MURATA ELECTRONICS OY Patent applications |
Patent application number | Title | Published |
20140339963 | MICROELECTROMECHANICAL RESONATOR - A method for manufacturing microelectromechanical flexural resonators with a deforming element that has an elongate body extending along a spring axis. A deforming element is positioned on the semiconductor wafer with a defined nominal n-type doping concentration such that a crystal orientation angle is formed between the spring axis of the deforming element and a crystal axis of the silicon semiconductor wafer. The combination of the crystal orientation angle and the nominal n-type doping concentration is adjusted to a specific range, based on total frequency error of the deforming element in a broad temperature range. The combination is optimized to a range where also sensitivity to variations in the material properties is minimized. | 11-20-2014 |
20140217615 | METHOD OF MAKING A SYSTEM-IN-PACKAGE DEVICE, AND A SYSTEM-IN-PACKAGE DEVICE - A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer. | 08-07-2014 |
20130229089 | POWER COLLECTOR STRUCTURE AND METHOD - A power collector structure connected to a base is repetitively deformed or bent. The power collector structure is bar-like, and is connected to the base in an essentially rigid manner. A power collector for converting mechanical energy to electric power is connected to the power collector structure. | 09-05-2013 |
20130192371 | ACCELERATOR SENSOR STRUCTURE AND USE THEREOF - A MEMS-sensor structure comprising first means and second means coupled for double differential detection and positioned symmetrically to provide quantities for the double differential detection in a phase shift. If the sensor deforms, due to a specifically symmetric positioning of the first and second means, the effect of the displacement is at least partly eliminated. | 08-01-2013 |
20130192362 | VIBRATION TOLERANT ACCELERATION SENSOR STRUCTURE - A MEMS structure comprises an anchor, a spring, and a seismic mass that is suspended to the anchor via the spring to pivot around an axis of rotation. Errors from unwanted vibration modes are reduced by including in the MEMS structure a spring structure that extends from the seismic mass to the anchor. Said spring structure comprises a side arm that is connected to the seismic mass or the anchor. At least part of the spring structure is formed by a side arm that extends in the spring structure in a direction parallel to the axis of rotation of the seismic mass; and is attached to one end of the spring. | 08-01-2013 |