NEOBULB TECHNOLOGIES, INC. Patent applications |
Patent application number | Title | Published |
20140306230 | LED COMPONENT BY INTEGRATING EPITAXIAL STRUCTURE AND PACKAGE SUBSTRATE TOGETHER AND METHOD OF MANUFACTURING THE SAME - The present invention discloses an integral LED component which integrates LED epitaxial structures electrodes and interconnect with a package substrate together and an integral manufacturing process thereof. The integral LED component can be made with multiple epitaxial structures or with just a single epitaxial structure. The integral LED component can be mounted into a hollow carrier. And by having support by the hollow carrier, the package substrate can be mounted and contacted with a heat conductive or a dissipation device. The integral LED component is fabricated by wafer level process and cut from the wafer as an independent component. By different manufacturing process, the integral LED component can be made as Vertical LED structure or Lateral LED structure. | 10-16-2014 |
20130010479 | LED LIGHT SOURCE - The invention discloses a LED light source, comprising a control circuit module, a shell, an energy conversion component, a heat pipe, and a cooling component. The shell comprises a dome and a side wall, and the shell contains the control circuit module. The energy conversion component comprises a substrate, a substrate holder, and at least a LED, wherein the LED is disposed on the substrate, the substrate is connected to the substrate holder, and the substrate holder is coupled to the control circuit module to drive the energy conversion component. The heat pipe comprises a flat part, an extension part, and a contact part, wherein the substrate and the substrate holder of the energy conversion component are disposed on the flat part; the extension part, disposed inside the shell, extends toward a direction. The cooling component comprises a plurality of fins, wherein the fins contacts the contact part respectively. The control circuit module is disposed between the energy conversion component and the cooling component. | 01-10-2013 |
20120292658 | SEMICONDUCTOR OPTOELECTRONIC CONVERTING SYSTEM AND THE FABRICATING METHOD THEREOF - The present invention discloses a semiconductor optoelectronic converting system and the fabricating method thereof, the system comprises a supporting module, a heat pipe, a power converting module and a heat-dissipating plate module. The main features of the present invention are that the supporting module has an accommodating space for disposing the heat pipe, and wherein the supporting module and the heat pipe have a common surface for disposing the power converting module thereon. Furthermore, the present invention further decreases the heat resistant therebetween and improves the heat conducting rate and further capable of becoming a rechargeable self-sufficiency lighting system. | 11-22-2012 |
20110317423 | System in Package High Power Highly Efficient Diode Lamp - A system in package, high power, and highly efficient diode lamp is provided. The diode lamp includes a heat-conducting/heat-dissipating module, a LED light module, an optical module, and a control circuit module. The heat-conducting/heat-dissipating module includes a heat-conducting device and at least one heat-dissipating fin. The LED light module is disposed on a flat portion of the heat-conducting device. The optical module focuses the light emitted by the LED light module. The control circuit module is used to control the LED light module. When the diode lamp is electrically connected to a power supply, the control circuit module selectively controls the LED light module to emit the light. The heat generated during the operation of the LED light module is conducted from the flat portion of the heat-conducting device to the at least one heat-dissipating fin, and then it is dissipated by the at least one heat-dissipating fin. | 12-29-2011 |
20110291150 | LED ILLUMINATION DEVICE - The invention disclose a light emitting diode (LED) illustration device, comprising a platform, a substrate and a light emitting diode die. The said platform comprises an upper surface and a bottom surface. A first concave portion is formed on the upper surface of the platform, and a second concave portion is formed on the bottom surface of the platform. The first concave portion is connected with the second concave portion. The substrate is embedded in the second concave portion, wherein the said substrate comprises an electrostatic discharge protection structure. The said light emitting diode die is disposed on the said substrate. | 12-01-2011 |
