| NIHON DEMPA KOGYO CO., LTD. Patent applications |
| Patent application number | Title | Published |
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| 20120133447 | SURFACE MOUNT TYPE CRYSTAL UNIT - An object of the invention is to provide a surface mount oscillator that can suppress a change with the lapse of time in frequency characteristics. A surface mount type crystal unit | 05-31-2012 |
| 20120112604 | ULTRASONIC PROBE AND MANUFACTURING METHOD THEREOF - A manufacturing method of an ultrasonic probe that has a signal foil made of a copper foil patterned by an additive method is provided. The manufacturing method includes preparing a base material and forming an insulating layer on a surface of the material, patterning the insulating layer by exposure, development, and peeling according to a lithographic technique, forming a cavity reaching an upper surface of the base material in the insulating layer along the patterning, forming a signal foil by performing plating in the cavity in the order of copper plating and solder plating, and demolding the formed signal foil from the cavity. | 05-10-2012 |
| 20120105110 | Signal level adjusting device and high-frequency apparatus - To provide, in a frequency synthesizer including: a variable attenuator provided at a subsequent stage of a voltage controlled oscillator; a detector; and a control unit outputting a control voltage for adjusting an attenuation amount of the variable attenuator via a digital/analog converter in accordance with a detection voltage, a technology with which a spurious due to a change in an output of the digital/analog converter can be suppressed. A low-pass filter is provided between an output side of a digital/analog converter and a variable attenuator to cut a frequency component corresponding to an overshoot generated when an output of the digital/analog converter is changed. Further, a period of time from when a control unit outputs a control voltage to when it reads a signal level detected by a detector is set to a period of time longer than a time constant of the low-pass filter determined by a cut-off frequency of the low-pass filter so that no influence is exerted on an operation of automatically controlling the signal level. | 05-03-2012 |
| 20120081187 | Oscillator - An oscillator outputs a sine wave with high purity capable of reducing phase noise. In a Colpitts oscillator circuit using a transistor as an amplifying part, a quartz-crystal resonator for waveform shaping is provided outside or inside an oscillation loop. A quartz-crystal resonator for oscillation and the quartz-crystal resonator for waveform shaping are formed, with an electrode pair and an electrode pair being provided on a common quartz-crystal piece. A separation distance between the electrode of the quartz-crystal resonator and the electrode of the quartz-crystal resonator is set large so that they are not elastically coupled, or even when they are elastically coupled, their coupling degree is weak, and an inductor causing parallel resonance with a parallel capacitance of the quartz-crystal resonator is provided. | 04-05-2012 |
| 20120074816 | Piezoelectric Device - The piezoelectric device ( | 03-29-2012 |
| 20120073376 | Ultrasonic probe - The shapes of reflecting parts in a hermetically sealed container are inclined to prevent generation of an unnecessary echo. In a short-axis oscillating ultrasonic probe, a piezoelectric element group arranged along a long-axis direction and having an acoustic lens on an ultrasonic wave transmitting/receiving surface, is provided on a rotary holding table housed in a hermetically sealed container. An ultrasonic wave transmitted and received to/from the ultrasonic wave transmitting/receiving surface of the piezoelectric element group is mechanically scanned in the short-axis direction of the piezoelectric element group by rotating and oscillating the rotary holding table in the short-axis direction, and a liquid serving as an acoustic medium is filled in the hermetically sealed container. The surface shapes of the reflecting parts in the hermetically sealed container are inclined so that, when an unnecessary ultrasonic wave travelling in the hermetically sealed container and exceeding a range of the acoustic lens after propagating in the long-axis direction or the short-axis direction between the surface of the acoustic lens and the inner periphery of the hermetically sealed container, is reflected on any of the reflecting parts, the unnecessary ultrasonic wave after being reflected does not return to between a surface of the acoustic lens and an inner periphery of the hermetically sealed container. | 03-29-2012 |
| 20120070850 | Method for detecting microorganisms and microorganism detecting apparatus - It is possible to determine the presence of bacteria in a sample solution in a shorter period of time without changing a conventional incubating method. Bacteria in a sample solution are incubated in, for example, a sterilized agar medium | 03-22-2012 |
| 20120068790 | Elastic wave device - There is provided an elastic wave device that is capable of suppressing deterioration in flatness of a frequency characteristic in a pass frequency band yet has excellent ESD resistance. At positions apart from a crossing area of electrode fingers | 03-22-2012 |
| 20120068579 | Method for Manufacturing a Piezoelectric Device and the Same - The present disclosure provides a method for manufacturing piezoelectric devices by using a base wafer having through-holes manufactured in precise size. In the method for manufacturing a piezoelectric device comprises: a step of: forming an anticorrosive film (S | 03-22-2012 |
| 20120068578 | Piezoelectric Device - A piezoelectric device ( | 03-22-2012 |
| 20120062336 | Duplexer - Disclosed is a receiving side filter in a pass band of a duplexer's transmitting side filter. Output balancing is performed by the receiving side filter, which includes a longitudinal mode resonator type filter. A pass band of the receiving side filter is set on a lower band side than the pass band of the transmitting side filter. Between an antenna port and a pair of balanced reception ports, first and second ladder-type filters are provided. The first includes a series arm and a parallel arm, each formed of a SAW resonator and a longitudinal mode resonator type filter. The second ladder-type filter has series arms, formed of SAW resonators respectively provided in signal paths that connect the respective balanced reception ports and the longitudinal mode resonator type filter, and a parallel arm formed of a SAW resonator and connecting between these signal paths. | 03-15-2012 |
| 20120056514 | Mesa-Type At-Cut Quartz-Crystal Vibrating Piece and Quartz-Crystal Device - To provide an AT-cut quartz-crystal vibrating piece in which size of the vibrating unit is adjusted to appropriate value, so that the unnecessary vibration is inhibited and degradation of its characteristics is prevented. A mesa-type AT-cut quartz-crystal vibrating piece for vibrating at 38.400 MHz comprising a rectangular excitation unit ( | 03-08-2012 |
| 20120043859 | Method of Manufacturing the Piezoelectric Device and the Same - To provide a piezoelectric device prevented from overflowing of sealing materials. The piezoelectric device ( | 02-23-2012 |
| 20120032563 | Mesa-Type At-Cut Quartz-Crystal Vibrating Piece and the Quartz-Crystal Device - The present disclosure provides a mesa-type AT-cut quartz-crystal vibrating piece, in which amount of the vibrating unit is adjusted to appropriate amount, in order to inhibit unnecessary vibration and to prevent degradation. The mesa-type AT-cut quartz-crystal vibrating piece ( | 02-09-2012 |
| 20120032562 | At-Cut Quartz-Crystal Device and Methods for Manufacturing Same - The present disclosure provides a manufacturing method of a quartz-crystal device, in which its lid and base is manufactured with smaller thermal expansion coefficient between AT-cut quartz-crystal wafer. The method for manufacturing a quartz-crystal device comprises the steps of: preparing an AT-cut quartz-crystal wafer ( | 02-09-2012 |
| 20120032561 | Piezoelectric Device With Tuning-Fork Type Piezoelectric Vibrating Piece - To provide the piezoelectric device and the manufacturing method thereof, in which the quartz-crystal side surface electrodes and the base side surface electrodes are ensured to be electrically connected without disconnection. The piezoelectric device ( | 02-09-2012 |
| 20120012428 | Brake mechanism, transport apparatus and industrial apparatus - A brake mechanism is constituted to have: an electromotive actuator which suppresses a rotation of a disk by moving a first pad toward a second pad to sandwich and press the disk between the first pad and the second pad; a pressing force setting section outputting a set signal to set a pressing force of the pad to the disk; a plurality of piezoelectric elements provided at different places from each other in the first pad or the second pad, the plurality of piezoelectric elements detecting a stress of the pad; a signal processing part which processes electric signals obtained from the plurality of piezoelectric elements and generates a detection signal of a pressing force, the detection signal corresponding to a pressing force of the pad to the disk; and a computing part which obtains a deviation between the set signal and the detection signal, computes an operation signal of the electromotive actuator based on the deviation, and then outputs the operation signal. | 01-19-2012 |
| 20110316522 | Sensing device - To provide a sensing device that holds a piezoelectric sensor and a channel forming member placed on the sensor in a closely contacted state while maintaining a shape of space of a passage space formed inside the device. In a sensing device | 12-29-2011 |
| 20110316391 | TUNING-FORK-TYPE PIEZOELECTRIC VIBRATING PLATE AND PIEZOELECTRIC DEVICE - A tuning-fork-type piezoelectric vibrating plate with a suppressed CI value and a piezoelectric device using thereof are provided. The tuning-fork-type piezoelectric vibrating plate includes: a base section formed by a piezoelectric material; and a pair of vibrating arms extended from the base section along a predetermined direction. On a front surface and a back surface of the vibrating arms, a first excitation groove is formed at the base section side, a second excitation groove is formed at a tip side of the vibrating arms, and a partition section is formed to separate the first excitation groove from the second excitation groove. A length from the base section side of the first excitation groove to the tip side of the second excitation groove in the predetermined direction is L | 12-29-2011 |
| 20110303347 | METHOD FOR MANUFACTURING SURFACE MOUNTING CRYSTAL RESONATOR - A method for manufacturing a surface mounting crystal resonator is provided, in which the bonding strength of low melting point glass is increased and the productivity is also increased. The surface mounting crystal resonator includes a set of container components having at least a crystal sheet | 12-15-2011 |
| 20110260586 | Piezoelectric Device with Tuning-fork type Piezoelectric Vibrating Piece - The piezoelectric device comprises a piezoelectric vibrating piece having a base portion, a pair of vibrating arms extending in a specified direction from the base portion, and a pair of connection portions disposed on the pair of the supporting arms; a package having a bottom surface which accommodates the piezoelectric vibrating piece and side faces surrounding the bottom surface, in which a pair of electrode pads corresponding to the connection portions are formed on the bottom surface; and adhesive for bonding the pair of the electrode pads with the pair of connection portions. One electrode pad and the other electrode pad, with adhesive applied to the electrode pads, are shifted with respect to each other in a predetermined direction. | 10-27-2011 |
| 20110241785 | Reference signal oscillator - A rubidium oscillator or a cesium oscillator is used as a high stability oscillator, and an OCXO being a metastable oscillator which is inferior in a long-term frequency stability compared with the above oscillators but has a high short-term frequency stability is used as a backup. There is prepared a table in which an elapsed time since an occurrence of an abnormality in the high stability oscillator and weighting (use ratio) of use of the both oscillators is corresponded, and by using this table, after the high stability oscillator recovers, an oscillation frequency of the metastable oscillator is used by 100% initially, but thereafter the weighting (use ratio) of use of the metastable oscillator is made smaller and the use ratio of the high stability oscillator is made larger in stages. | 10-06-2011 |
| 20110234325 | Voltage controlled temperature compensated crystal oscillator - The invention provides a multifunctional VC-TCXO that, as well as promoting miniaturization, selectively configures the functions as needed, and furthermore, is suitable for power savings. In a VC-TCXO provided with a chamber body that accommodates an IC chip and a crystal blank, the IC chip has; basic functions consisting of a first oscillator output function, and a temperature compensating function, and additional functions comprising of a second oscillator output function, an operation/non-operation function of the first oscillator output, and a temperature voltage output function, and basic IC terminals and additional IC terminals for these functions, and basic mounting terminals, and additional mounting terminals. Two of the additional IC terminals are two functions among the additional functions, which are selectively connected according to changes in a circuit pattern of a surface layer of the circuit formation surface, and the basic mounting terminals are provided on four corner portions of an outside bottom surface of the chamber body, and the two additional mounting terminals that are connected to the two additional IC terminals are provided on a central portion of a long side facing the outside bottom surface. | 09-29-2011 |
