| MURATA MANUFACTURING CO., LTD. Patent applications |
| Patent application number | Title | Published |
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| 20120134858 | COOLING DEVICE - A piezoelectric fan includes a blade that is joined to a piezoelectric oscillator that bends in response to an application of a voltage, and the blade of the piezoelectric fan is arranged to swing in a space between neighboring heat dissipating fins of a heat sink. The formation of a hole in the blade increases the amplitude of the blade and also improves the sweep effect of sweeping high-temperature air in the vicinity of the wall of the heat dissipating fin, and thus, improves the cooling capability of the piezoelectric fan. | 05-31-2012 |
| 20120134059 | ESD PROTECTION DEVICE AND MANUFACTURING METHOD THEREOF - An ESD protection device includes a ceramic base material, a pair of opposed electrodes provided on a surface of or in the ceramic base material, and a discharge auxiliary electrode film arranged to connect the pair of opposed electrodes, wherein the discharge auxiliary electrode film is composed of a material containing, as its main constituents, metallic particles and glass covering the metallic particles. The discharge auxiliary electrode film is formed by providing an electrode paste containing glass-coated metallic particles that have an approximately 15% rate of increase in weight at about 400° C. for about 2 hours in air, a resin binder, and a solvent so as to connect the pair of opposed electrodes to each other, and then firing at a temperature of about 600° C. or more, higher than a softening point of glass of the glass-coated metallic particles, and not +200° C. higher than the softening point. | 05-31-2012 |
| 20120133458 | SIGNAL LINE - A signal line that can be easily bent and significantly reduces loss generated in a high-frequency signal includes a main body including a plurality of insulating sheets made of a flexible material and stacked on each other in a stacking direction. Ground conductors are provided in the main body on the positive z-axis direction side of a signal line. The ground conductors have a slit S formed therein that overlaps the signal line when viewed in plan from the z-axis direction. A ground conductor is provided in the main body on the negative z-axis direction side of the signal line, and is overlapped by the signal line when viewed in plan from the z-axis direction. The ground conductors and the signal line define a strip line structure. A distance between the ground electrodes and the signal line is smaller than a distance between the ground electrode and the signal line. | 05-31-2012 |
| 20120133246 | BOUNDARY ACOUSTIC WAVE DEVICE - Regarding a boundary acoustic wave device in which at least a part of an IDT electrode is embedded in a groove disposed in a piezoelectric substrate, the acoustic velocity is increased. A boundary acoustic wave device is provided with a piezoelectric substrate, a first dielectric layer, and an IDT electrode. The surface of the piezoelectric substrate is provided with a groove. The IDT electrode is disposed at the boundary between the piezoelectric substrate and the first dielectric layer in such a way that at least a part thereof is located in the groove. In the inside of the groove, the groove angle γ, which is the size of an angle formed by an upper end portion of the inside surface of the groove with the surface of the piezoelectric substrate, is less than 90 degrees. | 05-31-2012 |
| 20120127049 | FREQUENCY STABILIZATION CIRCUIT, FREQUENCY STABILIZATION DEVICE, ANTENNA APPARATUS AND COMMUNICATION TERMINAL EQUIPMENT, AND IMPEDANCE CONVERSION ELEMENT - A frequency stabilization device includes a first radiating element, a second radiating element, a feeding circuit connected to the first and second radiating elements, and a frequency stabilization circuit disposed between the feeding circuit and the first radiating element. The frequency stabilization circuit includes a primary-side series circuit connected to the feeding circuit and a secondary-side series circuit coupled to the primary-side series circuit via an electric field or a magnetic field. A first inductance element and a second inductance element are connected in series to each other, and a third inductance element and a fourth inductance element are connected in series to each other. The first and third inductance elements are coupled to each other, and the second and fourth inductance elements are coupled to each other. | 05-24-2012 |
| 20120126365 | Anti-Fuse Element - An anti-fuse element that includes an insulation layer; a pair of electrode layers formed on upper and lower surfaces of the insulation layer; and an extraction electrode contacting a section of the electrode layers forming electrostatic capacitance with the insulation layer. The anti-fuse element is configured to create a structural change section that includes a short circuit section short-circuited such that the pair of electrode layers are fused mutually to engulf the insulation layer, and a dissipation section with the electrode layers and insulation layer dissipated by the engulfing of the insulation layer, when a voltage not less than the breakdown voltage of the insulation layer is applied. The maximum diameter of a section of the extraction electrode in contact with the electrode layer is larger than the maximum diameter of the structural change section. | 05-24-2012 |
| 20120125675 | ELECTRONIC COMPONENT - An electronic component that can be mounted with good balance includes a substrate, a plurality of first terminals located on a peripheral portion of one main surface of the substrate, a ground electrode located in a center of the one main surface of the substrate and including openings, and at least two second terminals located on the one main surface of the substrate and within the openings of the ground electrode and that are electrically isolated from the ground electrode. The second terminals are arranged at positions that are point symmetrical about a center of the ground electrode. | 05-24-2012 |
| 20120119867 | MULTILAYER COIL COMPONENT - A multilayer coil component is provided to have high reliability and in which internal stress arising from the difference in firing shrinkage behavior and/or thermal expansion coefficient between ferrite layers and internal conductor layers is alleviated without forming conventional voids between the ferrite layers and the internal conductor layers. A method of manufacturing a multilayer coil includes a step of isolating interfaces between internal conductors and surrounding ferrite by allowing a complexing agent solution to reach interfaces between the internal conductors and the surrounding ferrite through side gap portions from side surfaces of a ferrite element including a helical coil. The complexing agent solution contains at least one selected from the group consisting of an aminocarboxylic acid, a salt of the aminocarboxylic acid, an oxycarboxylic acid, a salt of the oxycarboxylic acid, an amine, phosphoric acid, a salt of phosphoric acid, and a lactone compound. | 05-17-2012 |
| 20120119852 | MULTILAYER BAND-PASS FILTER - In a multilayer band-pass filter, each of first-stage to third-stage LC parallel resonators includes capacitor electrodes, via electrodes, and a line electrode. Jump-coupling capacitor electrodes face the capacitor electrodes of the first-stage and third-stage LC parallel resonators. The direction in which the inductor electrode extends from the capacitor electrodes of each of the first-stage and third-stage LC parallel resonators is opposite to the direction in which the inductor electrode extends from the capacitor electrodes of the second-stage LC parallel resonator. | 05-17-2012 |
| 20120119328 | Dielectric Thin Film Element and Method for Producing the Same - A dielectric thin film element that includes a substrate, a close-adhesion layer formed on one principal surface of the substrate, a capacitance section having a lower electrode layer formed on the close-adhesion layer, a dielectric layer formed on the lower electrode layer, and an upper electrode layer formed on the dielectric layer, and a protective layer formed to cover the capacitance section, wherein the end of the close-adhesion layer is exposed from the protective layer. | 05-17-2012 |
| 20120113563 | ELECTRONIC COMPONENT AND SUBSTRATE MODULE - In an electronic component and a substrate module, a laminated body includes a first capacitor conductor and a second capacitor conductor embedded therein, which define a capacitor. First and second external electrodes are connected to the first capacitor conductor and the second capacitor conductor through extraction conductors, respectively. Third and fourth external electrodes are connected to the first capacitor conductor through extraction conductors. Fifth and sixth external electrodes are connected to the second capacitor conductor through extraction conductors. On a first side surface, no external electrode having an electrical potential different from the electrical potential of the third external electrode is provided between a first end surface and the third external electrode. On the first side surface, no external electrode having an electrical potential different from the electrical potential of the fifth external electrode is provided between a second end surface and the fifth external electrode. | 05-10-2012 |
| 20120113560 | MULTILAYER CAPACITOR HAVING LOW EQUIVALENT SERIES INDUCTANCE AND CONTROLLED EQUIVALENT SERIES RESISTANCE - In a capacitor body of a multilayer capacitor, one second capacitor portion is sandwiched between two first capacitor portions. An ESR is controlled by setting a width of lead portions of third and fourth internal electrodes disposed in the second capacitor portion to be less than that of lead portions of first and second internal electrodes disposed in the first capacitor portions and by changing ratios between the first and second capacitor portions in the width of the lead portions and in the number of stacked internal electrodes. In the first capacitor portions, current paths from the internal electrodes to an external terminal electrode are widely distributed so that the first capacitor portions have a relatively low ESL, and accordingly, the ESL of the entire multilayer capacitor is reduced. | 05-10-2012 |
| 20120112979 | ANTENNA DEVICE AND COMMUNICATION TERMINAL APPARATUS - An antenna device includes a first antenna element that resonates with a first resonant frequency, a second antenna element that resonates with a second resonant frequency, a first frequency stabilizing circuit connected to a feeding end of the first antenna element, and a second frequency stabilizing circuit connected to a feeding end of the second antenna element. The first antenna element and the second antenna element can be arranged along two sides of a case of a communication terminal apparatus, for example. | 05-10-2012 |
| 20120112978 | ANTENNA DEVICE - An antenna device having a magnetic core to be surface-mounted on a circuit substrate includes a pair of coil portions spaced apart from each other at a predetermined interval. The coil portions are connected by a connecting conductor. An end of the magnetic core includes a curved or bent portion curved toward the circuit substrate. This structure defines an RFID antenna device having an improved receiving sensitivity that can be surface-mounted without increasing the thickness of a casing of a mobile electronic device. | 05-10-2012 |
| 20120112866 | COIL-INTEGRATED SWITCHING POWER SUPPLY MODULE - A coil-integrated switching power supply module that provides an improved heat radiation effect to keep the temperature of the entire coil-integrated switching power supply module to a lower value includes a thermal diffusion conductor pattern arranged around a hole through which a magnetic core extends on a layer. The thermal diffusion conductor pattern continuously extends in areas where coil conductor patterns are located on other layers and outside areas where the coil conductor patterns are located on the other layers. In addition, the thermal diffusion conductor pattern includes slits at portions thereof and does not define a closed loop around the hole through which the magnetic core extends. | 05-10-2012 |
| 20120112856 | LAMINATED LC FILTER - A substantially loop-shaped inductor including a via electrode is arranged such that its loop surface is parallel to a mounting board. Thus, a direction of magnetic flux of the inductor is perpendicular to the mounting board, and influence of the magnetic flux on an adjacent electronic component is significantly reduced and minimized. In addition, the via electrode defines a principal portion of the inductor. Thus, an inductor with a great Q value is obtained, and the insertion loss of a laminated LC filter is significantly reduced and minimized. | 05-10-2012 |
| 20120112313 | Anti-Fuse Element - An anti-fuse element that includes an insulation layer; a pair of electrode layers on the upper and lower surfaces of the insulation layer; and an extraction electrode formed so as to make contact with a section of the electrode layers that form electrostatic capacitance with the insulation layer. The anti-fuse element is configured to create a structural change section including short circuit sections that are short-circuited such that the pair of electrode layers are fused mutually to engulf the insulation layer, and a dissipation section with the electrode layers and insulation layer dissipated by engulfing the insulation layer, when a voltage not less than the breakdown voltage of the insulation layer is applied. Furthermore, the extraction electrode has at least two or more sections in contact with the electrode layer. | 05-10-2012 |
| 20120108783 | PIEZOELECTRIC SHEET, METHOD FOR MANUFACTURING PIEZOELECTRIC SHEET, AND MANUFACTURING APPARATUS - A specific region of a polylactic acid sheet is heated by a microwave. To allow the polylactic acid sheet to exhibit piezoelectricity in the thickness direction of the polylactic acid sheet, a high voltage is applied to the heated polylactic acid sheet in the thickness direction of the polylactic acid sheet, and thereby the screw axes of at least a part of the polylactic acid molecules are relatively aligned with the thickness direction. Then the polylactic acid sheet is rapidly cooled, and thereby the polylactic acid molecules are immobilized. The same step is executed for other regions of the polylactic acid sheet, and thereby piezoelectricity is imparted to a wide area of the polylactic acid sheet in the thickness direction. The resultant piezoelectric sheet is capable of exhibiting a high piezoelectricity in the thickness direction. | 05-03-2012 |
| 20120107696 | SECONDARY BATTERY - An electrode active material mainly includes an organic compound having, in a structural unit thereof, a conjugated diamine structure represented by the general formula (I), and an electrolyte includes a carbonate ester compound represented by the general formula (II). In the formulae, R | 05-03-2012 |
| 20120105302 | ANTENNA - This disclosure provides an antenna having a high degree of design flexibility. In a representative embodiment, the antenna includes a ground conductor to which a ground potential is applied, a linear conductor that transmits a high-frequency signal, an insulating layer configured to isolate the ground conductor and the linear conductor from each other, and a radiation conductor that is connected between the linear conductor and the ground conductor. The radiation conductor has a line width larger than that of the linear conductor between a point of connection to the linear conductor and a point of connection to the ground conductor, and is configured to emit an electric field. | 05-03-2012 |
| 20120104897 | SURFACE ACOUSTIC WAVE DEVICE - A surface acoustic wave device prevents a decrease in yield and a decrease in reliability, such as an impulse withstand voltage, and achieves good frequency characteristics, even when using higher frequencies. The surface acoustic wave device includes an IDT electrode disposed on a piezoelectric substrate, and a first insulating film and at least one second insulating film disposed on the IDT electrode, and utilizes a higher-order mode of an SH wave, in which the acoustic velocity of a surface acoustic wave in the first insulating film located closer to the IDT electrode than the insulating film at an outermost surface is higher than the acoustic velocity of a surface acoustic wave in the second insulating film located at the outermost surface. | 05-03-2012 |
| 20120098729 | ANTENNA AND ANTENNA MODULE - An antenna includes a flexible sheet, a first coil electrode being formed on a first main surface of the flexible sheet and a second coil electrode being formed on a second main surface of the flexible sheet. Another end portion of the first coil electrode and another end portion | 04-26-2012 |
| 20120098728 | ANTENNA MODULE - An antenna includes a flexible sheet, a first coil electrode located on a first main surface of the flexible sheet and a second coil electrode located on a second main surface of the flexible sheet. A base film is arranged on the first main surface of the flexible sheet and a wireless communication IC is mounted on the base film. Two input/output terminals of the wireless communication IC are connected to coupling electrodes. A first coupling electrode opposes one end portion of the first coil electrode with the base film disposed therebetween. A second coupling electrode opposes one end of the second coil electrode with the base film, a central electrode and the flexible sheet disposed therebetween. | 04-26-2012 |
| 20120098724 | ANTENNA DEVICE AND COMMUNICATION TERMINAL APPARATUS - The disclosure provides an antenna device and communications terminal including such an antenna device. The antenna device includes a coil including a conductor wound around a plate-shaped magnetic core. A flat conductor is positioned adjacent to the coil, and the coil is positioned such that it is closer than the flat conductor to an antenna of a communication partner positioned near the antenna device. The coil conductor includes a first conductor portion adjacent to a first main surface of the magnetic core and a second conductor portion adjacent to a second main surface thereof. A circuit substrate includes a ground electrode formation area and a ground electrode non-formation area. The antenna coil is mounted on the ground electrode non-formation area of the circuit substrate with the first main surface of the magnetic core facing the circuit substrate. | 04-26-2012 |
