| MULTI-FINELINE ELECTRONIX, INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20100146782 | MINIATURE CIRCUITRY AND INDUCTIVE COMPONENTS AND METHODS FOR MANUFACTURING SAME - Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer. | 06-17-2010 |
| 20100127814 | MINIATURE CIRCUITRY AND INDUCTIVE COMPONENTS AND METHODS FOR MANUFACTURING SAME - Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer. | 05-27-2010 |
| 20100071935 | SHIELDED FLEXIBLE CIRCUITS AND METHODS FOR MANUFACTURING SAME - A shielded flexible cable having a plurality of shielded electronic circuits in close proximity to one another such that signals transmitted on one of said plurality of shielded electronic circuits do not substantially interfere with signals transmitted on the other of said plurality of electronic circuits comprising a polyimide support member supporting a plurality of etched copper traces on a first side of said polyimide support member and a copper layer on a second side of said polyimide support member. Said polyimide support member is flexible along at least one axis, and said plurality of etched copper traces and said copper layer substantially as flexible as said polyimide support member. | 03-25-2010 |
| 20100011568 | METHOD OF MAKING SLOTTED CORE INDUCTORS AND TRANSFORMERS - Slot core inductors and transformers and methods for manufacturing same including using large scale flex circuitry manufacturing methods and machinery for providing two mating halves of a transformer winding. One winding is inserted into the slot of a slot core and one winding is located proximate to the exterior wall of the slot core. These respective halves are joined together using solder pads or the like to form continuous windings through the slot and around the slotted core. | 01-21-2010 |
| 20080202807 | SHIELDED FLEXIBLE CIRCUITS AND METHODS FOR MANUFACTURING SAME - A shielded flexible cable having a plurality of shielded electronic circuits in close proximity to one another such that signals transmitted on one of said plurality of shielded electronic circuits do not substantially interfere with signals transmitted on the other of said plurality of electronic circuits comprising a polyimide support member supporting a plurality of etched copper traces on a first side of said polyimide support member and a copper layer on a second side of said polyimide support member; said polyimide support member flexible along at least one axis; said plurality of etched copper traces and said copper layer substantially as flexible as said polyimide support member; a silver based material, including, for example, silver ink or silver film, surrounding a portion of each of said plurality of copper traces along substantially the entire length of each of said plurality of copper traces; said silver based material in electrical communication with (i) said copper layer via discontinuities in said polyimide support member, and (ii) a grounded terminal; an electrically insulative material in substantial proximity to each of said plurality of copper traces so as to electrically insulate each of said plurality of copper traces from (i) the other said plurality of copper traces, and (ii) said silver based material; said electrically insulative material physically located between said silver based material and each of said plurality of copper traces; a first dielectric layer covering substantially the entire exposed surface of said silver based material; and a second dielectric layer covering substantially the entire exposed surface of said copper layer. | 08-28-2008 |