| 20110223620 | Method of detecting microorganisms and microorganism detecting apparatus - It is possible to determine the presence of bacteria in a sample solution in a shorter period of time without changing a conventional incubating method. Bacteria in a sample solution are incubated in, for example, a sterilized agar medium | 09-15-2011 |
| 20110221538 | Piezoelectric oscillator - To provide a technique capable of suppressing electric energy by a fundamental wave vibration and reducing phase noise in a piezoelectric oscillator using an overtone of a thickness shear vibration in a piezoelectric piece. An excitation electrode portion in an electrode | 09-15-2011 |
| 20110221490 | PLL apparatus - There is provided an art to prevent an unstable operation due to temperature in a PLL apparatus in which a proper range of an amplitude level of an external reference frequency signal is specified and a control voltage is supplied to a voltage-controlled oscillator according to whether the amplitude level falls within the proper range or not. The PLL apparatus includes: a switching unit switching a signal that is to be supplied to a control voltage output unit between a signal of a phase comparison unit and a preset signal of a preset signal output unit; a protection circuit provided between a signal path of a reference frequency signal and a ground and having diodes that are connected in inverse parallel in order to regulate an amplitude level of the reference frequency signal; a temperature detection unit detecting an atmospheric temperature of the protection circuit; and a level detection unit detecting the amplitude level of the external reference frequency signal, and threshold values as references for the switching are set according to the detected temperature, thereby coping with a change in the amplitude level due to a temperature characteristic of the diodes. | 09-15-2011 |
| 20110214265 | Piezoelectric component and manufacturing method thereof - An object of the present invention is to; miniaturize, increase the capacity, and reduce the price of piezoelectric components. The present invention relates to a piezoelectric component and a manufacturing method thereof, characterized in that: there are bonded and laminated at least two or more piezoelectric elements in which comb-teeth electrodes, wiring electrodes having element wirings that are arranged adjacent to the comb-teeth electrodes, and electrode terminals connected to the wiring electrodes, are formed on a principal surface of a plurality of piezoelectric substrates, while forming hollow sections between the respective piezoelectric elements; through electrodes are formed in the respective piezoelectric substrates so as to pass therethrough; the through electrodes are connected to the electrode terminals; and the piezoelectric substrates are sealed by a resin sealing layer. | 09-08-2011 |
| 20110210649 | CRYSTAL RESONATOR FOR SURFACE MOUNTING - The crystal resonator for surface mounting includes: a single-layer base substrate, including a pair of crystal holding terminals on a major face; a crystal piece, including an excitation electrode on two major faces, and electrically and mechanically connected to the crystal holding terminals; and a concave metal cover, including an opening end face bonded to an outer peripheral surface of the base substrate through curing of a liquid resin. The end face electrode is electrically connected through an electrically conducting path of the outer peripheral surface extended from the crystal holding terminals, and the crystal resonator for surface mounting is disposed as a structure that includes an end face region of two positions at least being opposite to the electrically conducting path in the opening end face of the metal cover spaced from a front end of a protruding portion through the protruding portion disposed on the opening end face. | 09-01-2011 |
| 20110204753 | PIEZOELECTRIC DEVICE AND MANUFACTURING METHOD THEREOF - A piezoelectric device and a manufacturing method thereof are provided. The piezoelectric device having a piezoelectric vibration sheet ( | 08-25-2011 |
| 20110193637 | Surface mounted oven controlled type crystal oscillator - The invention relates to an oven controlled crystal oscillator for surface mounting with reduced height (low profile). The oven controlled crystal oscillator for surface mounting comprises: a flat first substrate made of ceramic and on which are installed a crystal device and a heat resistor; and a second substrate made of a glass epoxy resin which is quadrangular in plan view and which faces the first substrate and has a larger external shape in plan view than the first substrate. The second substrate has an opening into whose center the crystal device is inserted, and has terminal sections on four locations corresponding to the surface outer periphery of the first substrate and the peripheral surfaces of the opening in the second substrate, and the terminal sections of the first substrate and second substrate are connected by solder. A front end side head section of the crystal device inserted into the opening section of the second substrate is positioned inside the open surface of the opening section, and from terminal sections provided at four locations on the second substrate, conductive paths extend via the outside surface of the second substrate to external terminals formed on the outside bottom surface of the second substrate. | 08-11-2011 |
| 20110191995 | Method for manufacturing piezoeletric resonator - To provide a method for manufacturing a piezoelectric resonator which can conduct frequency matching with high reliability when performing rough adjustment of the frequency by adjusting the shape of a piezoelectric oscillating piece before forming an electrode film, and thereby it becomes possible to avoid reduction of the yield. Etching for forming the shape of a piezoelectric oscillating piece, and etching for forming grooves are conducted simultaneously, and after forming the grooves, the shape formation of the piezoelectric oscillating piece is started again from the same depth as the groove in a state of covering the groove with a metal film, and after the shape formation, matching of frequency is conducted by etching the side surface of the piezoelectric oscillating piece in succession. By composing such a structure, it is possible to conduct rough adjustment of frequency at a low etching rate so that the frequency matching can be performed with no due difficulty and with high accuracy. | 08-11-2011 |
| 20110180311 | SOLDER, ELECTRONIC PART, AND METHOD OF FABRICATING ELECTRONIC PART - A solder material with favorable mechanical properties and high corrosion resistance is provided. The solder material is not apt to be melted in a re-heating process after the soldering process is performed. The solder material includes first solder powder, Cu powder, and a flux. The first solder powder contains Cu, Si, Ti, and Sn. Here, Cu accounts for 7 wt %˜9 wt %, Si accounts for 0.001 wt %˜0.05 wt %, Ti accounts for 0.001 wt %˜0.05 wt %, and the rest is Sn. The Cu powder is coated by Ag. The flux is mixed with the first solder powder and the Cu powder. | 07-28-2011 |
| 20110169533 | FREQUENCY SYNTHESIZER - The provision of a technique capable of determining a state where PLL control does not operate normally instantly or in advance in a frequency synthesizer that frequency-divides, A/D converts, and quadranture-detects a frequency signal from a voltage controlled oscillating unit, and extracts a rotation vector rotating at a frequency difference between the frequency signal used for the detection and the A/D converted frequency signal, and integrates a difference between a frequency of the above rotation vector and a set frequency to set an integration result as a control voltage to the voltage controlled oscillating unit. | 07-14-2011 |
| 20110156823 | Piezoelectric oscillator - There is provided a temperature compensated piezoelectric oscillator which excels in frequency stability and has a good electronic noise characteristic, and with which a circuit can be structured simply. An auxiliary oscillator unit | 06-30-2011 |
| 20110156529 | Surface mounted crystal resonator - An object of the invention is to provide a surface mounted resonator that improves impact resistance by the shape of a mounting terminal provided on an outside bottom face of a stacked resonator. A surface mounted crystal resonator is provided with a plurality of mounting terminals electrically connected to a hermetically sealed crystal piece at both ends of an outside bottom face having a rectangular shape long in the lengthwise direction, the mounting terminals having the same external dimensions with a total dimension of the mounting terminals in a lengthwise direction of the outside bottom face being 70% or more [but less than 100%] of a dimension in the lengthwise direction of the outside bottom face. Respective facing sides of the mounting terminals facing each other in a central area of the outside bottom face are formed curved in a convex shape such that a curvature thereof decreases gradually. | 06-30-2011 |
| 20110149464 | Voltage controlled variable capacitor and voltage controlled oscillator - There is provided a voltage variable capacitor that can be formed on a semiconductor circuit, has a large variable ratio of capacitances and a high Q value, and achieves a highly linear relation of a control voltage and an oscillation frequency when the capacitor forms a VCO. The voltage variable capacitor is formed of a plurality of MOS capacitance elements (CM | 06-23-2011 |
| 20110148538 | Crystal device - An object is to provide a crystal device in which an influence due to an electroconductive adhesive is reduced, and vibration characteristics of a crystal piece are favourably maintained. A configuration is such that in a crystal device including: a container main body having a concavity, with a crystal retention terminal formed in a bottom face of the concavity, and with a mounting terminal that is electrically connected to the crystal retention terminal formed on an outer bottom face; a crystal piece accommodated in the concavity, with an excitation electrode formed on both main faces, and with a support electrode that is electrically connected to the excitation electrode using a connecting electrode, formed on both sides of one end portion, and with the support electrode bonded to the crystal retention terminal with an electroconductive adhesive; and a cover that is connected to an open end face of the container main body and hermetically seals the crystal piece, there is provided a jetty being a main face of the crystal piece, and that protrudes on a periphery of the support electrode, and the jetty is formed integral with the crystal piece. | 06-23-2011 |
| 20110140572 | Crystal device - An object is to provide a crystal device that uses a mesa-structure crystal piece in which frequency adjustment is possible. A configuration is such that in a crystal device having: a crystal piece having a thick portion and a thin portion, with an excitation electrode formed on both main faces of the thick portion, and a lead out electrode electrically connected to the excitation electrode, formed on an end portion; a container main body having a concavity for accommodating the crystal piece; and a cover that is connected to an open end face of the container main body and hermetically seals the crystal piece, a frequency adjustment metal film which is electrically isolated from the excitation electrode and made independent, is formed on the thin portion of the crystal piece. | 06-16-2011 |
| 20110102107 | FILTER, PORTABLE TERMINAL AND ELECTRONIC COMPONENT - An object is to obtain a steep and large attenuation amount in attenuation bands close to each other out of a band of a TV wave and to provide a filter in which the use number of inductors is reduced thereby to be able to contribute to downsizing of a device. Elastic wave resonators of a plurality of parallel arms for each forming plurality of attenuation band are connected to the same electric potential point in a signal path without aid of an inductor. Otherwise, a series circuit of a plurality of element parts generating series resonance is connected in a signal path as a parallel arm. Therefore, a large attenuation amount can be obtained in each of the plural attenuation bands, but a region equivalent to what is called a zero point exists between adjacent poles. However, there can be obtained a characteristic in which steep attenuations occur in both sides of the zero point even if the zero point exists. Sets of elastic wave resonators (sets of resonators) connected to the same potential points or parallel arms constituted by the series circuits are connected in a signal path in a plurality of stages, and an inductor for inverting a phase intervenes between the stages. | 05-05-2011 |
| 20110080228 | Voltage controlled oscillator - To provide a voltage controlled oscillator capable of being treated as a lumped constant circuit, having small size and capable of obtaining an oscillation frequency in a high frequency band. A resonance part | 04-07-2011 |
| 20110080226 | Voltage controlled oscillator and electronic component - To provide a voltage controlled oscillator having small size and capable of obtaining a low phase noise characteristic over a large span of adjustable range of frequency. A quartz crystal having a characteristic (dielectric loss tangent: tan δ) better than that of fluorocarbon resin, LTCC or the like conventionally used as a substrate of a resonance part | 04-07-2011 |