| 20120098711 | ANTENNA DEVICE AND MOBILE TERMINAL - The disclosure provides an antenna device and mobile terminal including such an antenna device. The antenna device includes a coil including a conductor wound around a plate-shaped magnetic core. A flat conductor is positioned adjacent to the coil, and the coil is positioned such that it is closer than the flat conductor to an antenna of a communication partner positioned near the antenna device. The coil conductor includes a first conductor portion adjacent to a first main surface of the magnetic core and a second conductor portion adjacent to a second main surface thereof. The magnetic core and the coil conductor form an antenna coil. A circuit substrate includes a ground electrode formation area and a ground electrode non-formation area. The antenna coil is mounted on the ground electrode non-formation area of the circuit substrate with the first main surface of the magnetic core facing the circuit substrate. | 04-26-2012 |
| 20120098623 | MULTILAYER FILTER - A multilayer filter includes a laminate including a plurality of dielectric layers stacked on each other. Inner layer electrodes and outer terminals are provided in the laminate. A second coil electrode constituting a balanced-side inductor is defined by one of the inner layer electrodes. The second coil electrode has a coiled shape, and includes a first end connected to a first coil electrode through a via electrode and a second end connected to a third coil electrode through a via electrode. The second coil electrode is connected at a predetermined position along the winding direction thereof to a ground terminal, as one of the outer terminals, through an electrode for connection to a ground. The position where the ground connection electrode is connected to the second coil electrode is determined based on a balance characteristic in the balanced terminal side. | 04-26-2012 |
| 20120098622 | MULTILAYER FILTER - A multilayer filter includes a laminate including a plurality of dielectric layers stacked on each other. Inner layer electrodes and outer terminals are provided in the laminate. First and second balanced-side capacitors connected in series between first and second balanced terminals are defined by the inner layer electrodes. An inner-layer plate electrode not connected to any outer terminals is provided on the first dielectric layer. A first plate electrode connected to the first balanced terminal and a second plate electrode connected to the second balanced terminal are provided on the second dielectric layer in opposing relation to the inner-layer plate electrode. The inner-layer plate electrode and the first plate electrode and the first dielectric layer constitute the first balanced-side capacitor, and the inner-layer plate electrode and the second plate electrode and the first dielectric layer constitute the second balanced-side capacitor. | 04-26-2012 |
| 20120098387 | ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME - An elastic wave device includes a piezoelectric thin film formed from a piezoelectric single crystal substrate by peeling, an inorganic layer formed on a rear surface of the piezoelectric thin film, an elastic layer disposed on a surface of the inorganic layer opposite to the piezoelectric thin film, and a support member adhered to a surface of the elastic layer opposite to the inorganic layer. The elastic layer reduces stress generated when the piezoelectric thin film provided with the inorganic layer and the support member are adhered to each other and has a predetermined elastic modulus. The inorganic layer is formed of a material having a higher elastic modulus than that of the elastic layer and prevents damping generated when the elastic layer is provided. | 04-26-2012 |
| 20120097433 | SIGNAL LINE AND CIRCUIT SUBSTRATE - A signal line is a linear conductor provided within a laminated body. A first ground conductor is provided on a positive direction side in a z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in a planar view seen from the z axis direction. A second ground conductor is provided on a negative direction side in the z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in the planar view seen from the z axis direction. Via hole conductors connect the ground conductors to each other. In the first ground conductor, a plurality of opening portions are arranged along the signal line in the planar view seen from the z axis direction. The via hole conductors are provided between the opening portions adjacent to one another, in an x axis direction. | 04-26-2012 |
| 20120097428 | SIGNAL LINE PATH AND MANUFACTURING METHOD THEREFOR - A signal line that is easily inflected includes a laminated body including at least insulator layers that include flexible material and are laminated from a positive direction side in a z axis direction to a negative direction side therein in this order. A ground conductor is securely fixed to a main surface on the positive direction side of the insulation sheet in the z axis direction. A signal line is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. A ground conductor is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. The ground conductors and the signal line define a stripline structure. The laminated body is inflected so that the insulator layer is located on an inner periphery side, compared with a location of the insulator layer. | 04-26-2012 |
| 20120095803 | Product Inspection Device, Product Inspection Method, and Computer Program - A product inspection device that includes a measuring section, a deemed standard deviation calculation unit, a measurement value standard deviation calculation unit, a determination unit, and a risk calculation unit. The measuring section measures characteristic values of products, the deemed standard deviation calculation unit calculates a deemed standard deviation, and the risk calculation unit calculates a consumer risk and a producer risk based on at least one of an average value of the measured characteristic values of some of the products contained in a measured product lot, the deemed standard deviation, or the measurement value standard deviation. The determination unit changes a inspection standard based on at least one of the calculated consumer risk or the calculated producer risk, and determines whether or not all the products contained in the product lot are non-defective articles with the changed inspection standard as a reference. | 04-19-2012 |
| 20120092222 | ANTENNA AND ANTENNA MODULE - An antenna includes a flexible sheet that includes a first main surface including a first coil electrode located thereon and a second main surface including a second coil electrode located thereon. The first and second coil electrodes are wound in opposite directions when viewed from different directions. A first end of the first coil electrode faces a first end of the second coil electrode through the flexible sheet. Similarly, a second end of the first coil electrode faces a second end of the second coil electrode through the flexible sheet. The first and second coil electrodes define an inductor, the first ends of the first and second coil electrodes define a capacitor, and the second ends of the first and second coil electrodes define a capacitor whereby a resonant antenna is provided. | 04-19-2012 |
| 20120091863 | STRUCTURE FOR BONDING METAL PLATE AND PIEZOELECTRIC BODY AND BONDING METHOD - A bonding structure that provides excellent conductivity and bonding between a piezoelectric body and a metal plate includes a metal plate and an electrode of a piezoelectric body bonded to one another with an electrically conductive adhesive so as to provide electrical conductivity, the electrically conductive adhesive includes carbon black with a nano-level average particle size, and has a paste form included in a solventless or solvent-based resin so that the carbon black forms an aggregate with an average particle size of about 1 μm to about 50 μm. The electrically conductive adhesive is applied between the metal plate and the electrode of the piezoelectric body, and the metal plate and the piezoelectric body are subjected to heating and pressurization so that the carbon black aggregate is deformed, thereby hardening the electrically conductive adhesive. | 04-19-2012 |
| 20120091821 | ANTENNA APPARATUS - There is provided an antenna apparatus. A magnetic flux passing through a coil aperture of an antenna coil passes through a conductor aperture of a conductive layer, but the magnetic flux does not pass through the conductive layer. Accordingly, the magnetic flux is diverted to a path in which the conductor aperture of the conductive layer is the inside and the outer edge of the conductive layer is the outside. As a result, the magnetic flux passing through the coil aperture of the antenna coil makes a relatively large loop and links the inside and the outside of a coil conductor in an antenna in a communication partner with the antenna apparatus. | 04-19-2012 |
| 20120091513 | SEMICONDUCTOR SWITCH DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR SWITCH DEVICE - A semiconductor switch device and a method of manufacturing the semiconductor switch device are provided. The semiconductor switch device includes semiconductor elements on a single semiconductor substrate. At least one of the semiconductor elements constitutes a switch circuit and at least one other of the semiconductor elements constitutes a logic (connection) circuit. Each semiconductor element includes a recess, a gate electrode in the recess, a drain electrode, and a source electrode. In one representative aspect, the gate electrode in the switch circuit can have a rectangular external shape in section, and the gate electrode in the connection circuit has a shape in section other than rectangular. | 04-19-2012 |
| 20120087285 | HIGH-FREQUENCY MODULE - A high-frequency switch module includes a first diplexer arranged to receive a GPS signal and to send/receive a GSM | 04-12-2012 |
| 20120087282 | WIRELESS COMMUNICATION HIGH-FREQUENCY CIRCUIT AND WIRELESS COMMUNICATION APPARATUS - A wireless communication high-frequency circuit in which a broadband amplifier is shared between multiple communication frequency bands and multiple duplexers are used in order to support the multiple communication frequency bands to improve the transmission efficiency includes a first impedance matching circuit between an output port of an amplifier and a relay switch. A first signal path extends from the output port of the amplifier to the ground in the first impedance matching circuit. An inductor and a variable capacitance element are provided on the first signal path. Second impedance matching circuits are provided between output ports and the input port of the relay switch and transmission signal input ports of duplexers, respectively. | 04-12-2012 |
| 20120086556 | WIRELESS IC TAG, READER-WRITER, AND INFORMATION PROCESSING SYSTEM - A wireless IC tag includes a wireless IC chip and two coil-shaped antennas. One end of each of the coil-shaped antennas is electrically connected to the wireless IC chip, and the other ends of the coil-shaped antennas are electrically connected to each other. The winding axes of the coil-shaped antennas are arranged at different positions, and the coil-shaped antennas have the same winding direction. A reader-writer includes an antenna connected to an information processing circuit. The antenna is electromagnetically coupled to the coil-shaped antennas for communication. | 04-12-2012 |
| 20120086526 | WIRELESS IC DEVICE AND COUPLING METHOD FOR POWER FEEDING CIRCUIT AND RADIATION PLATE - A wireless IC device includes a wireless IC chip, a power feeding circuit substrate including a power feeding circuit including inductance elements, and radiation plates including plate-shaped coupling units. The inductance elements have spiral shapes and are wound in directions opposite to each other. The plate-shaped coupling units in the radiation plates are disposed in a vicinity of the inductance elements so as to be perpendicular or substantially perpendicular to the winding axes of the inductance elements, and eddy currents occur in the plate-shaped coupling units so as to couple the power feeding circuit and the radiation plates with each other. The plate-shaped coupling units may also have spiral shapes. | 04-12-2012 |
| 20120086524 | SURFACE ACOUSTIC WAVE FILTER DEVICE - An IDT electrode defining any one of a plurality of surface acoustic wave resonators defining series arm resonators and parallel arm resonators, except for the IDT electrode having a smallest amount of heat generation per unit time when a signal flows between first and second signal terminals, does not face wiring electrodes. | 04-12-2012 |
| 20120086520 | ELASTIC WAVE DEVICE AND DUPLEXER - An elastic wave device includes an unbalanced terminal and first and second balanced terminals. A longitudinally-coupled-resonator-type first elastic wave filter is provided between the unbalanced terminal and the first balanced terminal. An elastic wave filter, which is connected in parallel with the first elastic wave filter, is connected between the unbalanced terminal and the second balanced terminal. The current paths through which IDT electrodes of the elastic wave filter and the elastic wave filter are connected to ground terminals, are not symmetrical. | 04-12-2012 |
| 20120083219 | MULTI-RADIO TEST METHOD AND TEST FIXTURE - A method for testing characteristics of a communication device that includes a plurality of modules using a test fixture includes the steps of connecting the communication device to the test fixture, determining if tests to be performed on the plurality of modules can be simultaneously performed, performing the tests to be performed on the plurality of modules for any tests that are determined can be simultaneously performed, calculating a numerical value for each of the plurality of modules if it is determined that the tests to be performed cannot be simultaneously performed, selecting one of the tests based on the calculated numerical value, and performing the selected one of the tests based on the calculated numerical value and suspending the test or tests on the remaining modules of the plurality of modules other than the selected one of the tests. | 04-05-2012 |
| 20120081927 | ISOLATED SWITCHING POWER SUPPLY APPARATUS - An isolated switching power supply apparatus includes a direct-current input power supply, a power transmission transformer including a primary winding and a secondary winding, at least one main switching element configured to perform switching control on a direct-current voltage applied to the primary winding of the power transmission transformer, a rectification circuit that includes at least one rectification switching element and is connected to the secondary winding of the power transmission transformer, a smoothing circuit connected to the secondary winding of the power transmission transformer, a power conversion circuit configured to obtain an output voltage from the smoothing circuit, and a control circuit configured to control an operation of the power conversion circuit. | 04-05-2012 |
| 20120081836 | DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR - A laminated ceramic capacitor which exhibits excellent lifetime characteristics in a high temperature loading test uses a dielectric ceramic constituting the dielectric layers which contains (Ba | 04-05-2012 |
| 20120081258 | COIL ANTENNA AND ANTENNA STRUCTURE - The disclosure describes a compact coil antenna that can operate even if the coil antenna is arranged closely to its conductor plate, and that has a high degree of coupling with a target antenna. A lower coil conductor part and an upper coil conductor part each have a substantially rectangular and spiral form, and the inner end of the lower coil conductor part connects to the inner end of the upper coil conductor part to be connected in series to the inner end of the upper coil conductor part. In the lower coil conductor part and the upper coil conductor part, the arrangement interval in parallel-to-axis parts including segments that are parallel to the direction of the axis of a magnetic-material core is shorter than the arrangement interval of segments in orthogonal-to-axis parts that are orthogonal to the axis of the magnetic-material core. | 04-05-2012 |
| 20120081257 | ANTENNA - An antenna includes antenna coil having a magnetic-material core and a coil conductor. The antenna coil is arranged toward a side of a planar conductor, such as a circuit board. Of the coil conductor, a first conductor part close to a first main face of the magnetic-material core and a second conductor part close to a second main face of the magnetic-material core are provided such that the first conductor part is not over the second conductor part in view from a line in a direction normal to the first main face or the second main face of the magnetic-material core. In addition, a coil axis of the coil conductor is orthogonal to the side of the planar conductor. | 04-05-2012 |
| 20120081206 | SEMICONDUCTOR CERAMIC AND POSITIVE-COEFFICIENT CHARACTERISTIC THERMISTOR - A semiconductor ceramic and a positive-coefficient characteristic thermistor are provided which have a stable PTC characteristic, a high double point, and a wide operating temperature range. The semiconductor ceramic contains, as a main component, a barium titanate-based composition having a perovskite structure expressed by a general formula A | 04-05-2012 |
| 20120081192 | BRANCHING DEVICE - In a branching device, an LPF includes a first inductor arranged such that some conductor layers from among conductor layers are wound in a clockwise direction, and a second inductor arranged such that a conductor layer from among the conductor layers is wound in an counterclockwise direction. In addition, an HPF includes a third inductor arranged such that conductor layers are wound in the same clockwise direction as the first inductor. Therefore, when a high-frequency signal passes through the LPF, a winding direction is reversed. In addition, when a high-frequency signal passes through the HPF, a winding direction is reversed. | 04-05-2012 |
| 20120075770 | DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR - A laminated ceramic capacitor suitable for intermediate to high voltage applications uses a dielectric ceramic represented by {100(BaTiO | 03-29-2012 |
