| NEOMAX MATERIALS CO., LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120077056 | HIGH-TEMPERATURE BIMETAL - A high-temperature bimetal capable of being inhibited from considerably shifting from an original position when the temperature has fallen to an ordinary temperature is provided. This high-temperature bimetal (1) includes a high thermal expansion layer (2) made of austenitic stainless steel and a low thermal expansion layer (3) made of a thermosensitive magnetic metal having a Curie point and bonded to the high thermal expansion layer. The high-temperature bimetal is employed over both a high temperature range of not less than the Curie point and a low temperature range of less than the Curie point, while an upper limit of operating temperatures in the high temperature range of not less than the Curie point is at least 500° C. | 03-29-2012 |
| 20120058360 | CLAD PLATE - A clad plate includes an aluminum plate and a hard metal plate such as a copper plate, joined together at side end surfaces thereof, the clad plate being excellent in joint strength and flexural separation-resistant characteristics. A side end surface of an aluminum plate and a side end surface of a hard metal plate are jointed together via a nickel layer by pressure welding. A ridge and a groove formed in the side end surface of the aluminum plate are respectively engaged and joined, via the nickel layer, to a groove and a ridge formed in the side end surface of the hard metal plate, and an end portion of the nickel layer extends beyond the rear end portion of the side end surface of the aluminum plate and is jointed to the plate surface of the aluminum plate with the end portion exposed thereon. The average width W of the exposed portion of the nickel layer exposed on the plate surface is preferably in the range from about 0.2 mm to about 1.5 mm. | 03-08-2012 |
| 20120006884 | CLAD MATERIAL FOR WIRING CONNECTION AND WIRING CONNECTION MEMBER PROCESSED FROM THE CLAD MATERIAL - A clad material for a wiring connection has an electroconductive layer formed from either pure Cu or a Cu alloy having higher electroconductivity than pure Al, a surface layer formed from either pure Al or an Al alloy and layered on one surface of the electroconductive layer, and a solder layer formed by hot-dip solder plating on the other surface of the electroconductive layer. The wiring connection member has a first connection end provided with an electroconductive layer soldered to an electrode of a semiconductor element, and a second connection end provided with an electroconductive layer soldered to, for example, an external wiring device. The wiring connection member is processed from the clad material for a wiring connection. This wiring member prevents molten solder from depositing on a pressing and heating portion of a local heating apparatus while also possessing excellent solderability. | 01-12-2012 |
| 20110318484 | SILVER-COATED BALL AND METHOD FOR MANUFACTURING SAME - A silver-coated ball | 12-29-2011 |
| 20110156982 | SCREW FOR USE IN A RADIO WAVE RECEIVER, METHOD OF MAKING THE SCREW, AND RADIO WAVE RECEIVER USING THE SCREW - A screw for use in a radio wave receiver includes a metal screw body that includes a shank and a head, and an insulation resin layer formed on at least a back of the screw head. In the radio wave receiver, a back cover and a case are secured together firmly by a threaded engagement of a threaded part of the shank, on which no insulation resin layer is formed, with a screw hole formed in the case while the insulation resin layer is disposed therebetween. | 06-30-2011 |
| 20110048757 | HERMETIC SEALING CAP - A more thinnable hermetic sealing cap can be provided. This hermetic sealing cap ( | 03-03-2011 |
| 20100273025 | BRAZING METHOD AND BRAZED STRUCTURE - A brazing method which provides a braze joint having excellent corrosion resistance and a brazed structure including such a braze joint includes assembling a first member and a second member to be joined into a temporary assembly, the first member including a base plate made of a ferrous material and a diffusion suppressing layer laminated on the base plate and composed of a N—Cr alloy essentially including not less than about 15% and not greater than about 40% of Cr, the second member being disposed on the diffusion suppressing layer of the first member with intervention of a brazing material of a Cu—Ni alloy essentially including not less than about 10% and not greater than about 20% of Ni, and maintaining the temporary assembly at a temperature of not less than about 1,200° C. to fuse the brazing material and diffuse Ni atoms and Cr atoms into the fused brazing material from the diffusion suppressing layer to form the braze joint, causing the resulting brazing material of the braze joint to have an increased melting point due to the increase of the Ni and Cr contents of the braze joint to self-solidify the braze joint, and then cooling the resulting assembly. | 10-28-2010 |