| 20110080223 | Voltage controlled oscillator - There is provided a voltage controlled oscillator that is compact and can be manufactured at low cost. The voltage controlled oscillator is structured to include: a resonance part including a variable capacitance element and an inductance element, the variable capacitance element having a capacitance that varies according to a control voltage for frequency control input from an external part, and a series resonant frequency of the resonance part being adjusted according to the capacitance; an amplifying part amplifying a frequency signal from the resonance part; and a feedback part including a capacitance element for feedback and feeding the frequency signal amplified by the amplifying part back to the resonance part to form an oscillation loop together with the amplifying part and the resonance part, wherein the amplifying part is provided in an integrated circuit chip, and the resonance part and the capacitance element for feedback are formed as circuit components separate from the integrated circuit chip. The circuit components are selected according to an oscillation frequency. | 04-07-2011 |
| 20110080222 | Voltage controlled oscillator - There is provided a voltage controlled oscillator using a Colpitts circuit capable of suppressing deterioration (decrease) in variable range (adjustable range) of an output frequency due to the influence of an inductance component on a conductive line, which connects a connection point between two capacitors of a feedback part and an emitter of a transistor. In a VCO using a Colpitts circuit, with respect to capacitors | 04-07-2011 |
| 20110074475 | Frequency synthesizer - There is provided a frequency synthesizer capable of improving phase noise. A sinusoidal signal with a frequency set by a frequency setting part is output as a digital signal from a set signal output part, and the digital signal is D/A-converted. A difference between a sinusoidal signal with a frequency corresponding to an output frequency of a voltage controlled oscillating part and a sinusoidal signal output from a D/A converting part is amplified by a differential amplifier, and an amplified signal is input via an A/D converting part to a means for extracting a phase difference between the aforesaid sinusoidal signals. A voltage corresponding to a signal being the result of integration of the phase difference is input as a control voltage to the voltage controlled oscillating part. Then, a gain of the differential amplifier is set larger than a maximum value of phase noise degradation of the A/D converting part, whereby the phase noise degradation of the A/D converting part is cancelled. | 03-31-2011 |
| 20110064614 | PIEZOELECTRIC RESONATOR AND SENSING SENSOR - Provided is a piezoelectric resonator having high frequency stability and a sensing sensor using the piezoelectric resonator. A piezoelectric resonator has a first oscillation area which is provided in a piezoelectric piece and from which a first oscillation frequency is taken out. A second oscillation area which is provided in an area different from the first oscillation area via an elastic boundary area and from which a second oscillation frequency is taken out. Excitation electrodes are provided on one surface side and another surface side of the oscillation areas across the piezoelectric piece, and a frequency difference between the first oscillation frequency and the second oscillation frequency is not less than 0.2% nor greater than 2.2% of these oscillation frequencies. | 03-17-2011 |
| 20110063040 | Method of manufacturing piezoelectric resonator, piezoelectric resonator, and electronic component - To provide a piezoelectric resonator in which a casing houses a tuning-fork piezoelectric resonator element and whose failure occurrence caused when shavings of adjustment films scatter and adhere to excitation electrodes is prevented. In a method of manufacturing a quartz-crystal resonator in which a casing | 03-17-2011 |
| 20110049093 | Stacked crystal resonator and manufacturing method thereof - An object of the invention is to provide a method of manufacturing a stacked crystal resonator whereby a large number of stacked crystal resonators formed on a wafer can be easily broken away from the wafer, and the risk of damage to the outside surfaces and the like of the stacked crystal resonators is reduced. There is formed a framed crystal plate connected to a first wafer by a first support section, a cover connected to a second wafer by a second support section, and a base connected to a third wafer by a third support section, and a thickness of at least one of the first support section through third support section is thinner than a thickness the connected wafer. | 03-03-2011 |
| 20110043078 | Piezoelectric component and manufacturing method thereof - A piezoelectric component that has a superior level of molding pressure resistance while reducing the height and size thereof, is manufactured at low cost by using a photosensitive resin film to which is added a nano filler or a mica filler. The invention relates to a piezoelectric component and a manufacturing method of a piezoelectric component comprising: a piezoelectric substrate; a comb electrode formed on a main surface of the piezoelectric substrate; a piezoelectric device composed of wiring electrodes having device wiring sections disposed adjacent to the comb electrode; an insulation layer formed on an upper surface of the device wiring sections; a rewiring layer formed on an upper surface of the insulation layer; a protective film layer that is composed of an inorganic material and that covers the entire upper surface of the rewiring layer excluding the comb electrode; an outer periphery wall section formed by laminating a photosensitive resin film to which is added a nano filler onto the protective film layer; a ceiling section formed by laminating the photosensitive resin film to which is added a nano filler or a mica filler onto top openings of the outer periphery wall section; and electrode posts formed so as to pass through the outer periphery wall section and the ceiling section. Here the photosensitive resin film to which is added a nano filler is composed of a photosensitive resin to which is added an inorganic nano filler with a mean particle size of 1.0 nm or less, and has an elastic modulus of 3.0 GPa or greater. | 02-24-2011 |
| 20110032051 | DUPLEXER - Disclosed is a miniaturized duplexer having a good isolation characteristic. A duplexer having a high band side filter and a low band side filter that are each formed in a ladder-type filter provided on a common piezoelectric substrate is provided with a first elastic wave resonator to be included in one of these filters, a second elastic wave resonator to be included in the other of the filters, and a first additional grating reflector provided between these resonators to reflect an elastic wave leaked from a grating reflector of the first elastic wave resonator, and in which an additional grating reflector is not provided on a side opposite to the second elastic wave resonator in the first elastic wave resonator. | 02-10-2011 |
| 20110019296 | Optical filter - An object of the invention is to provide an optical filter that prevents an optical thin film formed on an optical plate from being partially removed, and prevents micro-cracks occurring in an outer peripheral edge section of a principle surface of the optical plate, and that has a high yield rate. An optical filter is provided with an optical plate which has a chamfered section formed on an outer peripheral edge section of one principle surface of the optical plate, and has isotropy with respect to wet-etching, and the chamfered section is of an arc shape which is cross-sectionally concave in an inward direction of the optical plate, and is formed by means of wet-etching. A crossing angle between the one principle surface and a concave surface where the chamfered section is formed, and a crossing angle between the concave surface and a side surface of the optical plate 3 where the chamfered section is formed, namely, crossing angles θG and θH are respectively 100° or greater and less than 180° . | 01-27-2011 |
| 20110001523 | FREQUENCY SYNTHESIZER - Provided is a frequency synthesizer capable of fine setting over a wide band and having a wide frequency pull-in range. A sine wave signal of an output frequency of a voltage controlled oscillating part is quadrature-detected, and in a PLL utilizing a vector rotating at a frequency (velocity) equal to a difference from a frequency of a frequency signal used for the detection, a frequency pull-in means integrates a first constant for increasing the output frequency as a pull-in voltage when a control voltage from the PLL to the voltage controlled oscillating part is larger than a prescribed set range, and integrates a second constant for decreasing the output frequency as the pull-in voltage when the control voltage is smaller than the set range. Then, an adding means adds the control voltage from the PLL and the pull-in voltage from the frequency pull-in means to output an addition result to the voltage controlled oscillating part. | 01-06-2011 |
| 20100329932 | Sensing device - To provide a sensing device that measures a substance to be sensed while letting a sample solution flow and has improved accuracy in detecting the substance to be sensed. The sensing device includes: a channel forming member | 12-30-2010 |
| 20100329928 | Sensing device - To provide a sensing device using a piezoelectric sensor having an oscillation area for detection and an oscillation area for reference and capable of achieving a high measurement sensitivity by improving shapes of excitation electrodes. On a quartz-crystal piece | 12-30-2010 |
| 20100327987 | Method of manufacturing crystal element and crystal resonator manufactured thereby - The present invention relates to a crystal element manufacturing method for manufacturing a plurality of crystal elements at a wafer level, and to a crystal resonator manufactured by this method. The method is comprised when the frequencies of the crystal elements are adjusted by adjusting the thickness of a crystal wafer that constitutes the crystal element in two stages by partial wet etching, the thicknesses of a large number of the step sections are coarse-adjusted in a first stage by collectively subjecting the step sections to partial wet etching, and then variations in the thicknesses of each group of a small number of the step sections are fine-adjusted in a second stage by collectively subjecting the step sections to partial wet etching. Alternatively, variations in the thicknesses of a small number of the step sections are coarse-adjusted and made uniform by means of partial wet etching, and then in a second stage, the thicknesses of a group of a plurality of the step sections having equal thicknesses are fine-adjusted by collectively subjecting the step sections to partial wet etching. Step sections having different areas are respectively formed on both of the front and back surfaces of a crystal wafer; at a crystal wafer level, these step sections are first collectively subjected to partial wet etching and thereby coarse-adjusted; then the thickness of each of the step sections is individually fine-adjusted by means of partial wet etching; and thereby the tact (the amount of operation time) required in partial wet etching is reduced. | 12-30-2010 |
| 20100327706 | Stacked crystal resonator - An object of the present invention is to provide a crystal resonator capable of maintaining its resonating characteristic and ensuring electrical connections between end surface electrodes using a simple method. Provided is a stacked crystal resonator including: a framed crystal plate, a frame section of which surrounds a resonating section, and to which both of these resonating section and frame section are connected by connecting sections; a first metallic film and second metallic film formed on both of the principle surfaces of the frame section of the framed crystal plate; and a base and cover stacked on both of the principle surfaces of the framed crystal plate. A crystal plate end surface electrode, which is electrically connected to the first metallic film, is electrically connected to a crystal plate auxiliary electrode; the crystal plate auxiliary electrode is electrically connected by a eutectic alloy while facing a base auxiliary electrode; the width of the frame section of one side on one end side of the framed crystal plate where the crystal plate auxiliary electrode is formed, differs from the width of the frame section of at least one other side; and a blocking film which blocks flow of the eutectic alloy to exciting electrodes, is provided on the conducting paths. | 12-30-2010 |
| 20100321068 | Frequency Synthesizer - An object of the present invention provides a frequency synthesizer having a broad frequency entraining range which can finely set a frequency over a broad band by a novel principle. | 12-23-2010 |
| 20100319736 | Sensing device - To provide a sensing device having a high processing power and capable of high-accuracy measurement. It is determined whether or not an oscillation frequency is stabilized while a buffer solution is supplied to a quartz-crystal resonator | 12-23-2010 |
| 20100319438 | Sensing device - To provide a sensing device capable of easily sensing a substance to be sensed with high accuracy. When sensing, by supplying a sample solution to an absorption layer | 12-23-2010 |
| 20100314355 | Ultrasonic probe - There is provided a crystal resonator (crystal element) in which the probability of chipping occurring in separation is small when there is one supporting section with respect to a frame section of a crystal wafer, and inclined surfaces due to the anisotropy of etching are eliminated. The present invention relates to a crystal resonator manufacturing method such that an AT-cut crystal wafer is etched, a large number of rectangular crystal elements are joined with frame sections by supporting sections, and the crystal elements are mechanically cut away from the frame sections. On both sides of the +X-axis one end section of the crystal element, at least the outer side surface has a planarly tapered projection having a triangular inclined surface with an apex in the −X-axis direction, and the tip end of the projection has processing traces of the etching in the +X-axis direction. | 12-16-2010 |