| 20120075766 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - In a multilayer ceramic electronic component, dummy electrodes are located in margin regions. In a region between an extension line of a side of a facing portion of an internal electrode facing a side surface of an element body and a side of an extending portion of the internal electrode facing the side surface, the dummy electrode is arranged not to extend to the extension line of the side facing the side surface. The dummy electrode includes a plurality of electrode pieces linearly extending in the direction parallel or substantially parallel to the side surface. | 03-29-2012 |
| 20120075158 | ANTENNA MODULE - An antenna module is provided and includes two feeding parts and having different frequencies of feeding on a circuit board. A first feeding radiation electrode is connected to the feeding part on a lower frequency side and performs an antenna operation. A second feeding radiation electrode is connected to the feeding part on a higher frequency side and performs an antenna operation. The first and second feeding radiation electrodes electrically connected, and the second feeding radiation electrode is smaller than and on the first feeding radiation electrode with an insulating part therebetween. The first feeding radiation electrode is configured to serve as an electrode that also performs an antenna operation of the second feeding radiation electrode, in such a manner that the second feeding radiation electrode performs an antenna operation in which the second feeding radiation electrode and the first feeding radiation electrode are electrically coupled to each other. | 03-29-2012 |
| 20120075032 | COMPOSITE ELECTRONIC MODULE AND METHOD OF MANUFACTURING COMPOSITE ELECTRONIC MODULE - An electronic component is mounted on a substrate so as to be in contact with a non-reciprocal circuit element. Therefore, there is no risk of the electronic component, which is arranged so as to be in contact with the non-reciprocal circuit element, being displaced as a result of being shifted by the magnetic force of permanent magnets included in the non-reciprocal circuit element and displacement of the electronic component as a result of being shifted by the magnetic force of the permanent magnets can be prevented. Therefore, since there is no risk of the electronic component being displaced by being shifted by the magnetic force of the permanent magnets, a space in which to mount a member that would function as an electromagnetic shield, such as a yoke, need not be provided on the substrate and the composite electronic module can be reduced in size and profile. | 03-29-2012 |
| 20120075002 | HIGH-FREQUENCY SWITCH MODULE - A high-frequency switch module that significantly reduces deterioration of high-frequency characteristics and improves harmonic wave distortion characteristics includes a high-frequency switch and SAW filters mounted on a multilayer substrate. Low pass filters are provided within the multilayer substrate. The terminals of the high-frequency switch are located on the bottom surface of the semiconductor substrate. The high-frequency switch includes a high-frequency circuit ground terminal and a control circuit ground terminal, the multilayer substrate includes therein a ground electrode which is electrically connected to a top surface connection electrode to which the high-frequency circuit ground terminal is connected, and a wiring electrode electrically connected to a top surface connection electrode to which the control circuit ground terminal is connected is arranged so as to be insulated from the ground electrode. | 03-29-2012 |
| 20120074809 | SURFACE ACOUSTIC WAVE SENSOR - A surface acoustic wave sensor that achieves increased detection sensitivity includes a piezoelectric substrate, an IDT electrode provided on the piezoelectric substrate, and a protection layer arranged on the piezoelectric substrate so as to cover the IDT electrode. The surface acoustic wave sensor is arranged so as to be excited by the IDT electrode in a high-order mode of an SH wave in which displacement at a surface of the protection layer and displacement near a boundary between the piezoelectric substrate and the IDT electrode have opposite directions, and the maximum displacement occurs at the surface of the protection layer. | 03-29-2012 |
| 20120074357 | CATALYST FOR REFORMING HYDROCARBON GAS, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SYNTHESIZED GAS - A catalyst for reforming a hydrocarbon gas using carbon dioxide and/or water vapor to react while restraining the deposition of carbon contains a NiO—Sr | 03-29-2012 |
| 20120074229 | RADIO FREQUENCY IC DEVICE AND METHOD OF MANUFACTURING THE SAME - A radio frequency IC device that prevents variations in the value of capacitive coupling between a radio frequency IC element and a radiation electrode and has good signal transmission efficiency includes a radio frequency IC element including input/output electrodes and, a first base including intermediate electrodes that are capacitively coupled to the input/output electrodes and have capacitance values C | 03-29-2012 |
| 20120073129 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND A METHOD FOR MANUFACTURING THE SAME - In a method of manufacturing a multilayer ceramic electronic component, polishing is performed so that intersection lines extending from external surfaces of a green element body and interfaces between a green chip to be formed into a laminate portion and ceramic side surface layers are each located within a curved-surface formation range of a chamfer portion. Accordingly, since a green ceramic material is extended so as to fill the interfaces like so-called “putty”, and the adhesive strength between the green chip to be formed into the laminate portion and each of the ceramic side surface layers is increased. | 03-29-2012 |
| 20120073100 | MANUFACTURING METHOD AND MANUFACTURING DEVICE FOR ELECTRONIC COMPONENT - A manufacturing method for an electronic component forms with a high degree of accuracy a portion of an outer electrode on a main surface of a dielectric block. Light irradiated from a second main surface side is detected by a detector disposed on a first main surface side, thereby detecting the positions of first and second inner electrodes, and a conductive layer is formed in a portion on a first main surface, determined based on the detection result by the detector, thereby forming first portions of individual first and second outer electrodes. | 03-29-2012 |
| 20120073099 | METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - An ion implantation layer is formed in a piezoelectric single crystal substrate by implanting hydrogen ions. A lower electrode is formed on the surface of the piezoelectric single crystal substrate at a side at which the ion implantation layer is formed. A sacrificial layer is formed on the surface of the piezoelectric single crystal substrate at a side at which the ion implantation layer and the lower electrode are formed. The formation of the sacrificial layer is performed by direct formation thereof on the surface of the piezoelectric single crystal substrate, for example, by sputtering or coating. A support layer is formed on the piezoelectric single crystal substrate on which the sacrificial layer is formed, and after the surface of the support layer is planarized, a support base material is bonded thereto. | 03-29-2012 |
| 20120069489 | ELECTRONIC COMPONENT - In an electronic component, a laminate includes a plurality of laminated ceramic layers and a mounting surface defined by outer edges of the plurality of laminated ceramic layers, the outer edges being continuously located adjacent to each other. Capacitor conductors are disposed on the ceramic layers and include exposed portions that are exposed at the mounting surface between the ceramic layers. An electroconductive layer defining an external electrode is arranged to directly cover the exposed portions and is formed by plating so as to be made of plated material. Another electroconductive layer covers the above-mentioned electroconductive layer and partially covers surfaces of the laminate, and it is made of a material including metal and one of glass and resin. | 03-22-2012 |
| 20120068788 | ELASTIC WAVE APPARATUS AND DUPLEXER - An elastic wave apparatus includes a balanced-unbalanced transforming function, and an elastic wave filter and a multilayer wiring board on which the elastic wave filter is mounted. The elastic wave filter includes an unbalanced terminal and first and second balanced terminals. External electrodes used are provided on the multilayer wiring board. A first internal line connects the first balanced terminal and the external electrode. A second internal line connects the second balanced terminal and the external electrode. The lengths or shapes of the first internal line and the second internal line are set so that a capacitance used for the improvement of a balance is generated in an adjacent area A where the first internal line and the second internal line are adjacent to each other. In the adjacent area A, the directions of currents passing through the first internal line and the second internal line are the same. | 03-22-2012 |
| 20120068787 | ELASTIC WAVE RESONATOR, LADDER FILTER AND DUPLEXER - An acoustic wave resonator that is excellent in terms of return loss characteristics at the resonant and anti-resonant frequencies and that is capable of effectively reducing loss includes an IDT electrode in which a plurality of first electrode fingers and a plurality of second dummy electrode fingers are connected to a first common electrode, a plurality of second electrode fingers and a plurality of first dummy electrode fingers are connected to a second common electrode. Apodization weighting is applied in the acoustic wave propagation direction. The metallization ratio of a non-crossing region is relatively high compared with the metallization ratio of a crossing region in the acoustic wave propagation direction. | 03-22-2012 |
| 20120068127 | BARIUM TITANATE-BASED SEMICONDUCTOR CERAMIC COMPOSITION AND BARIUM TITANATE-BASED SEMICONDUCTOR CERAMIC DEVICE - A barium titanate-based semiconductor ceramic composition which can be used for PTC thermistors for temperature sensors and which has characteristics, including a linear characteristic, advantageous for such PTC thermistors and a barium titanate-based semiconductor ceramic device. The barium titanate-based semiconductor ceramic composition is represented by the formula (Ba | 03-22-2012 |
| 20120062348 | LAMINATED COIL - A laminated coil includes a laminate having substantially rectangular insulating layers and coil patterns that are alternately laminated and unified, through holes, a coil formed inside the laminate from the coil patterns connected to each other via the through holes, external electrodes, and an insulating film formed on the outer peripheral surface of the laminate. At least one of the through holes is partially exposed in the surface of the laminate and is formed in contact with one side of the outer edge of the insulating layer but out of contact with the other sides other than the one side. | 03-15-2012 |
| 20120062332 | VARIABLE CAPACITANCE MODULE AND MATCHING CIRCUIT MODULE - In a variable capacitance module capable of achieving necessary variable capacitance ranges, a variable capacitance circuit includes a variable capacitance element and fixed capacitance elements. A first variable capacitance element and a first fixed capacitance element are connected in series, and the series circuit thereof and a second fixed capacitance element are connected in parallel. Accordingly, with reference to the capacitance of the second fixed capacitance element, the range of the combined capacitance of the variable capacitance circuit is provided by a step size of capacitance based on the combined capacitance of the variable capacitance element and the first fixed capacitance element. The first and second fixed capacitance elements are defined by inner-layer flat-plate electrodes in a laminated substrate, and the variable capacitance element is defined by an MEMS element mounted on a top surface of the laminated substrate. | 03-15-2012 |
| 20120061612 | Electrode Active Material for Secondary Battery and Method for Producing the Same, Precursor for Same, and Secondary Battery - A method for producing an electrode active material for a secondary battery, which contains a lithium containing phosphate compound with a olivine-type framework represented by LiMPO | 03-15-2012 |
| 20120058257 | LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles. | 03-08-2012 |
| 20120057382 | POWER FACTOR CORRECTION CONVERTER - A switching control circuit includes an A/D converter that converts detection signals of an input voltage detection circuit, a current detection resistor, and an output voltage detection circuit into a digital signal, a D/A converter that provides a reference voltage to an analog comparator, a PWM circuit that outputs a control voltage to a switching element, and a CPU that provides a specified value to the D/A converter as a reference value, reads the values converted by the A/D converter, and obtains the average value of the inductor current. The CPU reads an inductor current Ib when the output of the PWM circuit is set at a high level, and obtains the average value of an inductor current peak value Ip determined by the specified value and the inductor current value Ib at turn-on as an average inductor current value ILav. | 03-08-2012 |
| 20120057272 | LAMINATED CERAMIC CAPACITOR - A laminated ceramic capacitor which has high moisture resistance includes a laminated body including a plurality of stacked ceramic layers and internal electrodes placed between the ceramic layers; and an external electrode formed on an outer surface of the laminated body and electrically connected to the internal electrodes, and the laminated ceramic capacitor has the feature that the ceramic layers contain CaZrO | 03-08-2012 |
| 20120057268 | ELECTRONIC COMPONENT - In an electronic component, a first external electrode includes a first side surface electrode provided on a first side surface and a substantially rectangular first principal surface electrode that is connected to the first side surface electrode and provided on a principal surface so as to be in contact with a first corner of the principal surface. A second external electrode includes a second side surface electrode that is connected to a capacitor conductor and provided on a second side surface and a substantially rectangular second principal surface electrode that is connected to the second side surface electrode and provided on the principal surface so as to be in contact with a second corner, which is located opposite to the first corner, the second principal surface electrode facing the first principal surface electrode in an x-axis direction, in which long sides of the principal surface extend. | 03-08-2012 |
| 20120056796 | CIRCUIT BOARD AND CIRCUIT MODULE - A circuit board and a circuit module more accurately provide impedance matching between an antenna coil and an electronic component electrically connected to the antenna coil, and include a board body including board portions and a plurality of laminated insulating material layers made of a flexible material. An antenna coil includes coil conductors provided in the board portion. Wiring conductors are provided in the board portion and electrically connected to the antenna coil. The board portion has a structure that is less likely to deform than the board portion. An integrated circuit electrically connected to the wiring conductors is mounted on the board portion. | 03-08-2012 |
| 20120056795 | ANTENNA MATCHING CIRCUIT, ANTENNA DEVICE, AND METHOD OF DESIGNING ANTENNA DEVICE - A switching function and multiband compatibility and a function handling deviation of matching caused by the influence of the human body are configured in a single matching circuit. An antenna matching circuit is formed by a reactance changing section and a matching section. The matching section is formed by a parallel circuit of an inductor and a capacitor, and the LC parallel circuit is shunt-connected between a feed section and the ground. The reactance changing section changes the resonant frequency to be compatible with a plurality of bands, and performs fine adjustment of the resonant frequency changed by the influence of the human body. The parallel inductor causes the locus of input impedance of the antenna matching circuit to draw a small circle locus in the first quadrant of a Smith chart. The parallel capacitor is adjustable to move the small circle locus to the center on the Smith chart. | 03-08-2012 |
| 20120056691 | MAGNETIC RESONANCE TYPE ISOLATOR - A magnetic resonance type isolator includes a ferrite; a connection conductor that is arranged on the ferrite and includes first, second and third ports; a permanent magnet that applies a direct current magnetic field to the ferrite; a capacitor (or an inductor) that defines a first reactance element; and a capacitor (or an inductor) that defines a second reactance element. A main line arranged between the first port and the second port of the connection conductor does not resonate, an end portion of a sub-line that branches off from the main line serves as the third port, and a wave reflected from the sub-line is modulated so that its phase is shifted by 90° or about 90° at an intersection of the connection conductor. One of the capacitors is connected to the third port and the other capacitor is connected between the first port and the second port. | 03-08-2012 |
| 20120056690 | MAGNETIC RESONANCE TYPE ISOLATOR - A magnetic resonance type isolator includes a ferrite; a connection conductor that is arranged on the ferrite and includes a first port, a second port and a third port; a permanent magnet that applies a direct current magnetic field to the ferrite; an inductor that defines a reactance element; and capacitors that define an impedance matching circuit. A main line arranged between the first port and the second port of the connection conductor does not resonate, an end portion of a sub-line that branches from the main line serves as the third port, and a wave reflected from the sub-line is modulated so that its phase is shifted by 90° or about 90° at an intersection of the connection conductor. The inductor is connected to the third port and the capacitors are connected to the first and second ports, respectively. | 03-08-2012 |
