Nippon Steel & Sumikin Materials Co., Ltd. Patent applications |
Patent application number | Title | Published |
20150217277 | HIGH AL-CONTENT STEEL SHEET EXCELLENT IN WORKABILITY AND METHOD OF PRODUCTION OF SAME - The present invention provides a high Al-content steel sheet having an excellent workability and a method of production of the same at a low cost by mass production, a high Al-content metal foil and a method of production of the same, and a metal substrate using a high Al-content metal foil, that is, a high Al-content steel sheet having an Al content of 6.5 mass % to 10 mass %, the high Al-content steel sheet characterized by having one or both of a {222} plane integration of an α-Fe crystal with respect to the surface of the steel sheet of 60% to 95% or a {200} plane integration of 0.01% to 15% and a method of production of the same, a high Al-content metal foil and a method of production of the same, and a metal substrate using a high Al-content metal foil. | 08-06-2015 |
20140166337 | INSULATING FILM-COATED METAL FOIL - An insulating film-coated metal foil having on one or both surfaces thereof an organic-inorganic hybrid layer containing dimethylsiloxane and a metalloxane comprising a metal other than Si. Relative to the concentration [Si] | 06-19-2014 |
20140080394 | BEVELING GRINDSTONE - Provided is a beveling grindstone in which diamond abrasive grains etc. are prevented from falling off even after long-term grinding to allow long-term use of the grindstone and in which chipping that occurs during beveling of a hard and brittle material and the occurrence of cracking in the ground material are suppressed. The beveling grindstone is used to bevel the outer circumferential edge of a hard and brittle material and includes: a core having a groove portion formed on the outer circumferential surface thereof with which the outer circumferential edge of the hard and brittle material is brought into contact; and an abrasive grain layer which is formed in the groove portion and to which abrasive grains are secured by brazing. The abrasive grains have an average grain diameter of #4000 to #270. | 03-20-2014 |
20140054766 | LEAD-FREE SOLDER BUMP BONDING STRUCTURE - According to a lead-free solder bump bonding structure, by causing the interface (IMC interface) of the intermetallic compound layer at a lead-free-solder-bump side to have scallop shapes of equal to or less than 0.02 [portions/μm] without forming in advance an Ni layer as a barrier layer on the surfaces of respective Cu electrodes of first and second electronic components like conventional technologies, a Cu diffusion can be inhibited, thereby inhibiting an occurrence of an electromigration. Hence, the burden at the time of manufacturing can be reduced by what corresponds to an omission of the formation process of the Ni layer as a barrier layer on the Cu electrode surfaces, and thus a lead-free solder bump bonding structure can be provided which reduces a burden at the time of manufacturing in comparison with conventional technologies and which can inhibit an occurrence of an electromigration. | 02-27-2014 |
20130306352 | BONDING WIRE FOR SEMICONDUCTOR - There is provided a bonding wire for semiconductor, capable of ensuring a favorable wedge bondability even when bonded to a palladium-plated lead frame, superior in oxidation resistivity and having a core wire of copper or a copper alloy. This bonding wire comprises: a core wire of copper or a copper alloy; a coating layer containing palladium and having a thickness of 10 to 200 nm; and an alloy layer formed on a surface of the coating layer, such alloy layer containing a noble metal and palladium and having a thickness of 1 to 80 nm. The aforementioned noble metal is either silver or metal, and a concentration of such noble metal in the alloy layer is not less than 10% and not more than 75% by volume. | 11-21-2013 |
20130180757 | BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE - A bonding structure of a ball-bonded portion is obtained by bonding a ball portion formed on a front end of a multilayer copper bonding wire. The multilayer copper bonding wire includes a core member that is mainly composed of copper, and an outer layer that is formed on the core member and is mainly composed of at least one noble metal selected from a group of Pd, Au, Ag and Pt. Further, a first concentrated portion of such noble metal(s) is formed in a ball-root region located at a boundary with the copper bonding wire in a surface region of the ball-bonded portion. | 07-18-2013 |
20130157060 | REINFORCING METHOD AND REINFORCING STRUCTURE FOR STEEL STRUCTURE AND ELASTIC LAYER FORMING MATERIAL FOR REINFORCING STEEL STRUCTURE - A reinforcing method and structure for a steel structure and an elastic layer forming material for reinforcing a steel structure are provided that can prevent a reinforcing effect from being lowered by direct sunlight, can obtain a sufficient reinforcing effect, and can prevent a fiber sheet from being peeled away from a steel structure surface before the fiber sheet is torn. The reinforcing method for a steel structure, in which a fiber sheet including reinforcing fibers is bonded to a surface of the steel structure to integrate the fiber sheet with the steel structure, includes (a) a step of applying and hardening a polyurea resin putty to the surface of the steel structure to form an elastic layer, and (b) a step of bonding the fiber sheet to the surface of the steel structure having the elastic layer formed thereon with an adhesive agent. | 06-20-2013 |