| 20100313636 | Sensing device and sensing method - To provide a sensing device and a sensing method that, by a simple method of liquid supply to first and second excitation electrodes, makes it possible to make a first oscillation area adsorb an adsorption substance that adsorbs a substance to be sensed in a sample solution and a blocking substance that prevents the adsorption of a substance and to make the electrode in a second oscillation area adsorb the blocking substance. By the supply of a solution containing the adsorption substance to a first liquid storage space | 12-16-2010 |
| 20100301708 | Piezoelectric component and manufacturing method therof - An object of the present invention is to manufacture, at a low cost, a piezoelectric component that has a superior level of molding pressure resistance and has its height reduced. The present invention relates to a piezoelectric component and a manufacturing method thereof comprising: a piezoelectric substrate; piezoelectric devices formed on a principle surface of the piezoelectric substrate; a device wiring section formed on the principle surface of the piezoelectric substrate; a protective film that has a terminal electrode connected to the wiring section and is formed on an upper surface of the wiring section; a rewiring layer that is formed on an upper surface of the protective film and that is connected to a wiring section of an electrode, which is different from the above electrode; a buffer layer that is composed of an inorganic material and that covers an entire upper surface of the rewiring layer excluding the piezoelectric devices; an outer periphery wall that is composed of a photosensitive resin film and is formed on an upper surface of the buffer layer; a first ceiling layer that is composed of a photosensitive resin film having a mica filler added thereto and is formed on an upper surface of the outer periphery wall; a mesh-shaped member that is composed of an insulating material and is installed on an upper surface of the first ceiling layer; a second ceiling layer that is composed of a photosensitive resin film having a mica filler added thereto and is formed so as to cover an upper surface of the mesh-shaped member; and through electrodes that are formed so as to pass through the first and second ceiling layers, the outer periphery wall, and the mesh-shaped member, thus between the outer periphery wall, the first ceiling layer, and the principle surface of the piezoelectric substrate, there is formed a hollow section that accommodates the piezoelectric devices. | 12-02-2010 |
| 20100292935 | Sensing Sensor and Concentration Measuring Device - An object of the present invention is to enable a user, when measuring a sensing target substance in fluid using a crystal sensor (sensing sensor) using a crystal vibrator whose natural frequency is varied by an absorption of the sensing target, to easily and accurately grasp information peculiar to the crystal sensor, for instance, information regarding a quality thereof. | 11-18-2010 |
| 20100290206 | CRYSTAL OSCILLATOR FOR SURFACE MOUNTING - A crystal oscillator for surface mounting comprising: a case main body including concave portions on both principal surfaces; a crystal element hermetically encapsulated in one concave portion; an IC chip housed in the other concave portion; mounting terminals provided on four corner portions of an opening end face of the other concave portion; and a protrusion serving as identifying marks along a direction of sides of the case main body and provided in some of the mounting terminals. The mounting terminals, to which the protrusions are provided, are provided on both corner portions on one end side of the case main body. The protrusions extend in a same direction from the mounting terminals at an inner or outer circumference side of the opening end face. The mounting terminals including the protrusions are symmetric with respect to a center line between both corner portions on the one end side. | 11-18-2010 |
| 20100289589 | Temperature controlled crystal oscillator - The present invention provides a temperature controlled oscillator capable of detecting the surrounding temperature at a high level of precision, and obtaining stable oscillating frequencies. The temperature controlled oscillator of the invention is provided with a circuit substrate having a crystal resonator, an oscillating circuit, and a temperature control circuit, arranged on one or both principal surfaces, and a container main body that accommodates the circuit substrate and has mount terminals on an outer bottom surface thereof. The temperature control circuit includes at least a first temperature sensor that detects an operating temperature of the crystal resonator, a second temperature sensor that detects a surrounding temperature of the container main body, and a heating resistor that applies heat to the crystal resonator, and lead wires extend from the circuit substrate and are connected electrically to the mount terminals. An insulation groove that passes through the circuit substrate in a thickness direction is formed between: a first lead wire closest to the second temperature sensor, and the second temperature sensor; and the heating resistor. | 11-18-2010 |
| 20100266451 | Sensing device - To shorten the time required for an oscillation frequency to stabilize in a sensing device sensing a substance to be sensed by using the fact that a natural frequency of a piezoelectric resonator changes when the substance to be sensed is adsorbed by an adsorption layer formed on the piezoelectric resonator. A sensing device includes: an oscillator circuit | 10-21-2010 |
| 20100263437 | Quartz sensor and sensing device - To provide a quartz sensor capable of detecting a sensing target with high sensitivity also in measurement in a liquid phase in which a difference in Q values at the time of measurement in the liquid phase and in a vapor phase is small. In a quartz sensor | 10-21-2010 |
| 20100259425 | Digital signal processing device - There is provided a digital signal processing device capable of suppressing occurrence of an unnecessary frequency component (spurious) in performing a reduction processing of a bit number of a frequency signal made of a digital signal. A signal output section | 10-14-2010 |
| 20100259131 | CRYSTAL UNIT - A double rotation Y-cut crystal unit includes a crystal element, which is respectively rotated by an angle θ° and an angle φ° in a counterclockwise direction centering on an X axis and a Z axis of crystal axes (X, Y, Z), which principal surface is perpendicular to a Y″ axis of newly-generated rotated crystal axes (X′, Y″, Z′), and which is formed into a rectangular geometry longer in one direction, wherein a direction of the long side of the crystal element corresponds to an axial direction when the crystal element is rotated by an angle α° in the counterclockwise direction with the X′ axis serving as a central axis in a plane of X′-Z′ of the rotated crystal axes serving as the principal surface, and wherein the angle α° is set to (30-φ)°±45°. | 10-14-2010 |
| 20100231309 | CONSTANT-TEMPERATURE TYPE CRYSTAL OSCILLATOR - A constant-temperature type crystal oscillator includes: a surface-mount crystal unit, in which a crystal element is housed in a case main body to hermetically encapsulate the crystal element with a metal cover, and which includes a crystal terminal serving as a mounting terminal that is electrically connected to at least the crystal element on an outer bottom face of the case main body; a thermistor that detects an operational temperature of the surface-mount crystal unit; and a circuit substrate, on which elements forming an oscillator circuit and elements forming a temperature control circuit along with the thermistor are installed. The thermistor includes a first and second terminal electrode and a temperature detecting electrode that is electrically independent of the first and second terminal electrode. The temperature detecting electrode is electrically connected to the crystal terminal of the surface-mount crystal unit through a circuit pattern formed on the circuit substrate. | 09-16-2010 |
| 20100225418 | Low band side filter of duplexer, high band side filter of duplexer, and duplexer - To improve an isolation characteristic in a pass frequency band of a high band side filter | 09-09-2010 |
| 20100223999 | Elastic wave device and electronic component - To provide an elastic wave device that is small sized and in which a frequency fluctuation due to a change with time hardly occurs, and an electronic component using the above elastic wave device. A trapping energy mode portion | 09-09-2010 |
| 20100207709 | TUNING-FORK TYPE CRYSTAL RESONATOR AND METHOD OF FREQUENCY ADJUSTMENT THEREOF - The invention relates to a tuning-fork type crystal resonator in which the frequency adjustment accuracy is increased, and a frequency adjustment method thereof. In a tuning-fork type crystal resonator having a tuning-fork shaped piece of quartz crystal in which a pair of tuning fork arms extend from a tuning fork base, and a frequency adjustment method thereof, there is provided a first frequency adjustment step for adjusting an oscillation frequency by forming inclined surfaces spanning from outer peripheral surfaces surrounding the pair of tuning fork arms toward distal end surfaces, by using a femtosecond laser irradiated in a direction from the outer peripheral surfaces toward the distal end surfaces, or in a direction from the distal end surfaces toward the outer peripheral surfaces. | 08-19-2010 |
| 20100201453 | Crystal oscillator with pedestal - An object of the invention is to provide an oscillator with a pedestal that facilitates soldering operations and offers a high level of productivity. A surface mount crystal oscillator with a pedestal comprises a crystal oscillator with lead wires led out from a bottom surface of a metallic base thereof; and a pedestal having a substantially rectangular outer shape in plan view, has insertion holes through which the lead wires pass, and is attached to a bottom surface of the crystal oscillator, and has mount terminals to be electrically connected to the lead wires formed on a bottom surface thereof. The configuration is such that the insertion holes are provided in four corner sections of the pedestal, in the four corner sections of the bottom surface of the pedestal where the insertion holes are formed there is provided a recess with an open outer periphery, and the lead wire is connected to a terminal electrode formed inside the recess, using solder. | 08-12-2010 |
| 20100201229 | Tuning-Fork Type Piezoelectric Vibrating Piece, Piezoelectric Frame, Piezoelectric Device, and a Manufacturing Method of Tuning-Fork Type Piezoelectric Vibrating Piece and Piezoelectric Frame - A tuning-fork type crystal vibrating piece ( | 08-12-2010 |
| 20100194488 | Receiving side filter of duplexer and duplexer - To provide a receiving side filter of a duplexer and a duplexer capable of preventing a leakage of an electric field and a magnetic field to the outside. In a receiving side filter having a longitudinal mode resonator type filter including cross finger electrodes and reflectors respectively formed on a piezoelectric substrate and an unbalanced input signal path and balanced output ports respectively provided on an input side and on an output side of the longitudinal mode resonator type filter, and used on a receiving side of a duplexer, a shield electrode connected to a ground electrode side of the cross finger electrode is disposed to surround a periphery of the receiving side filter so that an electric field and a magnetic field leaked to the outside from the receiving side filter are short-circuited by the shield electrode. | 08-05-2010 |
| 20100192340 | Method of manufacturing quartz-crystal resonator - To provide a method of manufacturing a quartz-crystal resonator, in which without adding new processes, a desired quartz-crystal piece can be obtained from a quartz-crystal wafer by etching and electrodes can be provided without restraint. When a quartz-crystal piece | 08-05-2010 |
| 20100171390 | Elastic wave device and electronic component - To provide an elastic wave device that is small sized and in which a frequency fluctuation due to a change with time hardly occurs, and an electronic component using the above elastic wave device. A trapping energy mode portion | 07-08-2010 |
| 20100164635 | Oven controlled multistage crystal oscillator - An object of the invention is to provide an oven controlled crystal oscillator that prevents a reduction in characteristics due to temperature rise in the crystal vibrator and circuit elements other than the oscillating stage, and that increases energy efficiency of a heater element, to thereby facilitate temperature control. The oven controlled crystal oscillator of the invention is an oven controlled multistage crystal oscillator provided with: a crystal vibrator; circuit elements of an oscillating stage, a buffering stage, and a temperature control circuit; and first, second, and third circuit substrates, wherein the configuration is such that: on the first circuit substrate or the second circuit substrate, there are arranged the heater element and the circuit element of the oscillating stage thermally bonded to the heater element; on the third circuit substrate, there are arranged the circuit element of the buffering stage, and at least the circuit elements of the temperature control circuit excluding the heater element and the temperature sensor element; and the third circuit substrate is distanced in the vertical direction and thermally isolated, with a clearance, from the first and second circuit substrates. | 07-01-2010 |
| 20100164325 | Elastic wave device and electronic component - To provide an elastic wave device that is small sized and in which a frequency fluctuation due to a change with time hardly occurs, and an electronic component using the above elastic wave device. A trapping energy mode portion | 07-01-2010 |