| 20120056506 | BOUNDARY ACOUSTIC WAVE DEVICE - A boundary acoustic wave device includes a first medium, a second medium laminated on the first medium, and an IDT electrode arranged at an interface between the first medium and the second medium. The boundary acoustic wave device further includes a reformed portion disposed in at least one of the first medium and the second medium, reformed by externally provided energy, and having frequency characteristics different from frequency characteristics exhibited when the boundary acoustic wave device includes only at least one of the first medium and the second medium. | 03-08-2012 |
| 20120056337 | RFIC CHIP MOUNTING STRUCTURE - An RFIC module includes an RFIC chip that is mounted on a mounting substrate and that is encapsulated with an encapsulation resin layer. The mounting substrate includes a flexible base and electrodes provided on the flexible base. External terminals are disposed near four corners of a mounting surface of the RFIC chip. One of a plurality of mounting lands located on the surface of the flexible base is a shared mounting land and defines an integrated mounting land that is shared by an RF terminal and an NC terminal of the RFIC chip. The shared mounting land is arranged to cover one side of the RFIC chip when viewed from above. | 03-08-2012 |
| 20120056001 | OPTICAL DISC - An optical disc includes an electromagnetic coupling module mounted therein. The electromagnetic coupling module includes a wireless IC chip and a feeder circuit substrate in which a feeder circuit including a resonant circuit having a predetermined resonant frequency is disposed. The electromagnetic coupling module is electromagnetically coupled to a reflective film defining a metal thin film of the optical disc, and the reflective film defines an antenna or radiation pattern of the electromagnetic coupling module. | 03-08-2012 |
| 20120055273 | DEW FORMATION TESTING DEVICE AND DEW FORMATION TESTING METHOD - A dew formation testing device has an adjustment tank capable of adjusting the temperature and humidity of air to predetermined temperature and humidity, a testing tank installed separately from the adjustment tank and having a sample base that has a mounting surface, onto which a testing sample W can be placed, and that is capable to cool the mounting surface, and ducts that link the adjustment unit and the testing tank. The testing tank is provided with an air guide member that, when air flowing into the testing tank through the duct flows onto the sample base from a side of the sample base, guides the air in the direction tilted downward at a predetermined angle, the guidance being performed at a position right above the sample base at an end thereof which is on the upstream side of the air flow. | 03-08-2012 |
| 20120043854 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The external electrodes contain a sintered metal. The metal terminals are electrically connected to the external electrodes, respectively. The external electrode and the metal terminal are directly diffusion-bonded by diffusion of metal in the metal terminals into the external electrodes. The above arrangement provides a ceramic electronic component having highly reliable metal particle bonding and a method for manufacturing the same. | 02-23-2012 |
| 20120043129 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - In a circuit board, a laminate includes a plurality of laminated insulating material layers made of a flexible material. First external electrodes are provided on an upper surface of the laminate, and an electronic component is mounted thereon. Second external electrodes are provided on a lower surface of the laminate and mounted on a wiring board. An internal conductor is provided between first and second adjacent insulating material layers, fixed to the first insulating material layer, and not fixed to the second insulating material layer. The internal conductor is arranged so as to extend across regions obtained by connecting certain ones of the second external electrodes to certain ones of the first external electrodes located closest to the certain ones of the second external electrodes. | 02-23-2012 |
| 20120043117 | SIGNAL TRANSMISSION LINE AND CIRCUIT BOARD - A signal line and a circuit board that can be easily bent in a U shape and prevent unwanted emission include a line portion includes a plurality of laminated line portion sheets made of a flexible material. Signal lines extend within the line portion in an x-axis direction. Ground lines are provided within the line portion on a positive direction side in a z-axis direction with respect to the signal lines and have line widths equal to or smaller than the line widths of the signal lines. Ground lines are provided within the line portion on a negative direction side in the z-axis direction with respect to the signal lines. The signal lines overlap the ground lines when seen in a planar view from the z-axis direction. | 02-23-2012 |
| 20120039102 | WIRELESS POWER TRANSFER TERMINAL - This disclosure provides a wireless power transfer terminal that enables a power device to be used for both power transmission and power reception and allows space savings of circuits and a reduction in the cost of manufacturing. The wireless power transfer terminal includes first through fourth switching elements, a coil, and a control circuit. Each of two sets of switching elements forms a series circuit, and the two sets are connected in parallel to each other. The coil is connected between connection points of the switching elements of the series circuits. The control circuit performs switching control of the first to fourth switching elements in a power transmission mode and in a power reception mode. | 02-16-2012 |
| 20120039015 | LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni—B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni—B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %. | 02-16-2012 |
| 20120039014 | LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - In a laminate type ceramic electronic component, when an external electrode for a laminated ceramic capacitor is formed directly by plating onto a surface of a component main body, the film that is directly plated may have a low fixing strength with respect to the component main body. As the external electrode, a first plating layer composed of a Ni—P plating film with a P content rate of about 9 weight % or more is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no P is formed on the first plating layer. Preferably, the first plating layer is formed by electroless plating, whereas the second plating layer is formed by electrolytic plating. | 02-16-2012 |
| 20120038443 | COMMUNICATION TERMINAL - This disclosure provides an antenna coil for a circuit board including a ground conductor serving as a planar conductor, a feed circuit for connecting to the antenna coil and various electronic components constituting a mobile communication terminal that are mounted on the front and/or back surfaces of the circuit board. The antenna coil includes a magnetic core having a first principal surface and a second principal surface, and a coil conductor wound around the magnetic core. The coil conductor has a first conductor portion located adjacent to the first principal surface of the magnetic core, and a second conductor portion located adjacent to the second principal surface of the magnetic core and at a position different from that of the first conductor portion in plan as viewed from the first principal surface or the second principal surface. Housing is configured to house or hold the antenna coil, and the antenna coil is positioned such that the second principal surface of the magnetic core faces toward an outer surface of the housing. | 02-16-2012 |
| 20120038435 | ELASTIC WAVE APPARATUS - In an elastic wave apparatus, a first dielectric layer is laminated on a piezoelectric substrate. An electrode structure is provided at an interface between the first dielectric layer and the piezoelectric substrate. The electrode structure includes a first electrode structure of an elastic wave filter and a second electrode structure of elastic wave resonators. The elastic wave resonators are electrically connected to the elastic wave filter. An anti-resonant frequency at which the extreme impedance values of the elastic wave resonators are obtained is in a frequency band in which the higher-order mode spurious response of the elastic wave filter appears. | 02-16-2012 |
| 20120038218 | POWER TRANSMISSION SYSTEM - A power transmission system a power transmission apparatus, a center frequency acquiring unit, and a control unit. The power transmission apparatus includes a primary-side coupling electrode electrically configured to couple to a secondary-side coupling electrode and connected load circuit of a power receiving apparatus, a high-frequency voltage generating circuit configured to generate and apply a high-frequency voltage to the primary-side coupling electrode, and a driving power circuit that supplies driving power to the high-frequency voltage generating circuit. The center frequency acquiring unit acquires a center frequency at which a high-frequency high voltage applied to coupling electrode is minimized in a state in which a low load is applied to the secondary-side coupling electrode of the power receiving apparatus and the frequency of the generated high-frequency voltage is varied. The control unit sets a driving frequency of the high-frequency voltage generating circuit at or near the center frequency to supply power to the power receiving apparatus. | 02-16-2012 |
| 20120037538 | CARRIER TAPE, CARRIER TAPE MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING CARRIER TAPE - Provided is a carrier tape with improved tensile strength and flexural rigidity in a longitudinal direction of a base material, including recesses that can be provided at a narrow pitch in a first surface of the base material, and manufacturable at reduced cost, as well as to provide an apparatus and a method for manufacturing such a carrier tape. A carrier tape of the present invention is constituted by a strip-shaped base material, and includes a plurality of recesses provided in a first surface of the base material and for containing electronic components, a covering unit configured to seal openings of the recesses, and a projection provided on a second surface of the base material along a longitudinal direction of the base material. A length of the projection extends over at least two of the recesses. | 02-16-2012 |
| 20120033455 | SWITCHING POWER SUPPLY APPARATUS - In a switching power supply apparatus, a comparator outputs a first determination criterion signal based on a saw-tooth wave signal whose level fluctuates with a constant period and a detection voltage signal. An inverter subjects the first determination criterion signal to reverse processing, and outputs a second determination criterion signal. The comparator outputs a first switching judgment-use signal from a monitor signal and a threshold value, and the comparator outputs a second switching judgment-use signal from the monitor signal and the threshold value. An AND circuit outputs the first switching control signal from the first determination criterion signal and the first switching judgment-use signal, and the AND circuit outputs the second switching control signal from the second determination criterion signal and the second switching judgment-use signal. | 02-09-2012 |
| 20120033454 | SWITCHING POWER SUPPLY APPARATUS - A resonance-type power supply is provided in which no short circuit occurs and driving is performed with a constant switching period by performing switching control using a change of magnetic flux of a magnetic component as a trigger. When the change of magnetic flux of the transformer is detected, the first switching control signal is caused to transition to the Hi level. The detection voltage signal is A/D-converted, a first on-time is determined from the level thereof, and a second on-time is calculated by subtracting the first on-time from the constant switching period. When the first switching control signal is caused to transition to the Low level based on the first on-time, the change of magnetic flux of the transformer is detected, and the second switching control signal is caused to transition to the Hi level and is caused to transition to the Low level after the second on-time has elapsed. | 02-09-2012 |
| 20120033344 | DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR - A dielectric ceramic and a laminated ceramic capacitor using the dielectric ceramic are achieved which provide favorable thermal shock resistance without damaging properties or characteristics such as dielectric properties, insulation properties, temperature characteristics, and characteristics in high temperature loading, even when the dielectric layers are reduced in thickness and the number of stacked layers increased. The dielectric ceramic contains, as its main constituent, a barium titanate based compound represented by the general formula ABO | 02-09-2012 |
| 20120032767 | LAMINATED COIL - A laminated coil includes a laminated body insulating layers and coil patterns are integrally stacked in a desired order, a coil formed by connecting the coil patterns, a pair of external electrodes provided at opposite ends of the laminated body, and an insulating film provided on an outer peripheral surface of the laminated body. At least one of the coil patterns is in contact with an outer peripheral edge of the corresponding insulating layer at least a part of an outer peripheral edge of the coil pattern, but is not in contact with corners of the insulating layer in a manner such that the at least one coil-pattern is absent at portions of the corresponding insulating layer near the corners of the corresponding insulating layer. | 02-09-2012 |
| 20120032758 | ELECTRONIC COMPONENT - In an electronic component, a first LC resonant circuit includes a first coil including coil portions that extend from a first external electrode to a second external electrode while turning in a first direction. A second LC resonant circuit includes a second coil including coil portions that extend from a third external electrode to a fourth external electrode while turning in the first direction. A third LC resonant circuit includes a third coil and a capacitor. The third coil includes coil portions that extend from the capacitor of the third LC resonant circuit to the second external electrode while turning in a second direction opposite to the first direction around the coil portions of the first coil and the second coil. | 02-09-2012 |
| 20120025931 | BOUNDARY ACOUSTIC WAVE RESONATOR AND LADDER FILTER - In a boundary acoustic wave resonator, apodization weighting is performed on an IDT electrode so that an intersecting width decreases as a location moves outward in a boundary acoustic wave propagation direction. An inner side of a first busbar includes inclined portions that are disposed a predetermined distance from an envelope portion B | 02-02-2012 |
| 20120025628 | POWER TRANSMITTING APPARATUS, POWER RECEIVING APPARATUS, AND POWER TRANSMISSION SYSTEM - A power transmitting apparatus has a power transmitting apparatus side active electrode provided within the casing thereof along a seat. A power transmitting apparatus side passive electrode is exposed on a backrest. A power receiving apparatus has a power receiving apparatus side active electrode formed along the bottom surface thereof. A power receiving apparatus side passive electrode is formed on the outer surface of the casing of the power receiving apparatus. By mounting the power receiving apparatus on a mounting portion of the power transmitting apparatus, the power receiving apparatus side active electrode faces the power transmitting apparatus side active electrode with a dielectric layer therebetween, and the power receiving apparatus side passive electrode is directly electrically connected to the power transmitting apparatus side passive electrode. | 02-02-2012 |
| 20120025333 | MEMS ELEMENT AND METHOD FOR MANUFACTURING SAME - An acceleration sensor is formed using an etched layer sandwiched between first and second substrates. In this case, a structure including a movable portion which is displaceable in the thickness direction of the substrates, and a support frame are formed in the etched layer. In addition, first and second fixed electrodes are formed on the first and second substrates, respectively, at a position facing the movable portion. Further, a remaining sacrificial layer is provided on the substrate by leaving a portion of a second sacrificial layer when a first sacrificial layer is entirely etched away. Therefore, when the first sacrificial layer is etched away, corrosion of the structure and the support beams is prevented because the second sacrificial layer is preferentially corroded as compared to the structure. | 02-02-2012 |
| 20120021644 | COAXIAL INSPECTION CONNECTOR AND RECEPTACLE - This disclosure provides a coaxial inspection connector that is connectable to and disconnectable from a receptacle, the receptacle including an external conductor, a fixed terminal, and a movable terminal that is in pressed contact with the fixed terminal from below. Housing includes an end portion that contacts the external conductor. A probe extends vertically in the end portion. The probe is insulated from the housing, and includes a plunger. The plunger includes a plunger body and a tip. The plunger body contacts the fixed terminal when the external conductor contacts the end portion. The tip is an insulating portion disposed at a lower end of the plunger. The tip pushes the movable terminal downward and separates the movable terminal from the fixed terminal when the external conductor contacts the end portion. | 01-26-2012 |
| 20120021551 | THERMOELECTRIC CONVERSION MODULE AND METHOD FOR MANUFACTURING THE SAME - A compact, high-performance thermoelectric conversion module includes a laminate having a plurality of insulating layers, p-type thermoelectric semiconductors and n-type thermoelectric semiconductors formed by a technique for manufacturing a multilayer circuit board, particularly a technique for forming a via-conductor. Pairs of the p-type thermoelectric semiconductors and the n-type thermoelectric semiconductors are electrically connected to each other in series through p-n connection conductors to define thermoelectric conversion element pairs. The thermoelectric conversion element pairs are connected in series through, for example, series wiring conductors. The thermoelectric semiconductors each have a plurality of portions in which the peak temperatures of thermoelectric figures of merit are different from each other. These portions are distributed in the stacking direction of the laminate. | 01-26-2012 |
