| Nanda Technologies GmbH Patent applications |
| Patent application number | Title | Published |
|---|
| 20120133760 | OPTICAL INSPECTION SYSTEM AND METHOD - An inspection system includes optics, an object support for mounting an object in a region of an object plane of the optics, a bright-field light source, and a dark-field light source. The inspection system also includes an image detector having a radiation sensitive substrate disposed in a region of an image plane of the optics and a beam dump. | 05-31-2012 |
| 20120094401 | METHODS OF PROCESSING AND INSPECTING SEMICONDUCTOR SUBSTRATES - A method of inspecting a semiconductor substrate having a back surface and including at least one piece of metal embedded in the substrate comprises directing measuring light towards the back surface of the substrate and detecting a portion of the measuring light received back from the substrate. The method also includes determining a distance between the piece of metal and the back surface based upon the detected measuring light received back from the substrate. | 04-19-2012 |
| 20110043798 | OPTICAL INSPECTION SYSTEM AND METHOD - An inspection system includes optics, an object support for mounting an object in a region of an object plane of the optics, a bright-field light source, and a dark-field light source. The inspection system also includes an image detector having a radiation sensitive substrate disposed in a region of an image plane of the optics and a beam dump. | 02-24-2011 |
| 20110043796 | OPTICAL INPSECTION SYSTEM AND METHOD - An inspection system includes imaging optics for imaging an object plane into an image plane. The imaging optics include an objective lens having positive optical power, a first lens group having negative optical power, and a second lens group having positive optical power. The optical elements are arranged along a common optical axis with a pupil plane of the imaging optics located between the first lens group and the second lens group. | 02-24-2011 |
| 20100231902 | OPTICAL INSPECTION SYSTEM AND METHOD - A wafer inspection system has a bright field imaging beam path and a dark field imaging beam path to obtain bright field images and dark field images of a full 300 mm wafer. The optical system provides for telecentric imaging and has low optical aberrations. The bright field and dark field beam paths are folded such that the system can be integrated to occupy a low volume with a small foot print. | 09-16-2010 |
