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NEC COPORATION

NEC COPORATION Patent applications
Patent application numberTitlePublished
20110118395POLYLACTIC ACID RESIN COMPOSITION AND POLYLACTIC ACID RESIN MOLDED BODY - Disclosed is a polylactic acid resin composition having excellent bleed resistance and molecular weight retention ratio. A polylactic acid resin molded body is also disclosed. The polylactic acid resin composition contains a polylactic acid resin (a), a metal hydrate (b) having an alkali metal-containing substance content of not more than 0.2% by mass, and a phosphazene derivative (c). The polylactic acid resin molded body is obtained by molding the polylactic acid resin composition. Specifically, a polylactic acid molded body can be produced by filling a melt of the polylactic acid resin composition into a mold at a temperature in the range from glass transition temperature of said polylactic acid resin (a) to 110° C. and molding the melt therein.05-19-2011
20100219512Method for Forming Porous Insulating Film and Semiconductor Device - A method for forming porous insulating film using cyclic siloxane raw material monomer is provided, which method suppresses detachment of hydrocarbon and is able to form a low-density film.09-02-2010