| 20120019982 | ELECTRONIC COMPONENT - An electronic component includes a ceramic body including first to fourth side surfaces, a first external electrode provided on one side surface of the ceramic body, a second external electrode, and a plurality of reinforcing electrodes. Each of the first and second external electrodes includes a thick-film electrode layer including sintered metal, a plated layer arranged so as to cover the thick-film electrode layer, an external electrode main body portion covering the side surface of the ceramic body, and turnback portions extending to the top surface and the bottom surface of the ceramic body. An end portion of at least one reinforcing electrode of the plurality of reinforcing electrodes is exposed on the top surface or the bottom surface of the ceramic body on the center portion of the ceramic body in relation to the thick-film electrode layer in the turnback portion. | 01-26-2012 |
| 20120019981 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a first reinforcement layer. The first reinforcement layer is arranged in a first outer layer portion so as to extend in the length direction and in the width direction. Portions of the first reinforcement layer face a first portion of a first external electrode and a first portion of a second external electrode in the thickness direction. The first reinforcement layer is not exposed at a first end surface or a second end surface of the ceramic electronic component. In a portion of a first main surface of the ceramic electronic component in which the first portion of the first or second external electrode is provided, a portion that does not face the first reinforcement layer is closer to the center in the thickness direction than a portion that faces the first reinforcement layer. | 01-26-2012 |
| 20120019978 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a plurality of first reinforcement layers. The plurality of first reinforcement layers are arranged in a first outer layer portion so as to extend in the length direction and in the width direction, and are stacked in the thickness direction. The volume proportion of the plurality of first reinforcement layers in a region of the ceramic body in which the plurality of first reinforcement layers are provided is greater than the volume proportion of the first and second internal electrodes in an effective portion. | 01-26-2012 |
| 20120019977 | LAMINATE TYPE SEMICONDUCTOR CERAMIC CAPACITOR WITH VARISTOR FUNCTION - A laminate type semiconductor ceramic capacitor with a varistor function is achieved which allows for an improvement in product yield while ensuring such insulation performance that can withstand practical use, and is suitable for mass production with a favorable ESD withstanding voltage. The semiconductor ceramic forming the semiconductor ceramic layers has a compounding molar ratio m between the Sr site and the Ti site of 0.990≦m<1.000, has a donor element such as La present as a solid solution in crystal grains, has an acceptor element such as Mn present in a grain boundary layer in the range of 0.5 mol or less (preferably 0.3 mol to 0.5 mol) with respect to 100 mol of the Ti element, and has the crystal grains with an average grain size of 1.5 μm or less. | 01-26-2012 |
| 20120019332 | NONRECIPROCAL CIRCUIT ELEMENT - A nonreciprocal circuit element includes first and second center electrodes. On a ferrite to which a direct-current magnetic field is applied from a permanent magnet, the first and second center electrodes are insulated and intersect. First and second ends of the first center electrode are connected to an input port and an output port, respectively. First and second ends of the second center electrode are connected to the output port and a ground port, respectively. A first matching capacitor and a resistor are connected between the input port and the output port. A second matching capacitor is connected between the output port and the ground port. A parallel resonant circuit is connected in parallel to the resistor. A coupling element is connected between the parallel resonant circuit and another parallel resonant circuit including the first center electrode and the first matching capacitor so as to the parallel resonant circuits. | 01-26-2012 |
| 20120019101 | ELASTIC WAVE DEVICE - An elastic wave device that achieves an improved frequency-temperature characteristic and a sufficiently reduced spurious component includes a piezoelectric body including a LiNbO | 01-26-2012 |
| 20120019100 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - In a method for manufacturing a laminated ceramic electronic component, when a plating film to define an external terminal electrode is formed by plating exposed ends of a plurality of internal electrodes at a WT surface of a component main body, ingress of a plating solution may be caused from a gap between an end edge of the plating film and the component main body to decrease the reliability of a laminated electronic component obtained. An internal dummy electrode is provided around a region where the exposed ends of the plurality of internal electrodes are distributed in the WT surface of the component main body. The internal dummy electrode includes two LW-direction sections extending parallel or substantially parallel to each other in a direction along the LW surface, and two LT-direction sections extending parallel or substantially parallel to each other in a direction along the LT surface. The plating film is formed at least over the exposed end of the internal dummy electrode. The internal dummy electrode is formed by wrapping an outer layer sheet with the internal dummy electrode formed around a laminate composed of ceramic layers and the internal electrodes. | 01-26-2012 |
| 20120019099 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t | 01-26-2012 |
| 20120018205 | METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECTRONIC COMPONENT, AND WIRING BOARD - A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired. | 01-26-2012 |
| 20120018204 | CERAMIC ELECTRONIC COMPONENT AND WIRING BOARD - A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed. | 01-26-2012 |
| 20120013422 | SIGNAL TRANSMISSION COMMUNICATION UNIT AND COUPLER - This disclosure provides a signal transmission communication unit and a coupler that can occupy a small area and have a reduced thickness. The signal transmission communication unit includes a base component including a signal transmission line and a ground electrode, a coupling planar conductor parallel to the base component and having a planar shape, an inductor circuit connected between the coupling planar conductor and the signal transmission line, and an LC-series circuits between part of the coupling planar conductor and the ground electrode and including a capacitor and an inductor connected in series. The inductor circuit is provided between the coupling planar conductor and the base component, and the LC-series connected circuit is provided between the coupling planar conductor and the base component. | 01-19-2012 |
| 20120012369 | CIRCUIT BOARD - A circuit board includes a laminated body including a laminate of a plurality of insulating-material layers made of a flexible material. External electrodes are provided on the top surface of the laminated body. An electronic component is mounted on the external electrodes. A plurality of internal conductors, when viewed in plan in the z-axis direction, are overlaid on the external electrodes and are not connected to one another in regions in which the internal conductors are overlaid on the external electrodes. | 01-19-2012 |
| 20120010783 | MOVEMENT DIRECTION CONTROL APPARATUS AND COMPUTER PROGRAM - In a movement direction control apparatus and a non-transitory computer readable medium, a reaction torque accompanying rotation of a rotor is utilized to control a rotation angle of a body in a yaw direction. A specification of a yaw angle of a wheel as a target of the movement direction is received, and information of a friction torque is acquired. A rotation angular acceleration in the yaw direction is calculated, based on the yaw angle, the specification of which has been received, and the reaction torque is calculated, based on the calculated rotation angular acceleration in the yaw direction. An operation instruction to a motor for yaw is generated, based on the calculated reaction torque and the acquired information of the friction torque. | 01-12-2012 |
| 20120008250 | DIELECTRIC RESIN COMPOSITION FOR FILM CAPACITOR AND FILM CAPACITOR - To increase the heat resistance of a film capacitor, a dielectric resin composition is used as a material for a dielectric resin film used in a film capacitor, the dielectric resin composition being cured by mixing and crosslinking two or more organic materials having functional groups that react with each other to provide a cured article. At least one pair highly cohesive atomic groups which has a molecular cohesive energy equal to or higher than that of a methyl group and capable of cohering with each other due to the molecular cohesive energy is linked to the organic material. The highly cohesive atomic groups form a cohesive portion serving as pseudo-crosslinking. | 01-12-2012 |
| 20120008142 | METHOD FOR MEASURING CHARACTERISTIC OF OBJECT TO BE MEASURED, STRUCTURE CAUSING DIFFRACTION PHENOMENON, AND MEASURING DEVICE - A method of attaching an object to be measured to a structure causing a diffraction phenomenon; irradiating the structure to which the object to be measured is attached and which causes the diffraction phenomenon with an electromagnetic wave; detecting the electromagnetic wave scattered by the structure causing the diffraction phenomenon; and measuring a characteristic of the object to be measured from the frequency characteristic of the detected electromagnetic wave. The object to be measured is attached directly to the surface of the structure causing the diffraction phenomenon. Thus, the method for measuring the characteristic of an object to be measured exhibits an improved measurement sensitivity and high reproducibility. A structure causing a diffraction phenomenon and used for the method, and a measuring device are provided. | 01-12-2012 |
| 20120006904 | WIRELESS IC DEVICE COMPONENT AND WIRELESS IC DEVICE - A wireless IC device includes a wireless IC chip, a coupling electrode, and a radiation plate. The coupling electrode includes coupling portions arranged to be coupled to the wireless IC chip and a pair of opposing ends. The pair of opposing ends are capacitively coupled to each other and oppose the radiation plate to be coupled to the radiation plate. The wireless IC chip uses the radiation plate as an antenna to transmit and receive signals having certain frequencies to and from an RFID system. | 01-12-2012 |
| 20120003499 | FLEXIBLE BOARD - A reliable flexible board prevents disconnection from occurring in a conductor layer in a stacking process or during use of a product that repeatedly causes deformation. The flexible board includes resin layers and conductor layers that are alternately stacked on top of one another, wherein each of the conductor layers includes a first conductor layer made of a first metal and a second conductor layer made of a second metal disposed between one of the resin layers and the first conductor layer, the second metal having a higher ductility than the first metal. | 01-05-2012 |
| 20120003450 | MULTILAYER CERAMIC SUBSTRATE - In order to enable non-shrinkage firing, the strength of a multilayer ceramic substrate is increased which is obtained by a method in which alternately stacking a base material layer and a constrained layer which is not sintered at the sintering temperature for the base material layer, and in a firing step, allowing the material of the base material layer to flow into the constrained layer while subjecting the base material layer to sintering, thereby achieving densification of the constrained layer. The base material layer and the constrained layer each include celsian, and the abundance of celsian is lower in the base material layer than in the constrained layer. In order to increase the strength of the base material layer, the addition of a Ti component, rather than an increased content of Al component which interferes with sintering of the base material layer, causes fresnoite to be deposited in the base material layers. The presence of fresnoite in the base material layers increases crystal grain boundaries in the base material layers, and thus prevents cracking, thereby allowing the strength of the multilayer ceramic substrate to be improved. | 01-05-2012 |
| 20120002380 | CIRCUIT BOARD AND MOTHER LAMINATED BODY - A circuit board includes a laminated body including insulation layers made of a flexible material that are stacked on one another. External electrodes are provided on a bottom surface of the laminated body. Ground conductors are provided in the laminated body and that are harder than the insulation layers. The laminated body includes a flexible region and a rigid region that is adjacent to the flexible region when viewed in plan from a z-axis direction. The rigid region is defined by the ground conductors when viewed in plan from the z-axis direction. The external electrodes are provided within the flexible region when viewed in plan from the z-axis direction. | 01-05-2012 |
| 20120001821 | ANTENNA DEVICE AND WIRELESS COMMUNICATION DEVICE - There is provided an antenna device which has a structure using control lines of an integrated circuit as a portion of an emitting electrode so as to prevent electromagnetic coupling between the emitting electrode and the control lines, and thereby prevent the occurrence of unnecessary resonance and deteriorations in antenna characteristics. Also there is provided a wireless communication device of the same. The antenna device includes at least one emitting electrode and an other emitting electrode provided with the control lines. Connection circuits are provided between the control lines and the other emitting electrode to allow an RF signal of the emitting electrode to flow to the control lines such that the other emitting electrode and the control lines function as a single emitting electrode. | 01-05-2012 |
| 20120001704 | ACOUSTIC WAVE DEVICE - An acoustic wave device includes resonator structures each including resonators arranged next to each other, and each of the resonator structures is excited in at least two vibration modes as the resonators thereof are coupled and resonate with each other. At least one of the resonator structures exhibits stronger resonance characteristics in one of the vibration modes than in the other vibration mode or modes within the filter band. | 01-05-2012 |
| 20120001703 | ELECTRONIC COMPONENT - An electronic component includes a laminated body including an insulating material layer made of a first dielectric material and a second insulating material layer made of a second dielectric material having a relative dielectric constant greater than that of the first dielectric material that are laminated to one another. An LC filter is defined by a coil included in the laminated body and a capacitor. The coil includes a coil conductor layer provided on the insulating material layer. The coil conductor layer is provided within a region including the insulating material layer. | 01-05-2012 |
| 20120001701 | SIGNAL PROCESSING CIRCUIT AND ANTENNA APPARATUS - To form a signal processing circuit and an antenna apparatus that do not need a circuit to adjust resonant frequency of a resonant circuit or resonant-frequency adjustment work and that are downsized, an antenna coil and a capacitor define an antenna resonant circuit. An impedance matching circuit including capacitors, a first coil, and a second coil is provided between the antenna resonant circuit and a wireless IC. The first coil and the second coil are magnetically coupled. | 01-05-2012 |
| 20120001626 | MAGNETIC IMPEDANCE ELEMENT AND MAGNETIC SENSOR USING THE SAME - In order to provide a magnetic impedance element capable of achieving a large magnetic impedance effect at room temperature or higher, the magnetic impedance element includes a ceramic body represented by the chemical formula Sr | 01-05-2012 |
| 20120000695 | RESIN CIRCUIT BOARD - A resin circuit board includes a layered structure of resin layers and conductor layers, has significantly reduced and minimized warping and distortion, and has a precise shape. A second conductor layer is disposed between a resin layer and a first conductor layer made of a metal. The resin layer and the second conductor layer have a higher thermal expansion coefficient than the first conductor layer such that the thermal expansion coefficient changes gradually, allowing a stress resulting from a difference in thermal expansion coefficient to be relieved. | 01-05-2012 |
| 20110316648 | ELASTIC-WAVE LADDER FILTER - An elastic-wave ladder filter significantly reduces loss within a passband while also increasing the passband and attenuation. The elastic-wave ladder filter includes a series arm that connects an input end and an output end and a parallel arm that connects the series arm and a ground potential. The series arm includes at least three series arm resonators connected to each other in series. The resonant frequencies of the at least three series arm resonators differ from each other. An aspect ratio of the series arm resonator having the lowest resonant frequency is larger than an average of the aspect ratios of all the series arm resonators when the aspect ratio is defined as a ratio of an overlap width of electrode fingers of a series arm resonator to a number of pairs of the electrode fingers. | 12-29-2011 |
| 20110316647 | ELASTIC WAVE BRANCHING FILTER - A reception filter includes a first and second longitudinally coupled resonator-type surface acoustic wave filter portions and a surface acoustic wave resonator. The first and second longitudinally coupled resonator-type surface acoustic wave filter portions each include at least three IDT electrodes. The surface acoustic wave resonator includes one IDT electrode connected to at least one of the at least three IDT electrodes. The reception filter is arranged such that a ratio of a capacitance of the surface acoustic wave resonator to a capacitance of each of the at least one of the at least three IDT electrodes included in the longitudinally coupled resonator-type surface acoustic wave filter portion, the at least one of the at least three IDT electrodes being electrically connected to the one IDT electrode of the surface acoustic wave resonator, is in the range of about 1.9 to about 2.5. | 12-29-2011 |
