| Napra Co., Ltd. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120091481 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A light-emitting device includes a light-emitting element and a support substrate. The light-emitting element has an insulating layer and first and second vertical conductors passing through the insulating layer. The support substrate has a substrate part and first and second through electrodes and is disposed on the insulating layer. The first through electrode passes through the substrate part with one end connected to an opposing end of the first vertical conductor, while the second through electrode passes through the substrate part with one end connected to an opposing end of the second vertical conductor. The opposing ends of the first and second vertical conductors are projected from a surface of the insulating layer and connected to the ends of the first and second through electrode inside the support substrate. | 04-19-2012 |
| 20110284912 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR - An electronic device includes a semiconductor substrate, an insulating material-filled layer and a vertical conductor. The semiconductor substrate has a vertical hole extending in a thickness direction thereof. The insulating material-filled layer is a ring-shaped layer filled in the vertical hole for covering an inner periphery thereof and includes an organic insulating material or an inorganic insulating material mainly of a glass and a nanocomposite ceramic. The nanocomposite ceramic has a specific resistance of greater than 10 | 11-24-2011 |
| 20110262762 | FILLING MATERIAL AND FILLING METHOD USING THE SAME - A filling material includes a support base member and a metal layer, the metal layer including a first metal layer and a second metal layer and being disposed on one side of the support base member, the first metal layer being an aggregate of nano metal particles and having a film thickness enabling melting at a temperature lower than a melting point, the second metal layer being an aggregate of metal particles having a lower melting point than the first metal layer. | 10-27-2011 |
| 20110232740 | SOLAR CELL - A solar cell includes a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, a first electrode, and a second electrode. The first conductivity-type semiconductor layer has a front side intended to serve as a light-receiving surface. The second conductivity-type semiconductor layer is disposed on a back side of the first conductivity-type semiconductor layer, forming a p-n junction together with the first conductivity-type semiconductor layer. The first electrode passes through the second conductivity-type semiconductor layer toward the first conductivity-type semiconductor layer with a tip extending into and ending within the first conductivity-type semiconductor layer. The second electrode is disposed at a back side of the solar cell. | 09-29-2011 |
| 20110141704 | CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MANUACTURING THE SAME - A circuit board includes a substrate, a circuit pattern and a through electrode. The circuit pattern is disposed on one side of the substrate in a thickness direction thereof. The through electrode is filled in a through-hole formed in the substrate with one end connected to the circuit pattern. The circuit pattern and the through electrode each have an area containing a noble metal component (e.g., Au component) and are connected to each other therethrough. | 06-16-2011 |
| 20110140281 | SUBSTRATE FOR ELECTRONIC DEVICE, STACK FOR ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing an electronic device, including a step of aligning and stacking a plurality of substrates, each of the plurality of substrates having a plurality of vertical conductors and magnetic films, the vertical conductors being directed along a thickness direction of the substrate and distributed in a row with respect to a substrate surface, the magnetic films being disposed in place on the substrate surface in a predetermined positional relationship with the vertical conductors, upon aligning the plurality of substrates, the electronic device manufacturing method including a step of applying an external magnetic field to produce a magnetic attractive force between the magnetic films of adjacent stacked substrates and align the vertical conductors by the magnetic attractive force. | 06-16-2011 |
| 20110120759 | CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A circuit board includes a substrate, a circuit pattern and a through electrode. The circuit pattern is disposed on one side of the substrate in a thickness direction thereof. The through electrode is filled in a through-hole formed in the substrate with one end connected to the circuit pattern. The circuit pattern and the through electrode each have an area containing a noble metal component (e.g., Au component) and are connected to each other therethrough. | 05-26-2011 |
| 20100301485 | ELECTRONIC DEVICE, CONDUCTIVE COMPOSITION, METAL FILLING APPARATUS, AND ELECTRONIC DEVICE MANUFACTURING METHOD - An electronic device includes a plurality of stacked substrates. Each of the substrates includes a semiconductor substrate, a columnar conductor, and a ring-shaped insulator. The columnar conductor extends along a thickness direction of the semiconductor substrate. The ring-shaped insulator includes an inorganic insulating layer mainly composed of a glass. The inorganic insulating layer fills a ring-shaped groove that is provided in the semiconductor substrate to surround the columnar conductor. | 12-02-2010 |
| 20100239863 | Spherical particles having nanometer size, crystalline structure, and good sphericity and method for producing the same - The present invention provides a method for producing nanometer-size spherical particles. The method includes a first step for producing intermediate spherical particles. The intermediate spherical particles include a polycrystalline or single-crystalline region, having a particle size of 1 to 300 μm. The method of the present invention further includes a second step for producing final spherical particles. The second step uses a swirling plasma gas flow having the central axis thereof, the central axis running through an area between an anode and a cathode of a plasma generator. The intermediate spherical particles are discharged along the axis to subject the intermediate spherical particles to a plasma atmosphere of the area to form the final spherical particles. | 09-23-2010 |
| 20100126688 | METHOD FOR FILLING METAL INTO FINE SPACE - The present invention includes a step of cooling a molten metal within a fine space present in the inside of an object and hardening it while applying a forced external force exceeding atmospheric pressure to the molten metal. The fine space is opened on the outer surface of the object in terms of one end thereof. The forced external force is given by at least one member selected among a pressing pressure, an injection pressure and a rolling compaction and applied to the molten metal from the opening surface side on which the fine space is opened, in a state that the other end side of the fine space is closed. | 05-27-2010 |
| 20100031501 | METHOD FOR FILLING THROUGH HOLE OR NON-THROUGH HOLE FORMED ON BOARD WITH FILLER - A method for filling a through hole or a non-through hole formed on a board with a fluent filler comprises combining at least one filling method selected from a centrifugal filling method and a magnetic filling method with an ultrasonic filling method. | 02-11-2010 |
| 20090304834 | Metal powder with nano-composite structure and its production method using a self-assembling technique - Methods, apparatuses and systems for producing powder particles of extremely small, highly uniform spherical shape and high sphericity, composed of metal including single metals and alloys, including nanocomposite structures, using a self-assembling procedure. The invention further includes the produced spherical particles. The metal spherical particles are produced whereby molten metal, alloys or composites are directed onto a fast-rotating disk in an atmosphere containing one or more inert gases and small amounts of an oxidizing gas and the molten metal drops are dispersed as tiny droplets for a predetermined time using centrifugal force within a cooling-reaction gas, and then cooled rapidly to form solid spherical particles. The spherical particles comprise a crystalline, amorphous or porous composition, having a size of 1-300 μm±1% with a uniformity of size being ≦60-70% and a precise spherical shape of less than or equal to ±10%. | 12-10-2009 |
| 20090084588 | CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A circuit board includes a substrate, a circuit pattern and a through electrode. The circuit pattern is disposed on one side of the substrate in a thickness direction thereof. The through electrode is filled in a through-hole formed in the substrate with one end connected to the circuit pattern. The circuit pattern and the through electrode each have an area containing a noble metal component (e.g., Au component) and are connected to each other therethrough. | 04-02-2009 |