| 20100156546 | Surface mount crystal oscillator - There is provided a surface mount oscillator of a junction type in which the size of an IC chip is increased while maintaining high performance thereof, and the outer dimension of the oscillator in plan view are small. In a surface mount crystal oscillator which: a surface of an IC chip opposite to one principal surface thereof on which IC terminals are formed, is fixed on a mount substrate; external terminals that are constituted by a pair of crystal terminals and dummy terminals, at least one of which serves as a ground terminal, and that are formed in four corner sections of an outer bottom surface of a surface mount vibrator, are electrically connected to the IC terminals provided in four corner sections of the one principal surface; and IC terminals provided in positions other than the four corner sections are connected to circuit terminals of the mount substrate by means of wire bonding, the configuration is such that the external terminals of the surface mount vibrator constituted by the crystal terminals and the dummy terminals are electrically joined by means of joining balls to the IC terminals formed in the four corner sections of the IC chip. | 06-24-2010 |
| 20100156237 | Tuning-Fork Type Piezoelectric Vibrating Piece and Piezoelectric Device - A tuning-fork type piezoelectric vibrating piece ( | 06-24-2010 |
| 20100147074 | Piezoelectric Frame, Piezoelectric Device and Manufacturing Method for Same - A piezoelectric frame ( | 06-17-2010 |
| 20100141100 | Method of manufacturing piezoelectric oscillating pieces, piezoelectric oscillating piece, and piezoelectric resonator - Wafer-level processing of making outer peripheral ends (beveled portions) of piezoelectric oscillating pieces thinner than center portion sides is made possible easily and at low cost. A metal film which is a mask of a piezoelectric substrate and a photoresist film which is a mask of the metal film and has a pattern with which connection support portions supporting piezoelectric oscillating pieces on the piezoelectric substrate are formed are stacked on the piezoelectric substrate in this order from the substrate side, and by etching with the photoresist film and the metal film used as masks, contours of the plural piezoelectric oscillating pieces are formed in the piezoelectric substrate. Then, from a direction of through spaces (side surfaces) formed by this etching, the metal film is etched with an etching solution without peeling off the photoresist film, whereby outer peripheral sides of the metal film are removed and surfaces of outer peripheral ends of the piezoelectric oscillating pieces are exposed, and the exposed surfaces are etched with an etching solution, whereby the piezoelectric oscillating pieces are processed so that outer peripheral ends thereof become thinner than inner peripheral sides. | 06-10-2010 |
| 20100136306 | Method of manufacturing optical component and optical component - To easily bond substrates even made of materials whose linear expansion coefficients are different from each other when manufacturing an optical component used by transmitting light through an inside thereof. | 06-03-2010 |
| 20100123522 | CONSTANT-TEMPERATURE TYPE CRYSTAL OSCILLATOR - A constant-temperature type crystal oscillator includes: a crystal unit including a case main body including a first power source terminal on an outer bottom surface thereof; a surface-mounted oscillator; a temperature control circuit including a heating resistor and a temperature sensor; and a circuit substrate including a second power source terminal. One ends of the heating resistor and the temperature sensor are electrically connected to the second power source terminal. The first power source terminal of the surface-mounted oscillator and the one ends of the heating resistor and the temperature sensor are electrically connected to the second power source terminal of the circuit substrate. The first power source terminal of the surface-mounted oscillator is directly and electrically connected to, at least, the one end of the temperature sensor via an electrically-conducting path. | 05-20-2010 |
| 20100117746 | Surface mount crystal oscillator - An object of the invention is to provide a surface mount type crystal oscillator in which a probe can be easily brought into contact with a crystal inspection terminal. The surface mount type crystal oscillator is such that a crystal piece and an IC chip are housed within a container main body having a bottom wall and frame wall formed with laminated ceramics, and a communication terminal is provided on an outer side surface of the container main body. The communication terminal is provided so as to span from the outer side surface of the bottom wall to the outer bottom surface of the outer wall, the communication terminal is made the crystal inspection terminal, and the crystal piece and the IC chip are arranged in parallel on the inner bottom surface within the container main body. | 05-13-2010 |
| 20100117745 | Surface mount type crystal oscillator - There is provided a configuration in which a lead-out electrode that extends out from an excitation electrode provided on a lower surface of a crystal piece facing an inner bottom surface of a container main body, is connected to a crystal terminal of an IC chip via a conducting path provided on the inner bottom surface of the container main body, and the conducting path is superimposed, in plan view, on the excitation electrode of the lower surface of the crystal piece, and the excitation electrode of the lower surface and the conducting path have the same electric potential, to thereby suppress the occurrence of stray capacity therebetween. As a result, stray capacity occurring in the conducting path that connects the excitation electrode and the IC terminal is made small, thereby preventing variations in oscillating frequency. | 05-13-2010 |
| 20100117490 | Method of manufacturing piezoelectric resonator, piezoelectric resonator, and electronic component - To provide a piezoelectric resonator in which a casing houses a tuning-fork piezoelectric resonator element and whose failure occurrence caused when shavings of adjustment films scatter and adhere to excitation electrodes is prevented. In a method of manufacturing a quartz-crystal resonator in which a casing | 05-13-2010 |
| 20100117489 | PACKAGE-TYPE PIEZOELECTRIC RESONATOR AND METHOD OF MANUFACTURING PACKAGE-TYPE PIEZOELECTRIC RESONATOR - It is an object of the present invention to provide a package-type piezoelectric resonator which can be packaged at a wafer stage and is suitable for mass production. | 05-13-2010 |
| 20100102901 | Elastic wave filter - To provide an elastic wave filter capable of obtaining steep attenuation at a high band side or a low band side in a pass band and having high selectivity. | 04-29-2010 |
| 20100102892 | CRYSTAL OSCILLATOR - A crystal oscillator includes a crystal unit and a voltage-variable capacitive element that is connected to the crystal unit in series, the crystal oscillator varying an oscillation frequency by applying a control voltage between terminals of the voltage-variable capacitive element and by varying a series equivalence capacitance at a side of the oscillator circuit when observed between terminals of the crystal unit. The crystal oscillator further includes a first resistor and a second resistor for dividing the control voltage. At least one of the first resistor and the second resistor is a temperature sensing resistor, the resistance of which changes depending on a temperature, so as to correct frequency temperature characteristics of the oscillation frequency. | 04-29-2010 |
| 20100095751 | SENSING DEVICE - An object of the present invention is to provide a sensing device capable of easily and collectively displaying, based on pieces of time-series data of frequencies of piezoelectric resonators obtained for each concentration of a substance to be absorbed in solutions, pieces of variation data of the frequencies for each concentration caused by an absorption of the substance to be absorbed, in a state of aligning absorption start points. | 04-22-2010 |
| 20100085125 | CONSTANT-TEMPERATURE TYPE CRYSTAL OSCILLATOR - A constant-temperature type crystal oscillator includes: a crystal unit; an oscillator output circuit; a temperature control circuit; and a circuit substrate, on which circuit elements are installed. A principal surface of the crystal unit is installed so as to face one side board plane of the circuit substrate with interposing a first heat conducting resin, and the heating resistors are installed to be thermally coupled to the crystal unit via a second heat conducting resin. The principal surface of the crystal unit adheres to the one side board plane of the circuit substrate with interposing the first heat conducting resin. The heating resistors are installed on the one side board plane of the circuit substrate so as to sandwich the lead wires including a portion between the pair of lead wires of the crystal unit, and the heating resistors surround an outer circumference of the crystal unit. | 04-08-2010 |
| 20100076316 | Ultrasonic probe - The ultrasonic probe comprises a group of piezoelectric elements including piezoelectric elements arrayed in a long-axis direction thereof; and a rotation mechanism that oscillates the piezoelectric elements to the left and right in a short-axis direction thereof about a center of the long-axis direction. The rotation mechanism has a first bevel gear of a circular-arc shape, a second bevel gear meshing with the first bevel gear and rotating in a horizontal direction, and a drive motor. An optical rotating plate, with the boundary region as a reference, is rotated by less than a predetermined angle, and the boundary region is detected by transmission or shielding of light by the light shielding portion and the light transmission portion, and thereby, based on the detected boundary region, a reference position with respect to an object to be detected of the piezoelectric element group is set. | 03-25-2010 |
| 20100073098 | Constant-temperature type crystal oscillator - A constant-temperature type crystal oscillator includes: a crystal unit including a case main body, in which two crystal terminals and two dummy terminals are provided on an outer bottom face thereof, and a crystal element housed in the case main body; an oscillator output circuit including an oscillating stage and a buffering stage; a temperature control circuit for keeping an operational temperature of the crystal unit; and a circuit substrate, on which circuit elements of the crystal unit, the oscillator output circuit and the temperature control circuit are installed. The temperature control circuit includes: heating chip resistors; a power transistor; and a temperature sensing element. The dummy terminals are connected to a circuit terminal for dummy on the circuit substrate. The circuit terminal for dummy is connected to an electrically-conducting path, to which one terminal of the heating chip resistors is electrically connected, on the circuit substrate. | 03-25-2010 |
| 20100066213 | METHOD OF MANUFACTURING QUARTZ RESONATOR ELEMENT, QUARTZ RESONATOR ELEMENT, QUARTZ RESONATOR, AND QUARTZ OSCILLATOR - To provide a method of manufacturing a quartz resonator element having a small CI value, a quartz resonator element manufactured by this method, a quartz resonator, and a quartz oscillator. | 03-18-2010 |
| 20100066210 | SURFACE-MOUNT TYPE CRYSTAL UNIT - In a crystal unit, a crystal blank is accommodated in a container body composed of a bottom wall layer and a frame wall layer, and a metal cover is bonded to the container body by a eutectic alloy. The crystal blank is held by a pair of crystal connecting terminals formed at a position to be an inner bottom surface of a container body on one end portion side of the container body. A grounding external terminal is arranged at one corner of the outer bottom surface of the container body at the other end portion side of the container body. To connect the metal cover to the grounding external terminal, a first conduction metal film electrically connected to the metal cover through an end face metal film on an inner side surface of the frame wall layer is formed on a lower surface of the frame wall layer, and a second conduction metal film electrically connected to the grounding external terminal through an end face metal film on a container body outer side surface is formed on an upper surface of the bottom wall layer, corresponding to the positions where the grounding external terminals are formed. | 03-18-2010 |
| 20100061893 | Sensing Device - An object of the present invention is to provide a sensing device capable of easily grasping whether or not a concentration of a sensing target is equal to or less than a standard value. | 03-11-2010 |
| 20100060367 | CRYSTAL OSCILLATOR FOR SURFACE MOUNTING - The crystal oscillator for surface mounting includes: a container body having first and second recesses on both principal surfaces thereof; a crystal blank hermetically encapsulated within the first recess; and an IC chip in which an oscillation circuit using the crystal blank is integrated, the IC chip being accommodated within the second recess. The IC chip is provided with a plurality of IC terminals including a pair of crystal terminals used for electrical connection with the crystal blank. A plurality of mounting electrodes to which the IC terminals are connected through flip-chip bonding are formed on a bottom surface of the second recess in correspondence with the IC terminals. A pair of mounting electrodes corresponding to the pair of crystal terminals are electrically connected to the crystal blank and also formed as a pair of dual-purpose electrodes having greater areas than the other mounting electrodes. | 03-11-2010 |