| 20110316642 | MODULE - A module includes a substrate including an IC disposed on an upper surface side thereof. The IC includes a modulation circuit unit arranged to modulate a baseband signal into an RF signal and a demodulation circuit unit arranged to demodulate an RF signal into a baseband signal. The substrate includes a first wiring layer provided on the upper surface side, a second wiring layer disposed on a lower surface side of the first wiring layer, and an insulator layer disposed between the first wiring layer and the second wiring layer. A baseband signal-use wiring pattern is provided in the first wiring layer, an RF signal-use wiring pattern is provided in the second wiring layer, and on one surface of the insulator layer, a substantially flat-plate ground electrode pattern is arranged to cover substantially an entire surface. At least a balun is provided in the second wiring layer and defined by the RF signal-use wiring pattern, and when viewed in a top view, at least a portion of the RF signal-use wiring pattern defining the balun is arranged on an upper surface side of the second wiring layer so as to surround a connecting wiring electrically connecting an RF terminal of the IC and a balanced-side terminal of the balun to each other. | 12-29-2011 |
| 20110316353 | POWER TRANSMITTING APPARATUS, POWER RECEIVING APPARATUS, AND WIRELESS POWER TRANSMISSION SYSTEM - A power transmitting apparatus includes a power transmitting apparatus side passive electrode and a power transmitting apparatus side active electrode, and a power receiving apparatus includes a power receiving apparatus side active electrode and a power receiving apparatus side active electrode. The power transmitting apparatus side active electrode and the power transmitting apparatus side passive electrode are not parallel with each other in terms of a positional relationship, and the power receiving apparatus side active electrode and the power receiving apparatus side passive electrode are not parallel with each other in terms of a positional relationship. By mounting the power receiving apparatus on the power transmitting apparatus, the power transmitting apparatus side passive electrode and active electrode respectively face the power receiving apparatus side passive electrode and active electrode. | 12-29-2011 |
| 20110315786 | Atomizing Unit and Atomizer Including the Same - An atomizer that includes an atomizing unit having a piezoelectric vibrator, an elastic film, and a first liquid feeder. The piezoelectric vibrator includes a vibrating film and a piezoelectric body. An atomization region in the center of the vibrating film has through holes. The vibrating film is mounted on the piezoelectric body. The piezoelectric body causes the vibrating film to vibrate. The elastic film is disposed to face the atomization region. The elastic film is directly or indirectly secured to the piezoelectric vibrator. The first liquid feeder is supported by the elastic film so as to face the atomization region of the vibrating film with a gap interposed therebetween. The first liquid feeder feeds a liquid to the atomization region. | 12-29-2011 |
| 20110310527 | DIELECTRIC RESIN COMPOSITION FOR FILM CAPACITOR, METHOD FOR PRODUCING THE SAME, AND FILM CAPACITOR - To increase the heat resistance of a film capacitor, a cured article obtained by curing a mixed solution of a polyvinyl acetal having a hydroxyl group content of 10% to 38% by weight, the number of backbone carbon atoms of the polyvinyl acetal being 100 or more, and a polyisocyanate having an isocyanate content of 1% to 50% by weight is used as a dielectric resin films material arranged between first and second counter electrodes facing each other. At least the polyvinyl acetal is subjected to high-pressure homogenization in which a shearing force is applied such that a pressure applied to the polyvinyl acetal is 50 MPa or more when the material is passed through a path having a diameter of 0.125 mm and a length of 5 mm, so that the solubility is increased to allow a curing reaction to proceed uniformly. The cured article has a glass transition temperature of 130° C. or higher and a breakdown voltage of 350 V/μm or more. | 12-22-2011 |
| 20110309994 | ANTENNA DEVICE AND COMMUNICATION TERMINAL APPARATUS - An antenna device includes an antenna element and an impedance converting circuit connected to the antenna element. The impedance converting circuit is connected to a power-supply end of the antenna element. The impedance converting circuit is interposed between the antenna element and a power-supply circuit. The impedance converting circuit includes a first inductance element connected to the power-supply circuit and a second inductance element coupled to the first inductance element. A first end and a second end of the first inductance element are connected to the power-supply circuit and the antenna, respectively. A first end and a second end of the second inductance element are connected to the antenna element and ground, respectively. | 12-22-2011 |
| 20110309719 | SURFACE ACOUSTIC WAVE ELEMENT AND METHOD OF MANUFACTURING SAME - A surface acoustic wave element has a small energy loss and when it is used in a filter device, suppresses a spurious component occurring near the resonant frequency of a principal response and improves the frequency characteristic near the pass band of the filter device. The surface acoustic wave element includes a piezoelectric substrate, a comb-shaped electrode, and an insulating film. The comb-shaped electrode is disposed on the piezoelectric substrate. The insulating film is disposed so as to cover the piezoelectric substrate and the comb-shaped electrode. Where λ is the wavelength of an elastic wave that propagates in the piezoelectric substrate and h is the difference between the maximum and minimum values of a thickness dimension from the top surface of the piezoelectric substrate to the top surface of the insulating film, 0.01≦h/λ≦0.03 is satisfied. | 12-22-2011 |
| 20110309718 | CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - When an external terminal electrode of a ceramic electronic component such as a laminated ceramic capacitor is formed by plating, plating growth may be also caused even in an undesired location. The ceramic surface provided by a component main body is configured to include a high plating growth region of, for example, a barium titanate based ceramic, which exhibits relatively high plating growth, and a low plating growth region of, for example, a calcium zirconate based ceramic, which exhibits relatively low plating growth. The plating film constituting a first layer to define a base for an external terminal electrode is formed in such a way that the growth of a plated deposit deposited with conductive surfaces provided by exposed ends of internal electrodes as starting points is limited so as not to cross over a boundary between the high plating growth region and the low plating growth region toward the low plating growth region. | 12-22-2011 |
| 20110305060 | WIRING SUBSTRATE IN WHICH EQUAL-LENGTH WIRES ARE FORMED - In a wiring substrate, a double data rate (DDR) memory and a memory controller controlling the DDR memory are mounted. Further, in the wiring substrate, plural equal-length wires connecting the DDR memory and the memory controller are formed. The plural equal-length wires include a differential transmission line, such as a clock wire transmitting a clock signal, which is connected via a common mode choke coil. The differential transmission line may have a wire length shorter than a wire length of another equal-length wire, by a wire length corresponding to delay time of a transmission signal due to the common mode choke coil. | 12-15-2011 |
| 20110305043 | ISOLATED SWITCHING POWER SUPPLY APPARATUS - A control IC including a full-bridge circuit is disposed on a primary side and a secondary side. Bidirectional communication is performed between the primary side and the secondary side in a state in which they are isolated. A control signal output from the primary side or the secondary side earlier is preferentially processed. As a result, the authority to control a switching element can be freely given to a primary-side control IC or a secondary-side control IC, and any control processing can be performed with software. | 12-15-2011 |
| 20110304993 | CIRCUIT MODULE - In a circuit module, a conductive partition is defined by a plurality of conductive chips provided on a component mounting surface. The component mounting surface is divided into a first block and a second block by the conductive partition. The shape of the conductive partition can be freely changed in accordance with the size of a circuit board and the arrangement of electronic components in the first block and the second block by changing the positions of the conductive chips and the number of conductive chips. Electromagnetic interference between the first block and the second block is prevented by the conductive partition. | 12-15-2011 |
| 20110300820 | HIGH-FREQUENCY MODULE - A high-frequency module includes a switch IC. An antenna filter is connected to a common terminal of the switch IC and arranged adjacent to an antenna. The antenna filter is a low-pass filter whose attenuation band includes higher harmonic frequency bands of GSM1800/GSM1900 transmission signals and TDS-CDMA transmission signals. An individual-terminal filter is connected to one individual terminal of the switch IC. The individual-terminal filter is a low-pass filter whose attenuation band includes higher harmonic frequency bands of GSM850/GSM900 transmission signals. | 12-08-2011 |
| 20110300355 | SINTERED BODY OF LOW TEMPERATURE COFIRED CERAMIC AND MULTILAYER CERAMIC SUBSTRATE - In a sintered body of low temperature cofired ceramic constituting ceramic layers of a multilayer ceramic substrate provided with external conductor films, which is obtained by sintering a non-glass low temperature cofired ceramic material, respective crystalline phases of quartz, alumina, and fresnoite are deposited. The ceramic layers are, because of being in the form of a sintered body of non-glass low temperature cofired ceramic, less likely to fluctuate in composition, and the multilayer ceramic substrate can be thus inexpensively and easily manufactured therefrom. In addition, the ceramic layers have the above-mentioned respective crystalline phases deposited therein, and thus have a high joint strength with the external conductor films, and moreover, the sintered body itself has a high fracture toughness value. | 12-08-2011 |
| 20110298683 | CHIP ANTENNA AND ANTENNA DEVICE - This disclosure provides a chip antenna and an antenna device including the chip antenna. The chip antenna is not likely to be affected by a ground electrode located lower than the chip antenna when the chip antenna is mounted on a circuit board, and can have resulting small frequency variation and small reduction in gain. The chip antenna includes a dielectric substrate having a bottom face, a top face, a first side face, a second side face, a third side face, and a fourth side face. A non-feeding electrode extends from the fourth side face to the top face, another non-feeding electrode extends from the third side face to the top face. An end of the non-feeding electrode and an end of the non-feeding electrode face each other on the top face with a certain space therebetween. The bottom face includes bottom-face electrodes electrically connected to the non-feeding electrodes and a bottom-face electrode electrically connected to a feeding electrode. | 12-08-2011 |
| 20110298560 | HIGH-FREQUENCY MODULE - A high-frequency module enabling sufficient attenuation over a wide frequency range outside of a passband includes a triplexer including a combination of an LPF, a BPF, and HPFs arranged to demultiplex a signal input from a common terminal into a first communication signal, a second communication signal, and a third communication signal in different frequency bands, and to output the first, second, and third communication signals from individual terminals. The individual terminals of the triplexer are connected to respective baluns. The baluns are configured such that the respective passbands of the baluns overlap the respective frequency bands of the communication signals and the respective passbands of the triplexer, and the attenuation of the baluns at the attenuation poles of the triplexer is −3 dB or greater. This configuration provides high attenuation in the rebound bands of the attenuation poles. | 12-08-2011 |
| 20110293922 | CONDUCTIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT USING SAME, BONDING METHOD, BONDING STRUCTURE, AND ELECTRONIC COMPONENT - A conductive resin composition which includes (a) a curable resin and (b) hard spherical carbon formed by coating the surface of a spherical base carbon particle with fine carbon particles and/or pitch-derived fine carbon pieces is used to electrically bond two conductive elements. The conductive resin composition is supplied to a space between areas of at least two works respectively having the areas to be electrically connected to each other, and the conductive resin composition is cured while applying a pressure between the areas. | 12-01-2011 |
| 20110293894 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a ceramic body having a substantially rectangular parallelpiped shape. The ceramic body includes a central portion in which first and second internal electrodes are arranged, and first and second end portions in which the first and second internal electrodes are not arranged. The ceramic electronic component satisfies Expressions (1) and (2) below: | 12-01-2011 |
| 20110292691 | ISOLATED SWITCHING POWER SUPPLY APPARATUS - In an ON/OFF type isolated DC-DC converter that stores electromagnetic energy in a main transformer during an ON period of a power switch and releases the electromagnetic energy to an output during an OFF period of the power switch, high-speed, highly stable output voltage control without the need for a photocoupler, for which the allowable temperature range is relatively narrow and the current transfer ratio changes over time, is performed. An integrating circuit including a resistor and a capacitor generates a ramp wave, and the ramp wave is superposed on a reference voltage of a reference voltage source Vref through a capacitor. A comparator compares a voltage Vo that is proportional to an output voltage of a converter with the reference voltage on which the ramp wave has been superposed, and transmits an inversion timing signal through a pulse transformer. During an ON period of a power switch, when the voltage Vo that is proportional to the output voltage exceeds the reference voltage on which the ramp wave has been superposed, the comparator is inverted and the power switch is turned OFF. | 12-01-2011 |
| 20110292686 | CAPACITOR CIRCUIT AND POWER CONVERSION CIRCUIT - A capacitor circuit includes a first capacitor line including a film capacitor and a second capacitor line including a ceramic capacitor that are connected in parallel with each other. The second capacitor line includes an inductance element that is connected in series with the ceramic capacitor. The inductance element is set to a value such that a series resonant frequency of the first capacitor line and a series resonant frequency of the second capacitor line are matched. | 12-01-2011 |
| 20110291784 | ELECTRONIC COMPONENT - An electronic component capable of adjusting the number of turns of a coil without preparing multiple kinds of inner conductors to be positioned at an end of the layer direction is composed of a multilayer body having multiple laminated magnetic layers. A spiral coil includes inner conductors and via-hole conductors connected to each other. Each of the inner conductors has a length of one turn. Both ends of each of the inner conductors are over points A and B. The inner conductor provided at the most negative side in the z-axis direction branches at one end so as to be over the points A and B. | 12-01-2011 |
| 20110290542 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film. | 12-01-2011 |
| 20110287176 | METHOD FOR PRODUCING CERAMIC ELECTRONIC COMPONENT - In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO | 11-24-2011 |
| 20110286151 | METHOD FOR PRODUCTION OF SOLID ELECTROLYTE AND SOLID ELECTROLYTIC CAPACITOR - A method for producing a solid electrolyte is disclosed, which comprises the steps of applying a solution containing a five-membered heterocyclic compound as a polymerizable monomer on a substrate surface, and polymerizing the applied monomer to give a solid electrolyte comprised of an electrically conductive polymer, wherein the monomer-containing solution contains the polymerizable monomer and at least one polymerizable compound selected from a dimer of the monomer and a trimer of the monomer, at a proportion satisfying the equation: | 11-24-2011 |
| 20110286142 | ESD PROTECTION DEVICE AND METHOD FOR PRODUCING THE SAME - An ESD protection device includes an insulating ceramic substrate excluding a glass ceramic substrate, first and second discharge electrodes provided on the insulating ceramic substrate and including respective edges that face each other with a gap therebetween, and a discharge supporting electrode provided on the insulating ceramic substrate so as to electrically connect the first and second discharge electrodes to each other, the discharge supporting electrode including a ceramic material and metal particles whose surfaces are coated with insulating inorganic material powder. A thermosetting resin-cured layer including a cavity is provided on the insulating ceramic substrate so that the portions of the first and second discharge electrodes that face each other with a gap therebetween are present in the cavity. | 11-24-2011 |
| 20110285495 | MULTILAYER INDUCTOR - This disclosure provides a multilayer inductor that has a built-in coil composed of coil conductors each having a length of one turn and that can suppress the occurrence of delamination. The inductor includes plural laminated magnetic layers. Coil conductors loop along a ring-shaped path each through a length of one-turn on the magnetic layers, and include connection portions including end portions that are located on the loop and connection portions including end portions that are located inside the ring-shaped path. Lands are provided on the insulating layers so as to overlap a region as viewed in plan, and the region is surrounded by the first connection portions and the second connection portions. | 11-24-2011 |
