| NAGASE CHEMTEX CORPORATION Patent applications |
| Patent application number | Title | Published |
|---|
| 20110288259 | PROCESS FOR PRODUCTION OF THERMOPLASTIC CURED EPOXY RESIN WITH TRANSPARENCY TO VISIBLE LIGHT, AND THERMOPLASTIC EPOXY RESIN COMPOSITION - A process for the production of a thermoplastic cured epoxy resin which is transparent to visible light, characterized by curing (A) an epoxy compound having two epoxy groups in one molecule with (B) a compound having two phenolic hydroxyl groups in one molecule by means of (C) a cure accelerator consisting of at least one compound represented by general formula (1): | 11-24-2011 |
| 20110190461 | NOVEL HETEROCYCLIC AROMATIC COMPOUND AND POLYMER - A heterocycle-containing aromatic compound represented by the formula: A-B, and an electrically conductive polymer obtained by oxidative polymerization of the heterocycle-containing aromatic compound as a monomer are provided. In the above formula, A represents a substituted or unsubstituted thiophene ring group, or a substituted or unsubstituted pyrrole ring group; B represents a substituted or unsubstituted hydrocarbon aromatic ring group, a substituted or unsubstituted thiophene ring group, or a substituted or unsubstituted pyrrole ring group; the ring represented by A and the ring represented by B are directly linked; however, A and B represent structures that are different from each other. The compound can be produced by a coupling reaction using a hypervalent iodine reactant. | 08-04-2011 |
| 20110105646 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING ELECTRONIC PART - An epoxy resin composition for encapsulating electronic parts is provided which contains an inorganic filler in a large amount and which has a low viscosity and is flowable at ordinary temperature. The composition reconciles reactivity and storage stability, is excellent in suitability for demolding, molded-object appearance, etc., and is reduced in warpage. The epoxy resin composition comprises: (A) 100 parts by weight of an epoxy resin, (B) 50 to 150 parts by weight of an acid anhydride, and (C) 8 to 40 parts by weight of a curing accelerator of the microcapsule-type which satisfies the following: when 10 parts by weight of the curing accelerator is mixed with 100 parts by weight of the epoxy resin (A) and 100 parts by weight of a methyltetrahydroxy acid anhydride as the acid anhydride (B), the mixture has a viscosity increase ratio through 24 hours standing at 25° C. of 1.0 to 2.0 times. The composition further contains (D) fused spherical silica having an average particle diameter of 20 to 40 μm in an amount of 88 to 92% by weight of the composition. The composition has a viscosity, as measured at 25° C. under a shear rate of 2.5 (1/s), of 1000 Pa·s or lower. | 05-05-2011 |
| 20110081613 | RADIATION-SENSITIVE RESIN COMPOSITION - An object is to provide a radiation-sensitive resin composition such that little out gas is emitted from a resin film after heat-burning even when a novolac resin is used. The present invention is directed to a radiation-sensitive resin composition containing (A) a novolac resin having repeating units with a structure in which at least a methyl group, a phenyl group, or a hydroxyphenyl group is attached in place of a hydrogen atom in a methylene group combining phenols, (B) at least one thermally-reactive compound selected from the group consisting of benzoxazine compounds, carbodiimide compounds, triazinethiol compounds, and bismaleimide compounds, and (C) a radiation-sensitive compound, and an organic electroluminescent element in which an insulating film has been formed by radiation lithography by using the composition. | 04-07-2011 |
| 20090215929 | Method for Producing Fiber-Reinforced Thermally Meltable Epoxy Resin - Disclosed herein are a method for producing a fiber-reinforced thermally meltable epoxy resin having excellent heat resistance using a thermally meltable epoxy resin having a high melting initiation temperature and a fiber-reinforced plastic molded by the method. The method for producing a fiber-reinforced thermally meltable epoxy resin comprises the steps of: (I) impregnating reinforcing fibers with a compound (A) having two epoxy groups in one molecule and a compound (B) having two phenolic hydroxyl groups in one molecule; and (II) linearly polymerizing the compounds (A) and (B) impregnated into the reinforcing fibers by polyaddition reaction, wherein at least a part of the compound (A) and/or at least a part of the compound (B) are/is a compound having a fluorene skeleton, and the compound (A) and the compound (B) are mixed in such a ratio that the number of moles of epoxy groups in the compound (A) is 0.9 to 1.1 times the number of moles of phenolic hydroxyl groups in the compound (B). | 08-27-2009 |
| 20080268369 | Organic Film Composition and Method for Forming Resist Pattern - Disclosed is a highly practical composition for under layers which enables to form a good undercut profile without causing a intermixing layer between an upper layer resist and an under layer film in a bi-layer photoresist process. Also disclosed is a method for forming a resist pattern. Specifically disclosed is a composition for under layer organic films for forming a resist pattern having an undercut profile on a substrate by exposing and developing a bi-layer film through a mask which bi-layer film is formed on the substrate and composed of an under layer organic film and an upper layer positive resist film. Such a composition for under layer organic films comprises an alkali-soluble resin (A) obtained by condensing a phenol component (A1) which is a mixture of 3-methylphenol and 4-methylphenol and an aldehyde component (A2) comprising an aromatic aldehyde and formaldehyde, and a solvent (B). Also specifically disclosed is a method for forming a resist pattern using such a composition of under layer organic films. | 10-30-2008 |
