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Nanyang Tecnological University

Singapore, SG

Nanyang Tecnological University Patent applications
Patent application numberTitlePublished
20100246150Interconnect Structure And A Method Of Fabricating The Same - An interconnect structure, an interconnect structure for interconnecting first and second components, an interconnect structure for interconnecting a multiple component stack and a substrate, and a method of fabricating an interconnect structure. The interconnect structure comprising a base portion formed on a mounting surface of a first component; a pillar portion extending from the base portion and substantially perpendicularly to the mounting surface; and a head portion formed on the pillar portion and having larger lateral dimensions than the pillar portion; wherein the base portion and the pillar portion are integrally formed of a homogeneous material.09-30-2010