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National University Corporation Ehime University

Matsuyama-shi, Ehime-ken, JP

National University Corporation Ehime University Patent applications
Patent application numberTitlePublished
20110229656IN-LIQUID PLASMA FILM-FORMING APPARATUS, ELECTRODE FOR IN-LIQUID PLASMA, AND FILM-FORMING METHOD USING IN-LIQUID PLASMA - In an in-liquid plasma film-forming apparatus having: a vessel 09-22-2011
20110228276NITROGEN OXIDE SENSING ELEMENT, NITROGEN OXIDE SENSOR, NITROGEN OXIDE CONCENTRATION DETERMINATION DEVICE USING SAME, AND METHOD FOR DETERMINING NITROGEN OXIDE CONCENTRATION - The nitrogen oxide sensing element of the present invention is such that a sensing film (09-22-2011
20110151456TEST METHOD FOR TYPE-2 DIABETES USING GENE POLYMORPHISM - The present invention relates to a method of testing for genetic susceptibility to type-2 diabetes in a subject that comprises detecting one or more polymorphisms present in the KCNQ1 gene and/or EIF2AK4 gene in a DNA-containing sample collected from the subject. The present invention permit a method of accurately, conveniently, and rapidly testing the genetic susceptibility of subjects to type-2 by targeting determinative genetic factors of genetic susceptibility to type-2 diabetes.06-23-2011
20080210664Method of Surface Treatment and Surface-Treated Article - Plasma generated in water vapor bubbles present in a water-containing liquid is brought into contact, in the liquid, with an article having a contact angle with water of 90° or less. The plasma is contacted with an organic substance adhering to the article to thereby remove the organic substance from the article. By bringing the plasma into contact with the article, the surface of the article is etched without breaking the article. The article may comprise a material composed of both a hydrophobic part having a contact angle with water exceeding 90° and a hydrophilic part having a contact angle with water of 90° or less. In this case only the hydrophobic part is etched by bringing the plasma into contact with the article.09-04-2008