| 20100060108 | ELECTRONIC COMPONENT FOR SURFACE MOUNTING - An electronic component, which is surface-mounted on a wiring board by soldering, and in which the occurrence of cracks in the solder after surface-mounting is suppressed, may include: a member constituting at least part of a container and made of ceramic; and an external terminal provided on the outer surface of the member and used in surface-mounting the electronic component on the wiring board by solder. The film thickness of a layer constituting the external terminal is designed so that when the thermal expansion coefficient of the ceramic constituting the member is α | 03-11-2010 |
| 20100052802 | Constant-temperature type crystal oscillator - A constant-temperature type crystal oscillator includes: a crystal unit that is installed on one principal surface of a circuit substrate, and chip resistors, which function as heating elements, and which are installed on the other principal surface of the circuit substrate so as to face a principal surface of the crystal unit, the chip resistors heating up the crystal unit to keep an operational temperature of the crystal unit constant. A heating metal film facing the principal surface of the crystal unit is provided on the one principal surface of the circuit substrate. A heat conducting material is interposed between the principal surface of the crystal unit and the heating metal film to perform thermal coupling therebetween. The heating metal film is thermally coupled to electrode terminals of the chip resistors via a plurality of electrode through holes. | 03-04-2010 |
| 20100045145 | Piezoelectric component and manufacturing method thereof - An object of the present invention is to; miniaturize, increase the capacity, and reduce the price of piezoelectric components. The present invention relates to a piezoelectric component and a manufacturing method thereof, characterized in that: there are bonded and laminated at least two or more piezoelectric elements in which comb-teeth electrodes, wiring electrodes having element wirings that are arranged adjacent to the comb-teeth electrodes, and electrode terminals connected to the wiring electrodes, are formed on a principal surface of a plurality of piezoelectric substrates, while forming hollow sections between the respective piezoelectric elements; through electrodes are formed in the respective piezoelectric substrates so as to pass therethrough; the through electrodes are connected to the electrode terminals; and the piezoelectric substrates are sealed by a resin sealing layer. | 02-25-2010 |
| 20100021346 | SENSING INSTRUMENT - A sensing instrument includes: a reference sensor including a reference piezoelectric resonator not adsorbing a substance to be sensed; a reference oscillator circuit oscillating the reference piezoelectric resonator; a measuring unit receiving an oscillation output of a sensing oscillator circuit and an oscillation output of the reference oscillator circuit in a time-series manner to measure frequencies of the oscillation outputs of the oscillator circuits; and a data creator creating time-series data of a difference between a frequency in a sensing sensor and a frequency in the reference sensor, based on the frequencies of the oscillation outputs of the oscillator circuits obtained by the measuring unit. Therefore, a frequency changed due to a factor other than the adsorption of the substance to be sensed is cancelled. | 01-28-2010 |
| 20100019867 | Piezoelectric component and manufacturing method thereof - The invention relates to a piezoelectric component and a manufacturing method thereof, that includes: a first piezoelectric element composed of a piezoelectric substrate, comb-shaped electrodes formed on a principal surface of the piezoelectric substrate, and wiring electrodes having element wiring disposed adjacent to the comb-shaped electrodes; terminal electrodes formed on the piezoelectric substrate; and a plurality of second piezoelectric elements on the principal surfaces of which are formed solder electrodes which contact the terminal electrodes, and comb-shaped electrodes and wiring electrodes. The second piezoelectric elements are sealed by a resin seal layer composed of a photosensitive resin sheet such that a hollow section is formed between both principal surfaces with the principal surface of the first piezoelectric element and the principal surface of the second piezoelectric element opposed, and comprise through electrodes which penetrate the resin seal layer and contact the terminal electrodes at their top end section. Small size, high performance, and cost reduction for the piezoelectric component is realized by the present invention. | 01-28-2010 |
| 20100007435 | Duplexer - To provide a duplexer which is small in size and excellent in separation characteristic of transmission/reception signals. An antenna port is disposed on a center of a rearward side in a disposition area of a duplexer, a high band side filter and a low band side filter are respectively disposed on a left side and a right side of the antenna port, a parallel arm at a last stage in the low band side filter, a parallel arm at a last stage in the high band side filter, a first signal port and a second signal port seen from the antenna port are positioned on a forward side of the antenna port, a ground side of a parallel arm on a front stage side of the parallel arm at the last stage in the low band side filter and a ground side of a parallel arm on a front stage side of the parallel arm at the last stage in the high band side filter are mutually connected via a conductive path formed on a piezoelectric substrate at a rearward side of the antenna port, and the parallel arms connected by the conductive path are positioned on the rearward side of the parallel arms at the last stages. Accordingly, a separation characteristic at a high band side is improved. | 01-14-2010 |
| 20090322449 | Transversal type filter - To provide a transversal type filter having weighted finger electrodes of at least either of an input IDT and an output IDT provided on a piezoelectric substrate, in which a diffraction of elastic wave output from an end face of the weighted IDT electrode is suppressed, a band width is wide, and a high flatness and a high selectivity are realized. In at least either of an input IDT and an output IDT, an apodized region in which a weighting is performed by using an apodizing method with which an aperture of finger electrodes is continuously changed is formed on a center portion of the electrode with respect to a propagation direction of an elastic wave, and dog-leg regions in which a weighting is performed by using a dog-leg method with which the aperture is made into 1/n by floating electrodes to form n tracks are formed on both sides of the apodized region. Subsequently, finger electrodes in each track of the dog-leg region are further weighted by using the apodizing method. | 12-31-2009 |
| 20090318108 | Acoustic surface wave filter module and method of manufacturing the same - In order to reduce the parts required for matching of an SAW filter module, the SAW filter module | 12-24-2009 |
| 20090315430 | Piezoelectric component and manufacturing method thereof - An object of the invention is to miniaturize a piezoelectric component and reduce the manufacturing cost thereof. Therefore the invention comprises: a piezoelectric element composed of a piezoelectric substrate, comb-shaped electrodes formed on a principal surface of the piezoelectric substrate, and wiring electrodes having element wiring disposed adjacent to the comb-shaped electrodes; an outer wall section formed from photosensitive resin film with an opening section formed on a principal surface of the piezoelectric substrate; and a ceiling section formed from photosensitive resin film laminated onto a top end surface of the outer wall section. A hermetic hollow section C surrounding the comb-shaped electrodes is formed between the outer wall section and the ceiling section, and electrode posts disposed so as to pass through the outer wall section and the ceiling section and that electrically connect the wiring electrodes and terminal electrodes disposed on a rear surface of the ceiling section are formed, and on a principal surface of the piezoelectric substrate are sequentially formed; a SiO | 12-24-2009 |
| 20090299194 | Minor axis motion type ultrasonic probe - The invention relates to a minor axis motion type ultrasonic probe with high sensitivity that suppresses propagation loss. The minor axis motion type ultrasonic probe of the invention comprises: a piezoelectric element group in which a plurality of piezoelectric elements are arranged in a line in a major axis direction of the piezoelectric element group; an acoustic lens that is provided on an ultrasonic wave transmitting/receiving surface side of the piezoelectric element group and that has a predetermined curvature in a minor axis direction of the piezoelectric element group; and a sealed container that houses the piezoelectric element group with the acoustic lens provided thereon and that is filled with a liquid serving as an ultrasonic wave medium, and the piezoelectric element group is moved in the minor axis direction and ultrasonic waves are transmitted and received to and from a living body, wherein the configuration is such that the acoustic lens is a concave lens formed from a material that has less propagation loss than a silicone resin and that has a greater acoustic velocity than a living body, and a relationship between acoustic velocity c | 12-03-2009 |
| 20090291509 | Sensing method - To enable successive measurement of samples by using one piezoelectric sensor. An adsorption layer provided in a piezoelectric sensor is an adsorption layer in which protein and an immunoglobulin are stacked in this order from the bottom. The immunoglobulin has a property of separating from protein when coming into contact with an acid liquid, and therefore, when the immunoglobulin as the adsorption layer is brought into contact with the acid liquid after capturing a substance to be sensed, the immunoglobulin is separated from the protein. Then, the adsorption layer is again formed by the supply of a new immunoglobulin, which enables the successive measurement of samples. | 11-26-2009 |
| 20090261969 | VEHICLE STATE NOTIFYING SYSTEM, ITS CONSTITUENT DEVICE, AND NOTIFYING METHOD - A vehicle state notifying system for notifying the user of a vehicle state through a simple configuration at a low cost is proved. The notifying system includes a slave device which the user carries and a master device radio-communicatable with the slave device bidirectionally. Upon reception of send request data from the slave device, the master device generates notification data indicating the state of an automobile from the detection result of the state of the automobile detected by various sensors and sends the notification data to the slave device through weak radio. The master device synchronizes the transmission timing of the notification data with the reception operation interval of the slave device. | 10-22-2009 |
| 20090261915 | Crystal Device for Surface Mounting - There is provided a crystal device in which an area inside a ceramic case is made larger to increase the design freedom of a crystal unit (crystal element). | 10-22-2009 |
| 20090261913 | Crystal device for surface mounting - A crystal device for surface mounting, in which a metal cover is jointed to the metal ring by seam welding, satisfies relationships A | 10-22-2009 |
| 20090261912 | Crystal device for surface mounting - A surface-mounted device includes a ceramic case, which has a concave portion formed by a bottom wall layer, a frame wall intermediate layer and a frame wall upper layer, and which houses at least a crystal element inside the concave portion. The ceramic case includes: arc-formed notched parts at outer circumference four corners thereof; and mounting terminals, which are extended to notched parts in the bottom wall layer among the notched parts, on an outer bottom face thereof. A radius of curvature of the notched parts in the frame wall intermediate layer is made identical to or greater than a radius of curvature of the notched parts in the bottom wall layer, and a radius of curvature of the notched parts in the frame wall upper layer is less than the radii of curvature of the notched parts in the bottom wall layer and the frame wall intermediate layer. | 10-22-2009 |
| 20090252983 | Crystal unit - A crystal unit includes a unit base in which a metal flange is welded to an outer circumference of a base main body, a crystal element held by supporters on the unit base, and a metal cover that is jointed to the metal flange to cover and hermetically encapsulate the crystal element. The base main body is formed of ceramic. A first metal film, to which the metal flange is joined, is formed on a surface of the outer circumference of the base main body. At least two places of the main body, second metal films are formed on an inner bottom face of the main body, and third metal films are formed on an outer bottom face of the main body. The second metal films and the third metal films are electrically connected to one another through via holes. The supporters are joined to the second metal films. | 10-08-2009 |
| 20090209860 | Ultrasonic probe - In an ultrasonic probe of the present invention, a probe main body that comprises a flat shaped piezoelectric element group having a plurality of strip shaped piezoelectric elements arranged in a line in the major axis direction, which is the crosswise direction of the piezoelectric elements, is formed and housed within a container main body and sealed therein with a cover. The ultrasonic probe is characterized in that, in order to mechanically and linearly scan the probe main body in the minor axis direction, which is the lengthwise direction of the piezoelectric elements, the probe main body is linearly reciprocated and mechanically scanned in the minor axis direction, by an endless belt that is driven by a drive source via another endless belt linearly in the minor axis direction, while being guided by a pair of linear guides. As a result, sufficient movement stroke of the probe main body in the minor axis direction can be ensured, and by means of a movement mechanism comprising the endless belt, the probe main body can be reciprocated in the minor axis direction to the fullest extent between the inner walls of a sealed container. | 08-20-2009 |
