| Mitsui Mining & Smelting Co., Ltd. Patent applications |
| Patent application number | Title | Published |
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| 20120085979 | TIN OXIDE PARTICLES AND PROCESS FOR PRODUCING THE SAME - A tin oxide particle having at least two diffraction peaks at 2θ (deg) of 9±1° and 28±1° in XRD measurement by Cu/Kα radiation. The tin oxide particle preferably shows diffraction peaks at 2θ (deg) of 19±1°, 48±1°, and 59±1°. The tin oxide particle preferably has electroconductivity. The tin oxide particle is preferably produced by mixing an aqueous solution containing tin (II) and a hydroxyl-containing organic compound in a heated condition with an alkali. | 04-12-2012 |
| 20120081001 | Green Emitting Phosphor - A green emitting phosphor is provided, allowing the internal quantum efficiency to be increased. The green emitting phosphor comprises a mother crystal containing Sr, Ga and S, and a luminescent center, characterized in that, in an XRD pattern, the ratio of the diffraction intensity of the maximum peak appearing at diffraction angle 2θ=14 to 20° over the diffraction intensity of the maximum peak appearing at diffraction angle 2θ=21 to 27° is 0.4 or greater. | 04-05-2012 |
| 20120018674 | Emitting Phosphor - An emitting phosphor is provided, which can be excited by a blue LED or a near-UV LED, emit visible light and increase internal quantum efficiency. An emitting phosphor is proposed, comprising an orthorhombic crystal system comprising Ga and S, wherein the orthorhombic crystal system has, in an XRD pattern using a Cu Kα beam, a proportion of the diffraction intensity of the maximum peak appearing at diffraction angle 2θ=16.0 to 18.0° with respect to the diffraction intensity of the maximum peak appearing at diffraction angle 2θ=23.6 to 24.8° of 0.4 or greater. | 01-26-2012 |
| 20120012776 | Positive Electrode Active Material for Lithium Battery - With the object of providing a positive electrode active material for lithium battery that can increase the filling density, can increase the output characteristics, and furthermore, with a small voltage decrease during conservation at high temperature in a charged state, a positive electrode active material for lithium battery is proposed, containing a spinel type (Fd3-m) lithium transition metal oxide represented by general formula Li | 01-19-2012 |
| 20110318600 | POROUS METAL FOIL AND PRODUCTION METHOD THEREFOR - A porous metal foil of the present invention comprises a two-dimensional network structure composed of metal fibers. This porous metal foil has superior properties and can be obtained in a highly productive and cost effective manner. | 12-29-2011 |
| 20110309349 | ANODE STRUCTURE FOR USE IN ORGANIC EL DEVICE, PRODUCTION METHOD THEREOF AND ORGANIC EL DEVICE - The present invention relates to an anode structure for use in a top-emission type organic EL device which comprises a laminated structure comprising an anode layer made of at least one selected from the group consisting of aluminum, aluminum alloys, silver and silver alloys; and a buffer layer directly provided on the anode layer and made of an electrically conductive amorphous carbon having a hydrogen concentration of 15 at. % or less. According to the present invention, there is provided an anode structure which is superior in alkali resistance and can lengthen lifetime of an organic EL device as well as can ensure a high work function suitable for an anode for a high-luminance, high-power-efficient organic EL device. | 12-22-2011 |
| 20110272768 | Lead Frame and Method of Producing Lead Frame - Provided is a lead frame, an electronic device provided with a lead frame, a method of producing a lead frame, and a method of producing an electronic device provided with a lead frame that has been produced by the method of producing a lead frame, in which a lead frame is not corroded, a mechanical strength of the lead frame is not lowered, it is not necessary to carry out the conventional plating processing steps composed of two stages, the processes are simple, a cost is lower, and a large amount of waste liquid such as plating processing liquid is not generated, thereby preventing an environment from being affected. The lead frame includes an outer lead part and an inner lead part, and plating is carried out on at least a part of one or both of the outer lead part or the inner lead part. | 11-10-2011 |
| 20110253940 | Green Emitting Phosphor - A green emitting phosphor exhibiting an excellent absorption ratio is provided. A green emitting phosphor containing crystal represented by MGa | 10-20-2011 |
| 20110253926 | Sputtering Target and Method of Forming Film - Provided is a sputtering target including (Co and Pt) or (Co, Cr, and Pt); SiO | 10-20-2011 |