20110255295 | OUTDOOR HIGH POWDER LIGHT-EMITTING DIODE ILLUMINATING EQUIPMENT - The invention provides a light-emitting diode illuminating equipment. The light-emitting diode illuminating equipment of the invention includes a heat-dissipating plate device, a plurality of heat-dissipating fins, a diode light-emitting apparatus, a plurality of heat-conducting devices, and a shield device. The heat-dissipating fins extend from a surface of the heat-dissipating plate device. By tightly mounting the heat-conducting devices on the surface of the heat-dissipating plate device and disposing between the heat-dissipating fins, heat generated during the operation of the diode light-emitting apparatus is distributed uniformly on the heat-dissipating plate device and the heat-dissipating fins due to the high efficiency heat-conducting of the heat-conducting devices, and then is dissipated. Besides, the shield device has a waterproof passage for a power cord passing through to power a control circuit, such that the light-emitting diode illuminating equipment is adapted to be installed outdoors. | 10-20-2011 |
20110228540 | SEMICONDUCTOR LIGHT-EMITTING APPARATUS INTEGRATED WITH HEAT-CONDUCTING/DISSIPATING MODULE - The invention relates to a light-emitting apparatus. The light-emitting apparatus includes a heat-conducting/dissipating module and at least one semiconductor light-emitting module. The heat-conducting/dissipating module includes a substantially cylindrical heat-conducting device having at least one flat portion and at least one heat-dissipating fin mounted on the circumference of the heat-conducting device. The at least one semiconductor light-emitting module includes a carrier, a plurality of exterior electrodes, at least one semiconductor light-emitting die, and at least two conducting wires. The carrier is flatly mounted on the flat portion of the heat-conducting device. The plurality of exterior electrodes is disposed on the carrier. The at least one semiconductor light-emitting die is mounted on the carrier and respectively connected to the plurality of exterior electrodes. The at least two conducting wires are connected to a power source or a grounding by being electrically connected to the plurality of exterior electrodes. | 09-22-2011 |
20110188249 | Light-Emitting Diode Illuminating Equipment with High Power and High Heat Dissipation Efficiency - The invention provides a LED illuminating equipment with high power and high heat-dissipating efficiency. The LED illuminating equipment of the invention includes a plurality of diode light-emitting apparatuses. Particularly, the heat generated by the diode light-emitting apparatuses in operation is conducted to a heat-dissipating plate device and the heat-dissipating fins. Besides, the heat is uniformly distributed over the heat-dissipating plate device and further dissipated by the heat-dissipating plate device and the heat-dissipating fins extending thereon. | 08-04-2011 |
20110157892 | ILLUMINATION DEVICE - The invention discloses an illumination device. A form factor of the illumination device comprises a shell and a plurality of LED platforms. The shell comprises a plurality of optical reflection components for reflecting light, each of the optical reflection components comprises a bottom surface. Each of the LED platforms, fixed on the bottom surface of one of the optical reflection components, comprises an energy converter, a heat-pipe and a heat-dissipating component. The energy converter, penetrating the bottom surface, comprises a plurality of first LEDs or second LEDs. The heat-pipe comprises a flat portion, an extension portion and a contact portion, wherein the flat portion contacts the energy converter, the extension portion has a bend and extends along a first direction, and the contact portion connects the bend and extends along a second direction. The heat-dissipating component has a plurality of fins, each of the fins contacts the contact portion. | 06-30-2011 |
20110110088 | System in Package High Power Highly Efficient Diode Lamp - A system in package, high power, and highly efficient diode lamp is provided. The diode lamp includes a heat-conducting/heat-dissipating module, a LED light module, an optical module, and a control circuit module. The heat-conducting/heat-dissipating module includes a heat-conducting device and at least one heat-dissipating fin. The LED light module is disposed on a flat portion of the heat-conducting device. The optical module focuses the light emitted by the LED light module. The control circuit module is used to control the LED light module. When the diode lamp is electrically connected to a power supply, the control circuit module selectively controls the LED light module to emit the light. The heat generated during the operation of the LED light module is conducted from the flat portion of the heat-conducting device to the at least one heat-dissipating fin, and then it is dissipated by the at least one heat-dissipating fin. | 05-12-2011 |
20110089519 | Chip Lead Frame and Photoelectric Energy Transducing Module - The invention discloses a chip lead frame and a photoelectric energy transducing module. The chip lead frame includes an insulator and a plurality of conductors. The insulator includes a first surface, a second surface, a first recess structure formed on the first surface, a through hole passing through the second surface and the first recess structure, and a venting structure. The first recess structure forms an accommodating space. The venting structure communicates with the accommodating space so that when a substrate is being bound to the first recess structure, the air in the accommodating space pressed by the substrate could flow through the venting structure out of the insulator without remaining between the substrate and the first recess structure. A photoelectric energy transducing semiconductor structure could be disposed on the substrate and electrically connected to the conductors, so as to form the photoelectric energy transducing module of the invention. | 04-21-2011 |