| 20090207889 | SPREAD SPECTRUM COMMUNICATION METHOD ADN SYSTEM USING VERY WEAK POWER, AND HIGH FREQUENCY RADIO APPARATUS - Provided is a high frequency radio apparatus capable of correcting a frequency of a carrier of the own apparatus in accordance with a frequency of a reception carrier when performing spread spectrum communication using very weak power. A carrier demodulating part demodulates a spread code received from a communication counterpart radio apparatus by using default carrier data, and sends the demodulated spread code to a synchronization timing detecting part. When the synchronization timing detecting part detects the spread code from the carrier demodulated data, a carrier frequency deviation detecting part performs a frequency analysis of the spread code to detect a deviation amount of the carrier frequency. A carrier data generating part generates corrected carrier data based on the detected deviation amount. A DBPSK modulating part uses the corrected carrier data to perform data transmission to the communication counterpart radio apparatus. | 08-20-2009 |
| 20090206938 | SURFACE-MOUNT TYPE CRYSTAL OSCILLATOR - A surface-mount type crystal oscillator includes: a container body with a first recess and a second recess; a crystal blank including excitation electrodes on respective principal surfaces thereof and hermetically encapsulated in the first recess; and an IC chip which is accommodated in the second recess and into which at least an oscillation circuit using the crystal blank is integrated. The container body includes a bottom wall and a frame wall provided on the bottom wall. Two openings which make up the first and second recesses, respectively, are formed in juxtaposition in the frame wall. A pair of inspection terminals are provided in an area of a top surface of the frame wall which surrounds the second recess. The inspection terminals are electrically connected to the excitation electrodes of the crystal blank. | 08-20-2009 |
| 20090195323 | SURFACE-MOUNT TYPE CRYSTAL OSCILLATOR - A surface-mount type crystal oscillator includes: a container body including a base wall and a frame wall, the frame wall being arranged on one principal surface of the base wall as including an opening; a crystal blank hermetically encapsulated inside a recess of the container body, the recess being formed by the opening of the frame wall; and an IC chip in which an oscillation circuit that uses the crystal blank is integrated. A flat portion which is a part of the base wall protrudes outwardly from an outer circumference of the frame wall. The IC chip is fixed to the one principal surface of the base wall at the flat portion. A testing terminal which is electrically connected with the crystal blank is provided on the one principal surface of the base wall at the flat portion. | 08-06-2009 |
| 20090195126 | CRYSTAL UNIT - In a crystal unit, at least two places of an outer circumference of a quartz crystal blank, which are places that correspond to both ends of a stress sensitivity zero axis of the crystal blank, are supported by supporters and fixed to the supporters by conductive adhesives. Each supporter includes; a vertical portion with a surface extending vertically, a slit formed in the vertical portion as extending vertically and with both ends thereof being closed, and a tongue portion projecting from a lower end of the slit. Each conductive adhesive includes; a first portion formed between the tongue portion and a lower surface of the crystal blank, a second portion extending to an end face of the crystal blank from an outer surface of the supporter and through the slit, and a third portion formed between an inner surface of the supporter and an upper surface of the crystal blank. | 08-06-2009 |
| 20090189705 | Crystal oscillator for surface mounting - A crystal oscillator includes an oscillator circuit, a main body, a first switching circuit, a second switching circuit, and a voltage detecting circuit. The oscillator circuit includes an IC chip including an output circuit and a function circuit. The crystal element includes a first excitation electrode and a second excitation electrode. The main body houses the oscillator circuit and the crystal element and includes a power supply terminal, a ground terminal, an output terminal, and a function terminal. The output terminal is electrically connected to the output circuit and the first excitation electrode via the first switching circuit. The function terminal is electrically connected to the function circuit and the second excitation electrode via the second switching circuit. The first switching circuit and the second switching circuit are operated on the basis of a switching signal from the voltage detecting circuit connected to the power supply terminal. | 07-30-2009 |
| 20090167448 | SURFACE-MOUNT TYPE CRYSTAL OSCILLATOR - A surface-mount type crystal oscillator comprises: a crystal blank; an IC chip on which at least an oscillation circuit using the crystal blank is integrated; a container that accommodates the crystal blank and the IC chip; a pair of inspection terminals provided on an outer surface of the container and electrically connected to the crystal blank, and used for inspecting characteristics of the crystal blank; a communication terminal provided on the outer surface of the container; and first switching means for switchably and electrically connecting and disconnecting the inspection terminals to and from the crystal blank in accordance with a selecting signal supplied from the communication terminal. | 07-02-2009 |
| 20090167382 | PLL Apparatus - It is an object of the present invention to provide a PLL apparatus realizing extremely high frequency stability. | 07-02-2009 |
| 20090167367 | Frequency Synthesizer - An object of the present invention provides a frequency synthesizer having a broad frequency entraining range which can finely set a frequency over a broad band by a novel principle. | 07-02-2009 |
| 20090167116 | METAL BASE FOR CRYSTAL UNIT AND CRYSTAL UNIT USING THE SAME - The metal base for a crystal unit includes: a base body in which at least a pair of through-holes are formed; a pair of leads provided with a supporter for supporting a crystal blank at the head thereof; and glass charged into the respective through-holes to electrically insulate the leads from the base body and hermetically seal the through-holes. A step is formed in a region of the lead corresponding to the outer bottom surface of the base body, the lead is made up of at least a first lead portion on the through-hole side from the step and a second lead portion in a direction in which the lead extends out from the step. The diameter of the lead of the second lead portion is smaller than the diameter of the lead of the first lead portion. | 07-02-2009 |
| 20090160563 | SURFACE-MOUNT TYPE CRYSTAL OSCILLATOR - A surface-mount type crystal oscillator includes a container body with a recess, a first holding terminal and a second holding terminal provided in the recess, a crystal blank secured to the first and second holding terminals, and an IC chip including a first terminal and a second terminal on respective opposite sides of one end of the IC chip, the first and second terminals being used to electrically connect the amplification element within the IC chip to the crystal blank. In the recess, the first connection terminal is connected, by wire bonding, to one of a first circuit terminal connected to the first holding terminal and a second circuit terminal connected to the second holding terminal. The second connection terminal is connected, by wire bonding, to one of a third circuit terminal connected to the first holding terminal and a fourth circuit terminal connected to the second holding terminal. | 06-25-2009 |
| 20090160561 | SURFACE-MOUNT TYPE CRYSTAL OSCILLATOR - The surface-mount type crystal oscillator includes a container body made of laminated ceramics, having a flat bottom wall layer, a frame wall defining a recess and a step portion formed at an inner wall of the recess, a crystal blank fixed to the step portion, an IC chip fixed to an inner bottom surface of the recess and a pair of inspection terminals provided on outer side surfaces of the container body and used to measure a vibration characteristic of the crystal blank. The bottom wall layer is made up of a first layer making up an outer bottom surface of the container body and a second layer between the first layer and the frame wall, and the inspection terminals are formed so as to extend across an end face of the second layer and the outer side surface of the frame wall. | 06-25-2009 |
| 20090140613 | CRYSTAL UNIT FOR SURFACE MOUNTING - The crystal unit for surface mounting includes a container body having a recess, a pair of holding terminals formed on an inner bottom surface of the recess and a crystal blank provided with excitation electrodes on both principal surfaces thereof, having a first end and a second end with lead-out electrodes extending from the excitation electrodes toward both sides of the first end. Both sides of the first end are fixed to the holding terminals using a conductive adhesive. Pillow members protruding from the inner bottom surface are provided on the inner bottom surface of the recess at positions corresponding to corners on both sides of the second end. A bank having a height lower than a height of the pillow members is provided on the inner bottom surface of the recess at an intermediate position between the pair of pillow members. | 06-04-2009 |
| 20090102326 | QUARTZ CRYSTAL ELEMENT MADE OF DOUBLE-ROTATION Y-CUT QUARTZ CRYSTAL PLATE - A crystal element has a crystal blank which is cut from a crystal of quartz and has a principal plane orthogonal to a Y″-axis, where the Y- and Z-axes are rotated by an angle of α around the X-axis in the crystal to be designated as the Y′- and Z′-axes, and the X- and Y′-axes are rotated by an angle of β around the Z′-axis to be designated as the X′- and Y″-axes. The crystal blank has mutually orthogonal two null stress-sensitivity axes. In the crystal blank, the thickness of the center part at which two null stress-sensitivity axes intersect is increased, and a ridge line portion defining a quadrangular pyramid like shape from the center part toward the outer peripheral part is formed. The sectional thickness of the crystal blank along the base thereof is larger in the central region and becomes gradually smaller toward both ends. | 04-23-2009 |
| 20090102322 | QUARTZ CRYSTAL DEVICE FOR SURFACE MOUNTING - The quartz crystal device includes a container body having: a recess; a pair of holding terminals formed on an inner bottom surface of the recess; and a crystal blank, both principal surfaces of which are provided with excitation electrodes with lead-out electrodes extending from the pair of excitation electrodes toward both sides of one end of the crystal blank. Both sides of one end of the crystal blank are fixed to the holding terminals using a conductive adhesive. Pillow members are provided on the inner bottom surface of the recess at positions corresponding to corners on both sides of the other end of the crystal blank, and the two pillow members are independent of each other. Alternatively, each holding terminal includes a first region formed near the facing holding terminal and a second region having a greater thickness than the first region formed far from the facing holding terminal. | 04-23-2009 |
| 20090102315 | QUARTZ CRYSTAL DEVICE - A quartz crystal device includes: a container; a crystal blank hermetically encapsulated in the container; and at least two outside terminals provided on an outer bottom surface of the container and used to surface-mount the quartz crystal device on a wiring board. Each outside terminal has a two-layer structure with a first layer provided on the outer bottom surface and a second layer provided on the first layer and having a flat surface. The second layer has a smaller plane shape than the first layer and is formed on a central part of the first layer at a distance from the perimeter of the first layer. | 04-23-2009 |
| 20090066426 | QUARTZ CRYSTAL DEVICE INCLUDING MONITOR ELECTRODE - A quartz crystal device includes: a crystal unit in which a crystal blank is hermetically encapsulated; and a mounting substrate housing an IC chip on which a circuit using the crystal blank is integrated. By joining an external terminal of the crystal unit and a bonding terminal of the mounting substrate, the mounting substrate is joined to the crystal unit to be integrated, and the quartz crystal device is configured. In the quartz crystal device, a crystal monitor terminal electrically connected to the bonding terminal is provided on an outer side surface of the mounting substrate, and even in a state in which the crystal unit and the mounting terminal are integrated, a vibration characteristic of the crystal blank is measurable by using the crystal monitor terminal. | 03-12-2009 |
| 20090066190 | QUARTZ CRYSTAL DEVICE - A quartz crystal device includes: a quartz crystal blank having an outer perimeter part and a vibration region partially separated mechanically from the outer perimeter part by a cut-out groove; a first container joined to a first principal surface of the crystal blank by being joined to an entire perimeter of the perimeter part of the crystal blank via a brazing material layer in the first principal surface; and a second container joined to a second principal surface of the crystal blank by being joined to an entire perimeter of the outer perimeter part of the crystal blank via a brazing material layer in the second principal surface. The vibration region of the crystal blank is hermetically encapsulated in a space formed by the first container, the second container and the outer perimeter part of the crystal blank. | 03-12-2009 |
