NAGASE CHEMTEX CORPORATION Patent applications |
Patent application number | Title | Published |
20160002402 | METHOD FOR MANUFACTURING NYLON 6 - Provided is a method for manufacturing nylon 6, said method being capable of producing a higher degree of crystallinity in a polymer at the end of a polymerization step performed on an anionically polymerizable caprolactam melt. The present invention is a method in which molten caprolactam in a reactor is anionically polymerized in the presence of a carbodiimide compound and both an anionic polymerization catalyst and an activator, neither of which is a carbodiimide compound, and a polymer is obtained from the reactor following the end of the polymerization step, yielding nylon 6 with a degree of crystallinity of at least 42% without raising the temperature of the interior of the reactor from the temperature thereof at the end of the polymerization step. | 01-07-2016 |
20150284759 | METHOD FOR PRODUCING D-ALLOSE - Provided herein is an enzyme protein produced by a highly safe microorganism and having the activity to isomerize D-psicose to D-allose. The protein is any of the following proteins (a) to (c) with the activity to isomerize D-psicose to D-allose. (a) A protein comprising the amino acid sequence represented by SEQ ID NO: 1 originating in strain 710 of a microorganism of genus | 10-08-2015 |
20150181913 | Enzyme Preparation for Modifying Food Material - An enzyme preparation for suppressing bitterness of food contains phospholipase and, if necessary, further contains protease. A method for suppressing bitterness of food includes treating a food material with a food bitterness suppressor containing the enzyme preparation. A method for producing a processed food product includes treating a food material with a food bitterness suppressor containing the enzyme preparation. Food treated with the enzyme preparation for suppressing bitterness of food tastes less bitter even when cooked after long-term preservation. Furthermore, an enzyme preparation for suppressing bitterness of food and for, if necessary, tenderizing food can be provided. | 07-02-2015 |
20150175800 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - There are provided an epoxy resin composition for encapsulation, which is particularly suitable for use in resin pre-setting type flip-chip mounting of a Cu post chip, and which is capable of suppressing defects due to the generation of voids; and a method for manufacturing a semiconductor device using a Cu post chip. The present invention provides an epoxy resin composition for semiconductor encapsulation for flip-chip mounting, which contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and 3 to 64 parts by weight, relative to 100 parts by weight of the component (A), of thermally thickening resin particles (D) having a volume-average primary particle diameter of 0.2 to 10 μm; and a method for manufacturing a semiconductor device by resin pre-setting type flip-chip mounting of a Cu post chip using the composition. | 06-25-2015 |
20150083209 | COATABLE DIFFUSING AGENT COMPOSITION, METHOD FOR PRODUCING COATABLE DIFFUSING AGENT COMPOSITION, SOLAR CELL, AND METHOD FOR MANUFACTURING SOLAR CELL - The present invention aims to provide a coatable diffusing agent composition that can prevent the formation of precipitates, has a longer solution life than conventional PTG solutions free of water, and thus can be stably stored for a long period of time even when this PTG solution is produced in large quantities, and is highly cost effective. The coatable diffusing agent composition of the present invention includes a titanate, a phosphorus compound, water, and an organic solvent. | 03-26-2015 |
20140194590 | PROCESS FOR PRODUCTION OF THERMOPLASTIC CURED EPOXY RESIN WITH TRANSPARENCY TO VISIBLE LIGHT, AND THERMOPLASTIC EPOXY RESIN COMPOSITION - Provided are a thermoplastic epoxy resin composition comprising (A) an epoxy compound having two epoxy groups in one molecule, (B) a compound having two phenolic hydroxyl groups in one molecule, and at least one compound selected from the group consisting of dihexylamine, diheptylamine, di(2-ethylhexyl)amine, N-ethylhexylamine, trihexylamine, dioctylamine, tri n-octylamine, N,N-dimethyl-n-octylamine, and N,N-dimethyldecylamine as (C) a curing accelerator, and a thermoplastic cured epoxy resin with transparency to visible light produced by curing the thermoplastic epoxy resin composition. | 07-10-2014 |
20130308180 | INFRARED REFLECTIVE SUBSTRATE - Disclosed herein is an infrared reflective substrate that can be easily produced by application onto the surface of a base material, has a film having a small film thickness, and achieves both high light permeability and excellent infrared reflective performance. The infrared reflective substrate includes: a transparent base material; and an infrared reflective layer formed by applying a coating agent containing a complex of poly(3,4-disubstituted thiophene) and a polyanion onto the transparent base material, and has a total light transmittance of 60% or higher. The complex preferably has a conductivity of 0.15 (S/cm) or higher, and the infrared reflective layer preferably has a film thickness of 0.50 μm or less. | 11-21-2013 |
