| NICHEPAC TECHNOLOGY INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110278725 | STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTION JOINTS - An interconnection mechanism between plated through holes is disclosed, a first embodiment includes a first substrate having a first plated through hole; a second substrate having a second plated through hole; a metal core is configured in between the two plated through holes; the metal ball has a diameter larger than a diameter of the plated through holes; and melted solder binds the first plated through hole, metal core, and the second plated through hole. A second embodiment includes stacked substrate having a gold plated only on ring pads of the plated through holes; melted solder binds the two gold ring pads. | 11-17-2011 |
| 20100073021 | ELECTRICAL CONTACT PROBE - A contact probe assembly, for placement within a probe receptacle for performing tests on an electrical device, includes the following elements. The hollow barrel has two openings at two opposite ends thereof, wherein the hollow barrel is adapted to be axially disposed within the probe receptacle. The first plunger is slidably disposed within one of the two openings at one end of the hollow barrel. The second plunger is slidably disposed within the other of the two openings at the opposite end of the hollow barrel. The resilient member is disposed within the hollow barrel and interconnected between the first plunger and second plunger, wherein the first plunger, the resilient member and the second plunger are formed as single one unitary member and made of the same electrically-conductive material. | 03-25-2010 |
| 20100035444 | IC ADAPTER - An integrated circuit (IC) adapter is disclosed to be adaptive sandwiched in between a ball grid array (BGA) integrated circuit (IC) and a printed circuit board to electrically couple the ball grid array IC and the printed circuit board. The IC adapter has a plurality of through holes therein, a resilient element in each of the through hole; in combination with a binding element for binding the integrated circuit (IC) onto the IC adapter such that the ball grid array IC can be removed, manually and without using any maintenance tool, from the IC adapter. | 02-11-2010 |
| 20100027277 | LIGHT EMITTING DIODE PACKAGE - A substrate structure for light emitting diodes (LED) chips operation includes a heat spreader, chip holders arranged in the center of the heat spreader, transfer pads located near the chip holders for wire bonding interconnection between the LED chips, and a circuit layer having a gap dividing the circuit layer diagonally. The circuit layer includes a first insulation layer on top of the heat spreader, a metal trace layer on top of the first insulation layer, and a second insulation layer on top of the metal trace layer, wherein portions of the second insulation layer are removed at the opposite corners along the gap, and around the opening, and a conductive plating is plated on the second insulation layer around the opening. Furthermore, a spotlight cap is provided to focus the light emitted from the LED. A LED package includes the substrate structure and the spotlight cap is also provided. | 02-04-2010 |
| 20090206857 | SINGULATED BARE DIE TESTING FIXTURE - A flexible redistribution membrane and a piece of silicon rubber is used in a testing fixture for testing a singulated bare die. The silicon rubber is used as a cushion under the flexible redistribution membrane against the downward pressure from the bare die during testing so that the top pads of the flexible redistribution membrane can be electrically tight coupling to bottom pads of the bared die to be tested. | 08-20-2009 |
| 20090206481 | STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTION JOINTS - An interconnection mechanism between plated through holes is disclosed, a first embodiment includes a first substrate having a first plated through hole; a second substrate having a second plated through hole; a metal core is configured in between the two plated through holes; the metal ball has a diameter larger than a diameter of the plated through holes; and melted solder binds the first plated through hole, metal core, and the second plated through hole. A second embodiment includes stacked substrate having a gold plated only on ring pads of the plated through holes; melted solder binds the two gold ring pads. | 08-20-2009 |
