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Morimoto Mfg. Co., Ltd.
Osaka, JP
| Morimoto Mfg. Co., Ltd. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20100029454 | Method and apparatus for bonding a sheet for a corrugated cardboard box - A bonding apparatus according to the present invention relates to a sewing machine ( | 02-04-2010 |