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NetShape Technologies, Inc

NetShape Technologies, Inc Patent applications
Patent application numberTitlePublished
20100190024SINTERED COPPER-BASED MATERIAL HAVING INCREASED GRAIN SIZE AND METHOD OF MAKING THE SAME - Disclosed are sintered copper-based materials and methods for forming the same having a larger grain size than materials formed through conventional methods. A metal powder having copper is compressed, pre-heated, and then sintered. Then, the density of the once sintered copper-based material is sized to increase density and subjected to a second sintering act. The sintered copper-based materials have a grain size of at least 50 μm.07-29-2010