20110088752 | Photoelectric Energy Transducing Apparatus - The invention discloses a photoelectric energy transducing apparatus, which includes a photoelectric energy transducing module and a semiconductor switch. The photoelectric energy transducing module includes a photoelectric energy transducing semiconductor structure, a first positive electrode, and a negative electrode. The semiconductor switch includes a second positive electrode and a second negative electrode. The second positive electrode is electrically connected to the first negative electrode. The second negative electrode is electrically connected to the first positive electrode. When light radiates onto the photoelectric energy transducing semiconductor structure, an electromotive force is induced between the first positive electrode and the first negative electrode, and the electromotive force provides a reverse bias on the semiconductor switch so that the semiconductor switch is cut off. Thereby, when several photoelectric energy transducing apparatuses are used in series, the entire in-series circuit is still conductible even if one or some of the photoelectric energy transducing apparatuses are damaged. | 04-21-2011 |
20100271826 | Light-Emitting Diode Illuminating Equipment - The invention provides a light-emitting diode illuminating equipment, including N diode light-emitting apparatuses and N optical devices, wherein N is a natural number. Each of the optical devices includes a lens. Each of the optical devices corresponds to one of the diode light-emitting apparatus, for modulating a light pattern of the corresponding diode light-emitting apparatus. In an embodiment, the lens of each of the optical devices is a cat's-eye-like lens. The lens includes a surface, where a groove is formed along an ellipse minor axis of the lens, such that the light transmitted through the lens can form a light pattern for a specific request. | 10-28-2010 |
20100270565 | SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD OF FABRICATING THE SAME - The invention provides a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts, and N semiconductor light-emitting die modules, wherein N is a positive integer lager than or equal to 1. Each of the sub-mounts is embedded on the substrate and exposed partially. Each of the semiconductor light-emitting die modules is mounted on the exposed surface of one of the sub-mounts. | 10-28-2010 |
20100202145 | ILLUMINATING EQUIPMENT USING HIGH POWER LED WITH HIGH EFFICIENCY OF HEAT DISSIPATION - The invention provides a packaged system that is suitable for a LED package of high power. The packaged system further includes a heat-conducting device surrounded by at least one heat-dissipating fin to effectively dissipate the heat generated by the high power LED package. The packaged system with high efficiency of heat dissipation can be incorporated into various projecting illuminating equipments, such as a flashlight or floodlight, by simply installing the present invention into a housing and providing power connection thereto. | 08-12-2010 |
20100194282 | LIGHT-EMITTING DIODE CLUSTER LAMP - The invention relates to a light-emitting diode cluster lamp. The light-emitting diode cluster lamp includes a plurality of light-emitting diode lamp packages, a control circuit, and a casing. Each of the light-emitting diode lamp packages includes a heat-conducting/dissipating module and a light-emitting diode module. The control circuit module is used for controlling the light-emitting diode lamp packages. The casing is adapted to accommodate the light-emitting diode lamp packages and the control circuit module. When the light-emitting diode cluster lamp is connected to a power source, the control circuit module selectively makes the light-emitting diode modules emit light. The heat generated during the light emission of each of the light-emitting diode modules is conducted and dissipated by the corresponding heat-conducting/dissipating module of each of the light-emitting diode modules. | 08-05-2010 |
20100194273 | OUTDOOR HIGH POWDER LIGHT-EMITTING DIODE ILLUMINATING EQUIPMENT - The invention provides a light-emitting diode illuminating equipment. The light-emitting diode illuminating equipment of the invention includes a heat-dissipating plate device, a plurality of heat-dissipating fins, a diode light-emitting apparatus, a plurality of heat-conducting devices, and a shield device. The heat-dissipating fins extend from a surface of the heat-dissipating plate device. By tightly mounting the heat-conducting devices on the surface of the heat-dissipating plate device and disposing between the heat-dissipating fins, heat generated during the operation of the diode light-emitting apparatus is distributed uniformly on the heat-dissipating plate device and the heat-dissipating fins due to the high efficiency heat-conducting of the heat-conducting devices, and then is dissipated. Besides, the shield device has a waterproof passage for a power cord passing through to power a control circuit, such that the light-emitting diode illuminating equipment is adapted to be installed outdoors. | 08-05-2010 |