| 20100212456 | METHOD OF MANUFACTURING COMPOSITE BALL FOR ELECTRONIC PARTS - Disclosed is a method of manufacturing a composite ball for electronic parts by preparing a core ball with spherical shape, forming a solder-plated layer encompassing the core ball to obtain a composite ball, and then conducting a smoothing work on the surface of the solder-plated layer, therein the smoothing work is preferably conducted by bringing a medium into contact with the surface of the solder-plated layer. | 08-26-2010 |
| 20100104887 | AIRTIGHTLY SEALING CAP, ELECTRONIC COMPONENT STORING PACKAGE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT STORING PACKAGE - Provided is an airtightly sealing cap, by which a use quantity of Au is reduced in a soldering material for sealing a miniaturized electronic component storing package. An airtightly sealing cap ( | 04-29-2010 |
| 20100055539 | FUEL CELL SEPARATOR AND METHOD FOR PRODUCING THE SAME - A separator for a fuel cell according to the present invention includes: a base | 03-04-2010 |
| 20090301749 | HERMETIC SEALING CAP, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, AND METHOD FOR PRODUCING HERMETIC SEALING CAP - A hermetic sealing cap can be provided which is capable of suppressing that a production process becomes complicated, and additionally of suppressing that a solder layer wetly spreads inward on a sealing surface. This hermetic sealing cap ( | 12-10-2009 |
| 20090286099 | SILVER-COATED BALL AND METHOD FOR MANUFACTURING SAME - A silver-coated ball | 11-19-2009 |
| 20090283573 | ELECTRODE WIRE MATERIAL AND SOLAR CELL HAVING CONNECTION LEAD WIRE FORMED OF THE WIRE MATERIAL - An electrode wire material that can be used in a solar cell is produced without using flattening rolls or endless belts and has excellent solderability. The electrode wire material includes a core material formed of a strip-like conductive material and a hot-dip solder plated layer formed on a surface of the core material. A recessed portion for storing molten solder is formed in the core material along the longitudinal direction and the hot-dip solder plated layer is filled in the recessed portion. The recessed portion for storing molten solder preferably has an opening width in the lateral direction of the core material of about 90% or more of the width of the core material. The core material is preferably formed of a clad material including an interlayer of a low thermal expansion Fe alloy and copper layers formed on both surfaces of the interlayer. | 11-19-2009 |
| 20090272577 | CLAD MATERIAL FOR WIRING CONNECTION AND WIRING CONNECTION MEMBER PROCESSED FROM THE CLAD MATERIAL - A clad material for a wiring connection has an electroconductive layer formed from either pure Cu or a Cu alloy having higher electroconductivity than pure Al, a surface layer formed from either pure Al or an Al alloy and layered on one surface of the electroconductive layer, and a solder layer formed by hot-dip solder plating on the other surface of the electroconductive layer. The wiring connection member has a first connection end provided with an electroconductive layer soldered to an electrode of a semiconductor element, and a second connection end provided with an electroconductive layer soldered to, for example, an external wiring device. The wiring connection member is processed from the clad material for a wiring connection. This wiring member prevents molten solder from depositing on a pressing and heating portion of a local heating apparatus while also possessing excellent solderability. | 11-05-2009 |
| 20090045506 | Cu-Mo SUBSTRATE AND METHOD FOR PRODUCING SAME - A Cu—Mo substrate | 02-19-2009 |
| 20090038823 | WIRING SUBSTRATE WITH LEAD PIN AND LEAD PIN - A wiring substrate with lead pins formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials is provided and in the lead pin, the end face side bonded as opposed to the electrode pad of a head part formed in one end of a shaft part is formed in a conic protrusion part and also a vertex angle of the conic protrusion part is set in an angle range of 110° to 140°, and the conductive material is interposed between the conic protrusion part and the electrode pad and also extends to a flat part of the head part and reaches an outer surface of the shaft part and the lead pin is bonded to the electrode pad. | 02-12-2009 |
| 20080271908 | Hermetic Sealing Cap, Method of Manufacturing Hermetic Sealing Cap and Electronic Component Storage Package - Cap for airtight sealing ( | 11-06-2008 |
