Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees

MonolithlC 3D Inc.

MonolithlC 3D Inc. Patent applications
Patent application number	Title	Published
20120088367	SEMICONDUCTOR DEVICE AND STRUCTURE - A method of manufacturing a semiconductor wafer, the method comprising: providing a base wafer comprising a semiconductor substrate; preparing a first monocrystalline layer comprising semiconductor regions; preparing a second monocrystalline layer comprising semiconductor regions overlying the first monocrystalline layer; and etching portions of said first monocrystalline layer and portions of said second monocrystalline layer as part of forming at least one transistor on said first monocrystalline layer.	04-12-2012
20120032294	METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE - A semiconductor device comprising: a first single crystal silicon layer comprising first transistors, first alignment mark, and at least one metal layer overlying said first single crystal silicon layer, wherein said at least one metal layer comprises copper or aluminum more than other materials; a second layer overlying said at least one metal layer, said second layer comprising second transistors, second alignment mark, and a through via through said second layer, wherein said through via is a part of a connection path between said first transistors and said second transistors, wherein alignment of said through via is based on said first alignment mark and said second alignment mark and effected by a distance between said first alignment mark and said second alignment mark.	02-09-2012