20100140791 | INTEGRATED CIRCUIT PACKAGING STRUCTURE AND METHOD OF MAKING THE SAME - The invention provides an integrated circuit packaging and method of making the same. The integrated circuit packaging includes a substrate, a semiconductor die, a heat-dissipating module, and a protection layer. The substrate has an inner circuit formed on a first surface, and an outer circuit formed on a second surface and electrically connected to the inner circuit. The semiconductor die is mounted on the first surface of the substrate such that the plurality of bond pads contact the inner circuit. The heat-dissipating module includes a heat-conducting device, and the heat-conducting device, via a flat end surface thereof, contacts and bonds with a back surface of the semiconductor die. The protection layer contacts a portion of the first surface of the substrate and a portion of the heat-conducting device, such that the semiconductor die is encapsulated therebetween. | 06-10-2010 |
20100133558 | FLIP CHIP TYPE LED LIGHTING DEVICE MANUFACTURING METHOD - A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type UP lighting devices. | 06-03-2010 |
20100108298 | HEAT PIPE WITH PLANISHED END SURFACE - The invention is to provide a heat pipe that has a planished end surface, and thereby an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe. The heat pipe includes a sealed metal pipe and a porous capillary diversion layer. The metal pipe has a space in vacuum, a working fluid is in the space, wherein the planished end surface is formed on the outer wall of an sealed end of the metal pipe. The porous capillary diversion layer is disposed in the space, and it covers and includes the inner wall of the sealed end of the metal pipe. | 05-06-2010 |
20090135604 | Illuminating Equipment Using High Power LED With High Efficiency of Heat Dissipation - The invention provides a packaged system that is suitable for a LED package of high power. The packaged system further includes a heat-conducting device surrounded by at least one heat-dissipating fin to effectively dissipate the heat generated by the high power LED package. The packaged system with high efficiency of heat dissipation can be incorporated into various projecting illuminating equipments, such as a flashlight or floodlight, by simply installing the present invention into a housing and providing power connection thereto. | 05-28-2009 |
20090101932 | Semiconductor light-emitting device and method of fabricating the same - The invention provides a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts, and N semiconductor light-emitting die modules, wherein N is a positive integer lager than or equal to 1. Each of the sub-mounts is embedded on the substrate and exposed partially. Each of the semiconductor light-emitting die modules is mounted on the exposed surface of one of the sub-mounts. | 04-23-2009 |
20090034250 | System in package high power high efficiency light-emitting diode lamp - The invention provides a system-in-package, high power, and highly efficient light-emitting diode lamp. The light-emitting diode lamp, according to the invention, includes a light-guiding device. At least one end of two ends of the light-guiding device, the light, converted by a diode light-emitting device from an electric energy, is emitted into, and then is guided by the light-guiding device outside. The heat generated during light-emitting of the diode light-emitting is conducted by a heat-conducting device from a flat portion thereof to at least one heat-dissipating fin and further dissipated by the at least one heat-dissipating fin. | 02-05-2009 |
20080247162 | Light-Emitting Diode Cluster Lamp - The invention relates to a light-emitting diode cluster lamp. The light-emitting diode cluster lamp includes a plurality of light-emitting diode lamp packages, a control circuit, and a casing. Each of the light-emitting diode lamp packages includes a heat-conducting/dissipating module and a light-emitting diode module. The control circuit module is used for controlling the light-emitting diode lamp packages. The casing is adapted to accommodate the light-emitting diode lamp packages and the control circuit module. When the light-emitting diode cluster lamp is connected to a power source, the control circuit module selectively makes the light-emitting diode modules emit light. The heat generated during the light emission of each of the light-emitting diode modules is conducted and dissipated by the corresponding heat-conducting/dissipating module of each of the light-emitting diode modules. | 10-09-2008 |