20130225776 | NOVEL HETEROCYCLIC AROMATIC COMPOUND AND POLYMER - An electrically conductive polymer obtained by oxidative polymerization of a heterocycle-containing aromatic compound as a monomer, wherein the heterocycle-containing aromatic compound is represented by the formula: A-B. In the above formula, A represents a substituted or unsubstituted thiophene ring group, or a substituted or unsubstituted pyrrole ring group; B represents a substituted or unsubstituted hydrocarbon aromatic ring group, a substituted or unsubstituted thiophene ring group, or a substituted or unsubstituted pyrrole ring group; the ring represented by A and the ring represented by B are directly linked; however, A and B represent structures that are different from each other. The compound can be produced by a coupling reaction using a hypervalent iodine reactant. | 08-29-2013 |
20130190471 | IMPACT-RESISTANT POLYAMIDE COMPOSITION AND PROCESS FOR PRODUCTION OF SAME - Provided are: an impact-resistant polyamide composition which exhibits improved toughness and improved impact strength and which can be easily polymerized in-situ in a molding stage; and a novel process for the production of the same. The novel process comprises initiating the anionic polymerization of ε-caprolactam in the presence of (A) an anionic polymerization catalyst, (B) an anionic polymerization activator, (C) 2.0 to 30% by weight (relative to the ε-caprolactam) of an N,N-disubstituted vinylbenzylamine, and (D) a radical polymerization initiator, and subjecting the resulting system to reaction under conditions comprising a reaction temperature of the reaction system of 120 to 180° C. and a reaction time of 10 seconds to 120 minutes. Since radical polymerization in the process is conducted without hindering the anionic polymerization, an alloyed polyamide composed of both polycaprolactam and poly (N,N-disubstituted vinylbenzylamine) can be obtained. | 07-25-2013 |
20120308831 | EPOXY RESIN COMPOSITION - A low temperature curable epoxy resin composition which comprises: an epoxy component that contains an epoxy compound having per molecule at least two epoxy groups and that is liquid at 25° C.; an aromatic amine based curing agent that contains an aromatic amine compound having per molecule at least two amino groups directly bonded to the aromatic ring and that is liquid at 25° C.; and Mg(II) acetylacetonate as a cure accelerator. The composition, which contains a novel cure accelerator using a metal complex, exhibits high stability at room temperature while lowering a cure temperature or shortening a cure time. | 12-06-2012 |
20120208978 | NOVEL HETEROCYCLIC AROMATIC COMPOUND AND POLYMER - An electrically conductive polymer obtained by oxidative polymerization of a heterocycle-containing aromatic compound as a monomer, wherein the heterocycle-containing aromatic compound is represented by the formula: A-B. In the above formula, A represents a substituted or unsubstituted thiophene ring group, or a substituted or unsubstituted pyrrole ring group; B represents a substituted or unsubstituted hydrocarbon aromatic ring group, a substituted or unsubstituted thiophene ring group, or a substituted or unsubstituted pyrrole ring group; the ring represented by A and the ring represented by B are directly linked; however, A and B represent structures that are different from each other. The compound can be produced by a coupling reaction using a hypervalent iodine reactant. | 08-16-2012 |
20120040499 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD FOR ENCAPSULATING SEMICONDUCTOR, AND SOLVENT-BORNE SEMICONDUCTOR ENCAPSULATING EPOXY RESIN COMPOSITION - Disclosed is a novel method for manufacturing a semiconductor package, which can suppress the formation of voids in an encapsulating resin. Specifically disclosed is a method for manufacturing a semiconductor package, which comprises: (1) a step wherein a first member, which is selected from a group consisting of semiconductor chips and circuit boards, is coated with solvent borne semiconductor encapsulating epoxy resin composition that essentially contains (A) an epoxy resin, (B) a phenol novolac resin in such an amount that the mole number of phenolic hydroxyl groups is 0.8-1.2 times the mole number of epoxy groups in the component (A), (C) a curing accelerator and (D) a solvent: (2) a step wherein the coated composition is dried by volatilizing the solvent therefrom; and (3) a step wherein the first member and a second member, which is selected from a group consisting of semiconductor chips and circuit boards to form, together with the first member, a semiconductor chip/circuit board pair or a semiconductor chip/semiconductor chip pair, are thermally compression bonded with each other with the coated and dried composition interposed therebetween. | 02-16-2012 |
20110288259 | PROCESS FOR PRODUCTION OF THERMOPLASTIC CURED EPOXY RESIN WITH TRANSPARENCY TO VISIBLE LIGHT, AND THERMOPLASTIC EPOXY RESIN COMPOSITION - A process for the production of a thermoplastic cured epoxy resin which is transparent to visible light, characterized by curing (A) an epoxy compound having two epoxy groups in one molecule with (B) a compound having two phenolic hydroxyl groups in one molecule by means of (C) a cure accelerator consisting of at least one compound represented by general formula (1): | 11-24-2011 |