| 20090058544 | SURFACE-MOUNT CRYSTAL OSCILLATOR - A surface-mount crystal oscillator includes: a crystal blank; an IC chip in which at least an oscillation circuit using the crystal blank is integrated, a plurality of IC terminals are provided on one principal surface, and a plurality of mounting terminals for surface mounting are provided on the other principal surface; and a housing member joined to the one principal surface of the IC chip and formed into a recessed shape. The crystal blank is fixed to crystal connection terminals out of the IC terminals, and is hermetically encapsulated in a space formed by the IC chip and the housing member. At least a power supply terminal, an output terminal and a ground terminal out of the IC terminals are electrically connected to the mounting terminals by a through-electrode provided to penetrate through the IC chip. | 03-05-2009 |
| 20090055112 | Sensing apparatus - An object of the present invention is to provide a sensing instrument capable to detect a substance existing in a very small quantity, such as environmental pollutants, instantly with a high degree of precision. As a specific means for solving the problem, a frequency signal from a crystal oscillator is sampled using a frequency signal from a reference clock generating part, the sampling value is outputted in a digital signal, quadrature detection is conducted with the digital signal for a frequency signal corresponding to the output signal, the rotational vector rotating at a frequency corresponding to the difference between the frequency of the frequency signal and the frequency of a sinusoidal wave used for the quadrature detection is taken out, and the variation of the frequency is detected by detecting the velocity of the rotational vector based on the respective sampling values. In addition to that, the measurement range of the variation of frequency can be widened by multiplying the above-described rotational vector by the reversely rotational vector corresponding to the velocity of the rotational vector. | 02-26-2009 |
| 20090050678 | METHOD FOR MOUNTING ELECTRONIC PARTS - When a surface-mount electronic part, which includes at least two mounting electrodes on an external underside thereof, is bonded to circuit terminals on a wiring board using solder, a protrusion, which is thicker than the circuit terminal, is provided on a surface of the wiring board facing the outer bottom surface of the electronic part to have the clearance between the mounting electrode and the circuit terminal that is not smaller than a predetermined value, so that the thickness of the solder between the mounting electrode and the circuit terminal is maintained to be large. | 02-26-2009 |
| 20090049914 | Ultrasonic Probe - An ultrasonic probe is configured such that: a piezoelectric element group is housed within a sealed container so as to be rotated and oscillated left and right about a center line that equally divides a plate surface of the piezoelectric element group; and the sealed container is filled with a liquid that serves as an acoustic medium, and in the sealed container there are provided an inlet hole for the liquid as well as an exhaust hole, to the inlet hole there is connected a flexible tube that functions as a diaphragm, and on the flexible tube and the exhaust hole there are respectively provided sealing lids. As a result, there is provided an ultrasonic probe that prevents an occurrence of air bubbles in a liquid that serves as an ultrasonic wave medium, and that realizes excellent ultrasonic characteristics. | 02-26-2009 |
| 20090048521 | Short Axis Oscillating Ultrasonic Probe - A short axis oscillating ultrasonic probe is configured such that: a piezoelectric element group that is arranged in a long axis direction and that has an acoustic lens on an ultrasonic wave transmitting and receiving surface thereof is provided on a rotational retention base; the rotational retention base is housed within a sealed container so as to rotate and oscillate in a short axis direction of the piezoelectric element group; ultrasonic waves that are transmitted and received from the ultrasonic wave transmitting and receiving surface of the piezoelectric element group are mechanically scanned in the short axis direction; and a liquid that serves as an acoustic medium is filled within the sealed container; and has a means for absorbing unwanted ultrasonic waves that propagate in the long axis direction, between the ultrasonic wave transmitting/receiving surface and the inner circumferential surface of the sealed container, and as the means for absorbing unwanted ultrasonic waves, a projecting section is provided on both end sides of the acoustic lens positioned in the long axis direction. As a result, there is provided a short axis oscillating ultrasonic probe that reduces operation processes in manufacturing the probe while achieving reliable sealing as well as absorption of unwanted ultrasonic waves, and that reduces the weight of the probe while achieving an excellent level of operability during diagnosis. | 02-19-2009 |
| 20090021316 | SURFACE-MOUNT TYPE CRYSTAL OSCILLATOR - A surface-mount type crystal oscillator has: a container body having a bottom wall and a frame wall having an opening and provided on one principal surface of the bottom wall; a quartz crystal blank hermetically encapsulated in a recess of the container body, which is formed by the opening of the frame wall; and an IC chip on which an oscillating circuit using the crystal blank is integrated. A region which is a region on the one principal surface of the bottom wall and other than formation regions of the frame wall and the recess is made a flat part, and the IC chip is fixed to the one principal surface of the bottom wall by flip-chip bonding, in the flat part. A crystal inspection terminal electrically connected to the crystal blank is provided on a surface of the flat part. | 01-22-2009 |
| 20090021315 | SURFACE-MOUNT CRYSTAL OSCILLATOR - In a surface-mount crystal oscillator, an IC chip having an IC terminal at each of at least four corner portions is housed in a substantially rectangular recess. Circuit terminals to which the IC terminals are fixed via bumps are provided on an inner bottom surface of the recess, and external terminals electrically connected to the circuit terminals are provided at the four corner portions of an opening end surface surrounding the recess. In each of at least three vertices or corners on the inner bottom surface of the recess, an external terminal corresponding to the vertex is formed into an L-shape to be in contact with a longer side and a shorter side of an outer perimeter of the recess, and an exposed part in which the inner bottom surface is exposed is formed between the circuit terminal which is the closest to the vertex and its external terminal. | 01-22-2009 |
| 20090002099 | Elastic Wave Device - In an elastic wave device including an input side electrode and an output side electrode being a resonant single-phase unidirectional transducers (RSPUDT) provided with respective pairs of bus bars opposing to each other on a piezoelectric substrate and a number of excitation electrode fingers extending in a comb-teeth shape so as to respectively cross each other from the respective bus bars, the elastic waves are repeatedly reflected and amplified between the central part of the input side electrode and the central part of the output side electrode along the direction of extension of the respective bus bars by the excitation electrode fingers of the input side electrode and the output side excitation electrode, the elastic wave device includes a damper at least on either one of the input side bus bar or the output side bus bar in an area between the central part of the input side electrode in the direction of movement of the elastic waves and the central part of the output side electrode in the direction of movement of the elastic waves so that the energy leaked out into the bus bar is absorbed. | 01-01-2009 |
| 20090002095 | Antenna Branching Filter - In an antenna duplexer including a high band side filter, a low band side filter, and a phase shifter in a low pass configuration inserted between the high band side filter and an antenna port and taking phase matching of both filters, a resonance inductor resonating with a capacitor on the antenna port side is provided to obtain a attenuation characteristic in an optional band in an out-of-pass band of both filters by the resonance. For instance, the maximum attenuation is held at twice of the center frequency f | 01-01-2009 |
| 20090001849 | Piezoelectric component and manufacturing method thereof - A piezoelectric component with a piezoelectric element includes a piezoelectric substrate, at least one oscillating section formed on the piezoelectric substrate, and an element wiring section connected to the oscillating section. A side face side hollow section forming layer and a lid face side hollow section forming layer made of photosensitive resin surround the top face and side face of the oscillating section while forming a gap so as to provide a hollow section. | 01-01-2009 |
| 20080309418 | Bonding-type surface-mount crystal oscillator - A crystal oscillator has: a crystal unit having a container body in which a crystal blank is housed and hermetically sealed; and a mounting substrate that houses an IC chip having at least an integrated oscillating circuit that uses the crystal unit. External terminals are formed as protrusions at four corners of the outer bottom surface of the container body, and depressions corresponding to the external terminals are formed at four corners of the top surface of the mounting substrate. Bonding terminals are formed at the inner bottom surface of the depressions. The mounting substrate is electrically and mechanically bonded to the outer bottom surface of the crystal unit by fitting the external terminals into the depressions and bonding the external terminals to the corresponding bonding terminals by soldering. | 12-18-2008 |
| 20080308223 | Electronic component and manufacturing method thereof - It is possible to prevent defects arising when resin-sealing electronic components, caused by leakage defects, resin interfusion defects, or the like, and it is possible to easily resin-seal a number of electronic components all together. There is provided a method of manufacturing electronic components on which SAW chips are mounted by face down bonding on wiring electrodes formed on a main face of a collective substrate, comprising the steps of: placing a resin sheet on the main face of the collective substrate, on which the SAW chips have been mounted; accommodating the collective substrate, on which the SAW chips have been mounted, in a flexible and sealed bag, and then seal-closing the sealed bag; submerging the accommodating bag into a pressurized container filled with a liquid, and then sealing off the pressurized container; supplying a pressurizing fluid into the pressurized container, raising the pressure within the pressurized container, carrying out heat application to heat-cure the resin sheet, and thereby tightly adhering the resin sheet onto the main face side of the SAW chips and the collective substrate, on which the SAW chips have been mounted so as to resin-seal the collective substrate; taking out the sealed bag from the pressurized container; taking out the resin-sealed collective substrate, on which the SAW chips have been mounted, from the sealed bag; and cutting the resin-sealed collective substrate, which has been taken out, into individual pieces. | 12-18-2008 |
| 20080290956 | SURFACE-MOUNT TYPE CRYSTAL OSCILLATOR - A surface-mount type crystal oscillator includes a container body having a recess and made up of laminated ceramic, a crystal blank accommodated in the container body, and an IC chip made up of a semiconductor substrate in which at least an oscillation circuit using the crystal blank is formed. The IC chip is electrically and mechanically connected to an inner bottom surface of the recess so that a circuit formation surface thereof faces the inner bottom surface. The IC chip has a first electrode formed on a surface thereof which is opposite the inner bottom surface, and a second electrode is formed on a surface which is disposed in the recess, the first and second electrodes being connected together by wire bonding. Alternatively, an outer peripheral side surface of the IC chip is thermally coupled to an inner peripheral surface of the recess by a conductive adhesive. | 11-27-2008 |
| 20080203858 | Sc Cut Crystal Resonator - The outer shape of a quartz crystal blank is processed to have a predetermined shape, thereby providing an SC cut crystal resonator capable of reliably and reproducibly suppressing B mode resonance. In this SC cut crystal resonator, the surface of the quartz crystal orthogonal to the Y axis is rotated through 33° to 35° about the X axis and is then rotated from this rotated position through 22° to 24° about the Z axis, and a slender quartz crystal blank oblong in an X′ axis direction is cut from the rotated surface. The end surface of the quartz crystal blank orthogonal to the Z′ axis is tilted in a direction rotated through +7° to +13° or −7° to −13° about the X′ axis. | 08-28-2008 |
| 20080197755 | SURFACE-MOUNT TYPE CRYSTAL UNIT - A surface-mount type crystal unit includes a package body which is made of a laminated ceramic and has a bottom wall layer and a frame wall formed on the bottom wall layer, the frame wall layer having an opening. In the package body, a concavity is constructed of the opening. The crystal unit further includes a pair of crystal holding terminals formed on one end part of the inner bottom surface of a concavity which is a top face of the bottom wall layer; a crystal blank held in the concavity by fixing the both sides of the one end part of the crystal blank to the pair of crystal holding terminals; a thermistor; and a cover which closes the concavity. The thermistor is arranged in a hollow part arranged in the top face of the bottom wall layer in the concavity. | 08-21-2008 |