| 20110285215 | METHOD FOR MANUFACTURING MODULE WITH PLANAR COIL, AND MODULE WITH PLANAR COIL - A method for manufacturing a module including a planar coil, and a module including a planar coil, reduce manufacturing cost and also are able to handle a large current. The method for manufacturing the module including the planar coil includes the steps of providing a second resin layer including a magnetic filler on a first resin layer with a built-in chip-type electronic component; providing a planar coil on the second resin layer; and providing a third resin layer including a non-magnetic property so as to coat the planar coil. | 11-24-2011 |
| 20110284281 | LAMINATED HIGH-FREQUENCY MODULE - In a laminated high-frequency module, a laminate includes a plurality of dielectric layers. In a lower layer region including some of the plurality of dielectric layers, a digital circuit is provided. In an interlayer region including some of the plurality of dielectric layers, a digital circuit and an analog circuit are arranged so that they do not overlap in plan view of the laminate. In an upper layer region including some of the plurality of dielectric layers, a digital circuit is provided. Digital ICs are mounted on the surface of the uppermost dielectric layer in the upper layer region. An inner-layer ground electrode is provided on substantially an entire boundary surface between the lower layer region and the interlayer region and on substantially an entire boundary surface between the interlayer region and the upper layer region. In the interlayer region, a digital line and an inner-layer ground electrode are alternately arranged in the lamination direction. | 11-24-2011 |
| 20110284270 | LOW-TEMPERATURE SINTERING CERAMIC MATERIAL AND CERAMIC SUBSTRATE - A low-temperature sintering ceramic material showing little variation in composition after firing, realizing high bending strength in a sintered body, and capable of forming a reliable ceramic substrate showing high peel strength of a surface electrode includes a main constituent ceramic material containing about 48 weight % to about 75 weight % in terms of SiO | 11-24-2011 |
| 20110281540 | ANTENNA COMBINING MODULE - In an antenna combining module, coupling of an inductor and individual signal lines provided in a matching circuit is prevented and minimized and isolation of lines from one another and communication performance are improved. The antenna combining module includes a duplexer DUP and a multilayer substrate. The multilayer substrate includes a reception signal line, a transmission signal line, an antenna common line, a matching line and a ground line. A wiring electrode for an inductor is inserted into the matching line from the mounting electrode for grounding up to the position where it combines with the antenna common line. The wiring electrode for the inductor wraps around the outside of a via hole filled with a conductive material of the antenna common line. The ground line is arranged between the wiring electrode for the inductor and the reception signal line, and the transmission signal line. | 11-17-2011 |
| 20110280239 | COMMUNICATION SESSION HAND-OFF METHOD AND COMMUNICATION DEVICE - A communication session hand-off method of a communication device includes establishing a first communication session over a first network between a first communication interface of the communication device and a communication interface of another communication device, monitoring a predetermined condition of the communication device by the communication device, and based upon the predetermined condition, sending a request by the communication device to the another communication device for the another communication device to establish a second communication session over a second network between a second communication interface of the communication device and the communication interface of the another communication device. | 11-17-2011 |
| 20110279945 | ESD PROTECTION DEVICE - An ESD protection device includes a ceramic multilayer substrate including a plurality of laminated insulating layers, an external electrode, at least one of an in-plane connecting conductor and an interlayer connecting conductor, and a mixture portion. The mixture portion is provided along a principal surface of one of the insulating layers and includes a dispersed material including at least one of metal and semiconductor; metal and ceramic; metal, semiconductor, and ceramic; semiconductor and ceramic; semiconductor; metal coated with an inorganic material; metal coated with an inorganic material and semiconductor; metal coated with an inorganic material and ceramic; and metal coated with an inorganic material, semiconductor, and ceramic. The mixture portion is connected to the external electrode and at least one of the in-plane connecting conductor and the interlayer connecting conductor. | 11-17-2011 |
| 20110279349 | CHIP ANTENNA AND ANTENNA APPARATUS - A chip antenna and an antenna apparatus, which allow the resonance frequency of the antenna to be set with a high degree of freedom, include a feeding electrode formed on the bottom surface, fourth side surface, and top surface of a dielectric substrate, a non-feeding electrode formed on the bottom surface, third side surface, and top surface of the dielectric substrate, wherein the leading ends of the feeding electrode and the non-feeding electrode are facing each other with a predetermined distance therebetween on the top surface of the dielectric substrate. The chip antenna and antenna apparatus further include a frequency adjusting electrode formed on the first side surface of the dielectric substrate, and ground electrodes connected to ground electrodes of a circuit substrate on which the chip antenna is mounted, wherein the ground electrodes are electrically connected to the frequency adjusting electrode and are formed on the bottom surface of the dielectric substrate. | 11-17-2011 |
| 20110279340 | ANTENNA AND WIRELESS IC DEVICE - An antenna for a wireless IC device having improved energy transfer efficiency with a wireless IC, and a wireless IC device equipped with the antenna are constructed such that the antenna includes a coil pattern and spiral coupling patterns provided at the ends of the coil pattern and disposed so as to face each other. A coupling module including a wireless IC chip and a feeder circuit substrate including a feeder circuit arranged to be coupled to the wireless IC chip is mounted on the coupling pattern so as to define a wireless IC device. The coil pattern is an open type coil pattern. The coupling patterns are arranged close to each other to define a single LC resonator. Thus, energy is concentrated in the coupling patterns, thereby improving the energy transfer efficiency between the antenna and the wireless IC chip. | 11-17-2011 |
| 20110279326 | WIRELESS IC DEVICE - A wireless IC device includes a substantially rectangular parallelepiped dielectric body, a metal pattern that is provided on the surface of the dielectric body via a film and functions as a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. The dielectric body has a laminated structure including a folded flexible dielectric layer. Surfaces of the dielectric layer which face each other after the dielectric layer has been folded are non-bonded surfaces. | 11-17-2011 |
| 20110279213 | LAMINATED INDUCTOR - This disclosure provides a laminated inductor capable of suppressing concentration of magnetic gap portions, preventing local magnetic saturation, and obtaining excellent DC superposition characteristics. In an embodiment of a laminated inductor, magnetic layers and coil conductors are alternately laminated. The laminated inductor includes plural first mixed layers and plural second mixed layers. Each first mixed layer includes a first nonmagnetic material portion between ones of the conductive patterns overlapping in a lamination direction and a second nonmagnetic material portion that is inside the coil conductor and connected to the first nonmagnetic material portion. Each second mixed layer includes a nonmagnetic material portion between ones of the conductive patterns overlapping in the lamination direction and a nonmagnetic material portion that is outside the coil conductor and is connected to the first nonmagnetic material portion. The plural first mixed layers and the plural second mixed layers are formed as different layers. | 11-17-2011 |
| 20110279194 | DUPLEXER MODULE - In a duplexer module, a transmitting signal is correctly monitored without deteriorating receiving sensitivity. The duplexer module includes a transmission line, a reception line, and an antenna common line, and performs conversion between a transmission signal and a reception signals and antenna common signals. A transmission filter is inserted into the transmission line, and the transmission filter allows the transmission signal to pass therethrough and stops the reception signal. A reception filter is inserted into the reception line, and the reception filter allows the reception signal to pass therethrough and stops the transmission signal. A first line of a coupler which detects the transmitting signal is inserted into the transmission line at a stage subsequent to the transmission filter. | 11-17-2011 |
| 20110279193 | DUPLEXER MODULE - A duplexer module that prevents degradation of isolation between signal lines includes transmission filters, reception filters, phase adjusting circuits, and a multilayer substrate. The transmission filters and the reception filters are constituted as separate discrete components. The multilayer substrate includes filter mount terminals to which the transmission filters are mounted, and filter mount terminals to which the reception filters are mounted. The filter mount terminals are arranged along an upper side of the multilayer substrate, and the filter mount terminals are arranged along a lower side of the multilayer substrate. | 11-17-2011 |
| 20110279177 | DUPLEXER MODULE - A duplexer module prevents a transmission signal and a reception signal in the same band from interfering with each other. The duplexer module includes a transmission line, a reception line, and an antenna common line. In addition, the duplexer module includes a plurality of mounting electrodes arranged along the four sides of an outer edge of a mounting surface of a multilayer substrate. The fourth mounting electrode defining a monitoring port is disposed on a side different from a side on which each of the first mounting electrode defining a transmission port, the second mounting electrode defining a reception port, and the third mounting electrode defining an antenna port is disposed. The fourth mounting electrode defining the monitoring port is a mounting electrode used to output a signal of the monitoring line through which a portion of electrical power is transmitted from the transmission line. | 11-17-2011 |
| 20110278993 | METHOD FOR MANUFACTURING COMPOSITE PIEZOELECTRIC SUBSTRATE AND PIEZOELECTRIC DEVICE - A piezoelectric device is manufactured in which the material of a supporting substrate can be selected from various alternative materials. Ions are implanted into a piezoelectric substrate to form an ion-implanted portion. A temporary supporting substrate is formed on the ion-implanted surface of the piezoelectric substrate. The temporary supporting substrate includes a layer to be etched and a temporary substrate. The piezoelectric substrate is then heated to be divided at the ion-implanted portion to form a piezoelectric thin film. A supporting substrate is then formed on the piezoelectric thin film. The supporting substrate includes a dielectric film and a base substrate. The temporary supporting substrate is made of a material that produces a thermal stress at the interface between the temporary supporting substrate and the piezoelectric thin film less than the thermal stress at the interface between the supporting substrate and the piezoelectric thin film. | 11-17-2011 |
| 20110278951 | NON-CONTACT POWER RECEIVING APPARATUS - The disclosure provides a non-contact power receiving apparatus including a conductive pattern in a second region of a substrate not covered by a magnetic sheet. The conductive pattern includes first and second electrodes provided in a first plane parallel to a surface of the substrate and arranged in a length direction of the conductive pattern. A third electrode is formed on a second plane parallel with the first plane. A first via hole connects superposed portions of the first and third electrodes to each other, and a second via hole connects superposed portions of the second and third electrodes to each other. As a result, loops of eddy currents generated in the conductive pattern can be made to be small, whereby eddy current loss can be reduced. | 11-17-2011 |
| 20110278362 | WIRELESS IC DEVICE - A wireless IC device includes a dielectric body, a metal pattern that is provided on a surface of the dielectric body and that defines a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. A plurality of slits are provided on at least one surface of the dielectric body so as to provide flexibility for the dielectric body. | 11-17-2011 |
| 20110277928 | METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE - A method for manufacturing a composite substrate that prevents undesirable effects of etching a thin film includes a pattern forming step, an ion implanting step, a bonding step, and a separation step. In the pattern forming step, a pattern region and a reverse pattern region are formed on a principal surface of a functional material substrate. In the ion implanting step, by implanting ions into the functional material substrate, a separation layer is formed inside at a certain distance from the surface of each of the pattern region and the reverse pattern region. In the bonding step, the functional material substrate at the pattern region is bonded to a supporting substrate. In the separation step, the pattern region is separated from the functional material substrate, and the reverse pattern region is made to fall off. | 11-17-2011 |
| 20110273815 | ELECTRONIC COMPONENT - In an electronic component, a first capacitor conductor includes a first exposed portion exposed between insulating layers at a surface of a laminate including a first shorter side and two longer sides. A second capacitor conductor includes a second exposed portion exposed between the insulating layers at a surface of the laminate including a second shorter side and the two longer sides. First and second external electrodes are arranged on the laminate so as to cover the first and the second exposed portions, respectively. A first width of the first capacitor conductor in a region located between the second shorter side and a first straight line obtained by connecting two edges of the second external electrode is greater than a width of the first capacitor conductor in a region located between the first straight line and a straight line obtained by connecting two edges of the first external electrode. | 11-10-2011 |
| 20110273056 | METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT AND CERAMIC ELECTRONIC COMPONENT - A method for manufacturing a ceramic electronic component capable of preventing degradation of the self alignment property and product characteristics due to absorption of flux into pores of a ceramic element assembly during soldering in mounting and a ceramic electronic component. In the method, a ceramic element assembly is subjected to an oil-repellent treatment by using an oil-repellent agent containing a polyfluoropolyether compound as a primary component and hydrofluoroether as a solvent, so as to avoid absorption of the flux by the ceramic element assembly. | 11-10-2011 |
| 20110268977 | ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING THE SAME - In a method for producing an electronic component device, a heat bonding step is performed in a state in which low melting point metal layers including low melting point metals including, for example, Sn as the main component, are arranged to sandwich, in the thickness direction, a high melting point metal layer including a high melting point metal including, for example, Cu as the main component, which is the same or substantially the same as high melting point metals defining first and second conductor films to be bonded. In order to generate an intermetallic compound of the high melting point metal and the low melting point metal, the distance in which the high melting point metal is to be diffused in each of the low melting point metal layers is reduced. Thus, the time required for the diffusion is reduced, and the time required for the bonding is reduced. | 11-03-2011 |
| 20110267736 | ELECTRONIC COMPONENT - A laminate includes insulating layers laminated to each other. Capacitor conductors are embedded in the laminate and have exposed portions exposed between the insulating layers at respective surfaces of the laminate. The capacitor conductors define a capacitor. External electrodes are provided by plating on the respective surfaces of the laminate so as to directly cover the respective exposed portions. When the laminate is viewed in plan in a y axis direction, the length of each of the exposed portions is approximately 35% to approximately 45% of the length of an outer periphery of the insulating layer. | 11-03-2011 |
| 20110267166 | ELECTRONIC COMPONENT AND METHOD FOR MAKING THE SAME - An electronic component that reduces resistance and prevents occurrence of an edge effect, includes a laminated body formed by stacking insulator layers. Conductor layers are linear conductors, and define coils included in the laminated body. The conductor layers face each other, with the insulator layer interposed therebetween, and allow signals of substantially the same phase to pass therethrough. The conductor layers define regions, each having a shape which decreases in thickness in the z-axis direction with increasing distance from a center thereof in a line width direction. | 11-03-2011 |
| 20110266918 | PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - A piezoelectric device includes IDT electrodes and solves various problems resulting from the IDT electrodes. The piezoelectric device has a configuration in which a piezoelectric thin-film and a support are bonded together such that the piezoelectric thin-film is supported by the support. IDT electrodes and interconnect electrodes are provided on a surface of the piezoelectric thin-film that is located on the support side. The piezoelectric thin-film includes a region in which the IDT electrodes are provided and on which no support is provided but an opening is formed. This allows the IDT electrodes and the piezoelectric thin-film and the IDT electrode-formed region of the piezoelectric thin-film to not be in contact with the support, thereby defining a membrane including only the piezoelectric thin-film and the IDT electrodes as elements, the piezoelectric thin-film and the IDT electrodes being disposed therein and being important for properties of the piezoelectric device. | 11-03-2011 |