20110190461 | NOVEL HETEROCYCLIC AROMATIC COMPOUND AND POLYMER - A heterocycle-containing aromatic compound represented by the formula: A-B, and an electrically conductive polymer obtained by oxidative polymerization of the heterocycle-containing aromatic compound as a monomer are provided. In the above formula, A represents a substituted or unsubstituted thiophene ring group, or a substituted or unsubstituted pyrrole ring group; B represents a substituted or unsubstituted hydrocarbon aromatic ring group, a substituted or unsubstituted thiophene ring group, or a substituted or unsubstituted pyrrole ring group; the ring represented by A and the ring represented by B are directly linked; however, A and B represent structures that are different from each other. The compound can be produced by a coupling reaction using a hypervalent iodine reactant. | 08-04-2011 |
20110105646 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING ELECTRONIC PART - An epoxy resin composition for encapsulating electronic parts is provided which contains an inorganic filler in a large amount and which has a low viscosity and is flowable at ordinary temperature. The composition reconciles reactivity and storage stability, is excellent in suitability for demolding, molded-object appearance, etc., and is reduced in warpage. The epoxy resin composition comprises: (A) 100 parts by weight of an epoxy resin, (B) 50 to 150 parts by weight of an acid anhydride, and (C) 8 to 40 parts by weight of a curing accelerator of the microcapsule-type which satisfies the following: when 10 parts by weight of the curing accelerator is mixed with 100 parts by weight of the epoxy resin (A) and 100 parts by weight of a methyltetrahydroxy acid anhydride as the acid anhydride (B), the mixture has a viscosity increase ratio through 24 hours standing at 25° C. of 1.0 to 2.0 times. The composition further contains (D) fused spherical silica having an average particle diameter of 20 to 40 μm in an amount of 88 to 92% by weight of the composition. The composition has a viscosity, as measured at 25° C. under a shear rate of 2.5 (1/s), of 1000 Pa·s or lower. | 05-05-2011 |
20110081613 | RADIATION-SENSITIVE RESIN COMPOSITION - An object is to provide a radiation-sensitive resin composition such that little out gas is emitted from a resin film after heat-burning even when a novolac resin is used. The present invention is directed to a radiation-sensitive resin composition containing (A) a novolac resin having repeating units with a structure in which at least a methyl group, a phenyl group, or a hydroxyphenyl group is attached in place of a hydrogen atom in a methylene group combining phenols, (B) at least one thermally-reactive compound selected from the group consisting of benzoxazine compounds, carbodiimide compounds, triazinethiol compounds, and bismaleimide compounds, and (C) a radiation-sensitive compound, and an organic electroluminescent element in which an insulating film has been formed by radiation lithography by using the composition. | 04-07-2011 |
20090215929 | Method for Producing Fiber-Reinforced Thermally Meltable Epoxy Resin - Disclosed herein are a method for producing a fiber-reinforced thermally meltable epoxy resin having excellent heat resistance using a thermally meltable epoxy resin having a high melting initiation temperature and a fiber-reinforced plastic molded by the method. The method for producing a fiber-reinforced thermally meltable epoxy resin comprises the steps of: (I) impregnating reinforcing fibers with a compound (A) having two epoxy groups in one molecule and a compound (B) having two phenolic hydroxyl groups in one molecule; and (II) linearly polymerizing the compounds (A) and (B) impregnated into the reinforcing fibers by polyaddition reaction, wherein at least a part of the compound (A) and/or at least a part of the compound (B) are/is a compound having a fluorene skeleton, and the compound (A) and the compound (B) are mixed in such a ratio that the number of moles of epoxy groups in the compound (A) is 0.9 to 1.1 times the number of moles of phenolic hydroxyl groups in the compound (B). | 08-27-2009 |
20080268369 | Organic Film Composition and Method for Forming Resist Pattern - Disclosed is a highly practical composition for under layers which enables to form a good undercut profile without causing a intermixing layer between an upper layer resist and an under layer film in a bi-layer photoresist process. Also disclosed is a method for forming a resist pattern. Specifically disclosed is a composition for under layer organic films for forming a resist pattern having an undercut profile on a substrate by exposing and developing a bi-layer film through a mask which bi-layer film is formed on the substrate and composed of an under layer organic film and an upper layer positive resist film. Such a composition for under layer organic films comprises an alkali-soluble resin (A) obtained by condensing a phenol component (A1) which is a mixture of 3-methylphenol and 4-methylphenol and an aldehyde component (A2) comprising an aromatic aldehyde and formaldehyde, and a solvent (B). Also specifically disclosed is a method for forming a resist pattern using such a composition of under layer organic films. | 10-30-2008 |