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Nihon Genma Mfg. Co., Ltd.
| Nihon Genma Mfg. Co., Ltd. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20090173770 | Lead-free solder alloy and electoronic component using this lead-free solder alloy - Wire burst faults at the time of solder attachment of conductors of an electronic component using insulation coated conductors having a core of copper or alloy containing alloy, is prevented. | 07-09-2009 |