| 20110266036 | LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME - A laminate type ceramic electronic component includes a thick film resistor and an overcoat layer so as to prevent defects such as delamination from being caused and to prevent the thick film resistor from being cracked after laser trimming, even when a method is adopted in which an unfired composite laminate is subjected to firing in such a way that an unfired ceramic laminate, an unfired thick film resistor, and an unfired overcoat layer are each integrally sintered. The unfired overcoat layer includes a glass ceramic material containing a ceramic and glass having substantially the same constituents and compositional ratio as those of the glass contained in the unfired ceramic layer. The respective glass ceramic materials constituting the unfired ceramic layer and the unfired overcoat layer are adjusted so that the ratio of a crystalline phase with a smaller coefficient of thermal expansion than the coefficient of thermal expansion of the fired ceramic layer is higher in the overcoat layer than in the ceramic layer. | 11-03-2011 |
| 20110265948 | VIA HOLE FORMING METHOD USING ELECTROPHOTOGRAPHIC PRINTING METHOD - A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method. | 11-03-2011 |
| 20110265929 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT - A triaxial acceleration sensor which has a structure including a cover joined to a substrate including a mechanically operable functional unit to be sealed, is adapted in such a way that the joined state can be reliably obtained so as to not interfere with a displacement of the functional unit. A sealing frame is made of a heated polyimide on a periphery of an upper main surface of a substrate provided with a functional unit, and a sealing layer made of a polyimide is formed over an entire lower main surface of a cover. For integrating the substrate and the cover so as to seal the functional unit, the sealing frame and the sealing layer are joined to each other by heating and pressurizing the sealing frame and the sealing layer at a temperature that is about 50° C. to about 150° C. higher than a glass transition temperature of the polyimide while bringing the sealing frame and the sealing layer into contact with each other. In this case, a recess is formed in the vicinity of a portion of the sealing layer to be brought into contact with the sealing frame so that a bump, generated from the sealing layer which is deformed in the joining step, is prevented from protruding toward the functional unit. | 11-03-2011 |
| 20110256309 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a monolithic ceramic electronic component includes a plating substep of depositing precipitates primarily composed of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated layer, wherein the specific metal is different from that of the internal electrodes, and the same or substantially the same metal that defines the internal electrodes is distributed throughout the plated layer. | 10-20-2011 |
| 20110255209 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a ceramic element including opposed side surfaces, an inner electrode, and an external terminal electrode. The external terminal electrode includes a first conductive layer and a second conductive layer. The first conductive layer is formed by plating so as to be electrically coupled to an exposed section of the internal electrode exposed to the side surfaces. The second conductive layer is arranged so as to cover the first conductive layer and includes conductive resin. The value of T | 10-20-2011 |
| 20110254752 | RADIO FREQUENCY IC DEVICE - A radio frequency IC device includes a radio frequency IC chip, a feeder circuit substrate, and a radiating plate. The feeder circuit substrate includes a feeder circuit that electrically connects to the radio IC chip and that includes a resonance circuit and/or a matching circuit including inductance elements. The feeder circuit substrate is bonded to the radiating plate, which radiates a transmission signal supplied from the feeder circuit and supplies a received signal to the feeder circuit. The inductance elements are arranged in spiral patterns wound in opposite directions and couple to each other in opposite phases. The radio frequency IC device is able to obtain a radio frequency IC device that is not susceptible to being affected by a usage environment, minimizes variations in radiation characteristics, and can be used in a wide frequency band. | 10-20-2011 |
| 20110254650 | ELECTRONIC COMPONENT - In an electronic component having a built-in coil composed of coil conductors with a length of one turn, the inductance value can be increased while suppressing generation of short circuits inside the coil conductors. The electronic component includes a multilayer body formed by stacking a plurality of magnetic layers on top of one another. The built-in coil includes coil conductors and via hole conductors. The coil conductors each have a ring-shaped coil portion having a cut out portion in one side of one corner thereof, and a connecting portion that form an obtuse angle with a side extending from one end portion of the coil portion and is positioned in a region enclosed or surrounded by the coil portion. Via hole conductors connect the plurality of coil conductors to one another. | 10-20-2011 |
| 20110254406 | BOUNDARY ACOUSTIC WAVE DEVICE - A boundary acoustic wave device that has a three-medium structure and that prevents a high-order mode spurious response includes a piezoelectric substrate, a first dielectric layer laminated on the piezoelectric substrate, a second dielectric layer laminated on the first dielectric layer, and an IDT electrode provided at an interface between the piezoelectric substrate and the first dielectric layer. The boundary acoustic wave device utilizes a Stoneley wave that propagates along the interface. Where V | 10-20-2011 |
| 20110253795 | WIRELESS IC DEVICE, WIRELESS IC MODULE AND METHOD OF MANUFACTURING WIRELESS IC MODULE - A wireless IC module that can function as a component of an RFID system even when mounted on a metal article includes a loop-shaped electrode that is constructed such that a plane of a loop of the loop-shaped electrode is substantially perpendicular to the mounting surface of a wireless IC module. The loop-shaped electrode functions as a magnetic field antenna and is electromagnetically coupled with a metal article so that the surface of the metal article functions as a radiator antenna. | 10-20-2011 |
| 20110252629 | METHOD FOR PRODUCING CERAMIC BODY - Provided is a method for producing a ceramic body, which is capable of preventing the ingress of moisture into a void between a conductor and the ceramic body more effectively in the ceramic body including the conductor therein. Ingress of a supercritical fluid containing an oxide sol precursor is achieved into a void between an internal electrode layer and a ceramic laminate. After that, the oxide sol is turned into a gel, and subjected to a heat treatment, thereby filling the void between the internal electrode layer and the ceramic laminate with an oxide. | 10-20-2011 |
| 20110249416 | CIRCUIT MODULE - In a circuit module, a chip element is mounted on a mount electrode, with an outer electrode interposed therebetween. The chip element is arranged such that a cut surface thereof is oriented toward a side of a circuit module that is adjacent to the mount electrode. A gap that is observable from outside of the circuit module is provided between a bottom surface of a base of the chip element and a top surface of a circuit board. | 10-13-2011 |
| 20110248810 | WIRE-WOUND COIL - The disclosure provides a wire-wound coil that can prevent contact between an outer flange portion of the wire-wound coil and a mount board so as to prevent breakage of the outer flange portion and misalignment and unwinding of a wound conductive wire. A groove is provided in an outer side face of a flange at an end of a winding core, and an inner flange portion and an outer flange portion are provided on opposite sides of the groove. A distance from a bottom face of the groove to at least an outer side face of the outer flange portion that would be facing a mount board or is attached to a mount board is shorter than a distance from the bottom face of the groove to the inner flange portion. | 10-13-2011 |
| 20110243162 | INFRARED RAY TRANSMISSIVE OPTICAL MEMBER AND MANUFACTURING METHOD THEREOF, OPTICAL DEVICE, AND OPTICAL APPARATUS - An optical member made of polycrystalline silicon formed from high-purity trichlorosilane as a raw material, and that absorbs and scatters an infrared ray in a wavelength region of 4 μm or less. In the optical member, a ratio A/B between a transmittance A of an infrared ray having a wavelength of 4 μm and a transmittance B of an infrared ray having a wavelength of 10 μm is 0.9 or less, and an average crystal grain size of the polycrystalline silicon is 5 μm or less. This polycrystalline silicon is produced by hydrogen reducing SiHCI | 10-06-2011 |
| 20110241958 | ANTENNA COIL TO BE MOUNTED ON A CIRCUIT BOARD AND ANTENNA DEVICE - In an antenna coil including a first magnetic core, a second magnetic core, and a flexible board, coil conductors are provided on a surface of the flexible board. By winding the flexible board around the first magnetic core and the second magnetic core, a first coil portion is disposed around the first magnetic core, and a second coil portion is disposed around the second magnetic core. The winding direction of the second coil portion is opposite to that of the first coil portion. The first coil portion and the second coil portion are connected to define one coil as a whole. | 10-06-2011 |
| 20110241804 | HIGH-FREQUENCY COUPLER AND COMMUNICATION DEVICE - A high-frequency coupler and a communication device are compact, capable of efficiently communicating a large volume of data over a short distance and can be used in combination with a non-contact IC card. The high-frequency coupler includes magnetic-field-generating patterns and a surrounding pattern disposed around a periphery thereof, and is used to communicate a large volume of data over a short distance in a communication system that uses broadband frequencies. Out of the magnetic fields radiated in directions perpendicular or substantially perpendicular to the plane of the patterns from the magnetic-field-generating patterns, portions extending laterally in the plane of the patterns are blocked by the surrounding pattern, the magnetic fields are lengthened in a direction perpendicular or substantially perpendicular to the plane of the patterns and the communication distance is increased. | 10-06-2011 |
| 20110241481 | SURFACE ACOUSTIC WAVE DEVICE - A surface acoustic wave device has a large electromechanical coupling coefficient, a low insertion loss, and high resistance to static electricity. In the surface acoustic wave device, a piezoelectric substance includes a plurality of grooves. Each electrode finger of an IDT electrode includes a first electrode layer disposed in the grooves and a second electrode layer disposed on the first electrode layer and located at a position higher than the upper opening of the grooves. In a surface acoustic wave device, the one-half power of the product of the cube of the average density (ρ | 10-06-2011 |
| 20110239457 | CIRCUIT MODULES AND METHOD OF MANAGING THE SAME - Circuit modules including identification codes and a method of managing them are provided. A module substrate includes signal input output terminals and outer ground terminals provided at the peripheral portions of a surface which becomes a mounting surface when the circuit module is completed. An inner-ground-terminal formation area surrounded by the signal input output terminals and the outer ground terminals includes a plurality of inner ground terminals arranged in a matrix of rows and columns. One of the edge portions is a direction identification area. The inner ground terminal is not provided in the direction identification area, and a first identification code having information about the position of the module substrate is provided in the direction identification area. | 10-06-2011 |
| 20110236658 | LAMINATED ELECTRONIC COMPONENT - A laminated electronic component includes a first plating film that defines a base for external terminal electrodes and that includes a plurality of layers including a first layer made of, for example, copper and a second layer provided on the first layer. The total thickness of the first plating film is about 3 μm to about 15 μm, and the thickness of the second layer is about 2 to 10 times as thick as the thickness of the first layer. The first layer is formed by electroless plating, and the second layer is formed by electrolytic plating. This formation results in a grain size of about 0.5 μm or more of a metal grain included in the second layer, and thus makes the film less susceptible to oxidation. | 09-29-2011 |
| 20110235278 | CIRCUIT MODULE - A circuit module includes a plurality of electronic components including at least one heat-generating electronic component and constituting an electric circuit are spaced from each other on a circuit board. Regions of one or both sides of the circuit board, including regions around the plurality of electronic components, are covered with a heat-dissipating member. A surface of the heat-dissipating member facing the circuit board includes irregularities. An end surface of a protrusion in the facing surface of the heat-dissipating member is in contact with a circuit board surface between the electronic components, directly or with a heat-dissipating sheet interposed therebetween. A wall surface of a recess in the facing surface of the heat-dissipating member is in surface-contact with the heat-generating electronic component within the recess, directly or with the heat-dissipating sheet interposed therebetween. Thus, heat from the heat-generating electronic component and heat from the circuit board heated by the heat from the heat-generating electronic component are dissipated outside through the heat-dissipating member. | 09-29-2011 |
| 20110235236 | DIELECTRIC CERAMIC COMPOSITION AND MONOLITHIC CERAMIC CAPACITOR - Provided are a dielectric ceramic composition suitable for use in a monolithic ceramic capacitor that is employed in high-temperature environments such cars, and a monolithic ceramic capacitor constituted by using the dielectric ceramic composition. The dielectric ceramic composition has a composition formula of 100(Ba | 09-29-2011 |
| 20110235235 | DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR - A dielectric ceramic capacitor that has excellent reliability and particularly excellent life characteristics in a load test even when the thickness of a dielectric ceramic layer is reduced uses a dielectric ceramic as a dielectric ceramic layer in a laminated ceramic capacitor which is a substance containing, as the main component, (Ba, R)(Ti, V)O | 09-29-2011 |
| 20110235234 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A laminate includes ceramic layers laminated to each other. Internal conductors are embedded in the laminate and include exposed portions that are exposed between the ceramic layers at a lower surface and an upper surface of the laminate. External electrodes are directly plated on the lower surface and the upper surface so as to cover the respective exposed portions. Regions of the lower surface at which the exposed portions are provided are arranged to protrude from the other regions of the lower surface, and regions of the upper surface at which the exposed portions are provided are arranged to protrude from the other regions of the upper surface. | 09-29-2011 |
| 20110235232 | ELECTRONIC COMPONENT - An electronic component includes a laminate including a plurality of insulating layers that are laminated on each other. A capacitor conductor is embedded in the laminate and includes an exposed portion exposed between the insulating layers at a predetermined surface of the laminate. An external electrode is provided on the predetermined surface by direct plating so as to cover the exposed portion. An outer edge of the external electrode is spaced away from the exposed portion by about 0.8 μm or more. | 09-29-2011 |
| 20110234364 | SEMICONDUCTOR CERAMIC AND POSITIVE TEMPERATURE COEFFICIENT THERMISTOR - A semiconductor ceramic includes a Ba | 09-29-2011 |
| 20110234332 | CIRCUIT MODULE - In a circuit module, a core isolator includes a ferrite and a permanent magnet that is arranged to apply a direct-current field to the ferrite. A switch outputs to a signal path a high-frequency signal outputted from the core isolator. A SAW filter is provided on the signal path. A matching circuit is provided on the signal path and provides impedance matching between the output impedance of the core isolator and the input impedance of the SAW filter. | 09-29-2011 |
| 20110234295 | HIGH-FREQUENCY SWITCH MODULE - A high-frequency switch module includes a switch IC. An impedance matching circuit is connected to the antenna port of the switch IC. The impedance matching circuit includes a high-pass filter and a low-pass filter. The high-pass filter is disposed on the side of the antenna port, and is a substantially L-shaped circuit including a capacitor and an inductor. The antenna port is connected to the ground by the inductor. | 09-29-2011 |
| 20110234045 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer. | 09-29-2011 |
| 20110229356 | FLUID CONVEYANCE DEVICE - A fluid conveyance device includes a substrate, and a disk-shaped piezoelectric element arranged in a bendable manner on the substrate. A plurality of substantially circular concentric segment electrodes are provided on the piezoelectric element, and are provided with voltages with phases that are shifted. A wavy ring deformation is thus produced on the piezoelectric element. A pocket produced between the piezoelectric element and the substrate is moved in a radial direction so as to convey a fluid from an outer substantially circular portion to a central portion and to discharge the fluid from the central portion. | 09-22-2011 |