| 20110189503 | SURFACE-TREATED COPPER FOIL - Object is to provide a surface-treated copper foil free from chromium in the surface-treatment layer and excellent in peel strength of a circuit and chemical resistance against to degradation of the peel strength after processing into a printed wiring board. To achieve the object, the surface-treated copper foil having a surface-treatment layer on a bonding surface of a copper foil for manufacturing a copper-clad laminate by laminating it to an insulating resin substrate has the surface-treatment layer formed by depositing a metal component having high melting point not lower than 1400° C. by dry process film formation method to the bonding surface of the copper foil after the cleaning treatment and further depositing a carbon component to the surface. | 08-04-2011 |
| 20110158845 | Al-Ni ALLOY WIRING ELECTRODE MATERIAL - To provide an Al—Ni alloy wiring electrode material, which has flexibility suitable for organic EL, can be directly bonded to a transparent electrode layer of ITO or the like, and is excellent in corrosion resistance against developers. An Al—Ni alloy wiring electrode material containing aluminum, nickel and boron, wherein the material contains a total of 0.35 at % to 1.2 at % of nickel and boron with the balance being aluminum. It is also preferred that the Al—Ni alloy wiring electrode material contain 0.3 at % to 0.7 at % of nickel and 0.05 at % to 0.5 at % of boron. | 06-30-2011 |
| 20110127074 | METHOD FOR ROUGHENING TREATMENT OF COPPER FOIL AND COPPER FOIL FOR PRINTED WIRING BOARDS OBTAINED USING THE METHOD FOR ROUGHENING TREATMENT - An object of the present invention is to provide a technology for forming a roughened surface of a copper foil which is laminated with an insulating resin substrate having a low dielectric constant, on which a fine-pitch wiring can be formed. To achieve the object, a method for roughening a surface of copper foil to be laminated with an insulating resin substrate characterized by depositing and forming of fine copper particles on the surface of copper foil, under conditions for burnt copper plating, using a sulfuric acid-based copper plating solution containing a quaternary ammonium salt polymer, is employed as a method for roughening treatment of a copper foil. Preferably, a solution temperature of the sulfuric acid-based copper plating solution of 20° C. to 40° C. and electrolysis is carried out with an average anode current density of 5 A/dm | 06-02-2011 |
| 20110114985 | Green Emitting Phosphor - A green emitting phosphor is provided, allowing the internal quantum efficiency to be increased. | 05-19-2011 |
| 20110095239 | COPPER POWDER FOR CONDUCTIVE PASTE AND CONDUCTIVE PASTE - Copper powder is provided, which, while having fine granularity and resistance to oxidation, does not lose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.05 to 10 atomic % Bi inside each particle. | 04-28-2011 |
| 20110094339 | FLUORINE ADSORBENT/DESORBENT APPLICABLE IN ELECTROLYTIC SOLUTION FOR ZINC ELECTRO-REFINING AND METHOD FOR REMOVING FLUORINE USING THE FLUORINE ADSORBENT/DESORBENT - In order to remove fluorine from a zinc containing solution before zinc electro-refining in lower cost, fluorine is removed by adsorption from a zinc containing solution (leached solution) utilizing the character of the predetermined iron compound or zinc compound which can adsorb fluorine in an acid solution and desorb fluorine in an alkaline solution. The fluorine adsorbent/desorbent having adsorbed fluorine is treated in an alkaline solution, to desorb the fluorine. This makes it possible to regenerate the fluorine adsorbent/desorbent. Further, an electrolytic solution for zinc electro-refining can be prepared in lower cost, thus total zinc refining costs can be reduced. | 04-28-2011 |
| 20110086757 | DEOXIDIZER - A deoxidizer includes a porous body of fluorite-type cerium oxide represented by CeO | 04-14-2011 |
| 20110076202 | PARTICULATE COMBUSTION CATALYST, PARTICULATE FILTER AND EXHAUST GAS PURIFYING APPARATUS - Provided is a particulate combustion catalyst including a carrier formed of monoclinic zirconium oxide particles, and metallic Ag or Ag oxide, which serves as a catalyst component and is supported on the carrier, wherein the amount of the catalyst component is 0.5 to 10 mass %, as reduced to metallic Ag, on the basis of the mass of the carrier, and preferably, the catalyst has a BET specific surface area of 8 to 21 m | 03-31-2011 |
| 20110065568 | CATALYST FOR PURIFYING NITROGEN OXIDE - A nitrogen-oxide-removing catalyst includes β zeolite bearing a rare earth metal oxide, and titanium dioxide bearing a rare earth metal oxide; includes β-zeolite bearing a rare earth metal oxide and iron oxide or iron hydroxide, and titanium dioxide bearing a rare earth metal oxide and iron oxide or iron hydroxide; or includes a carrier made of a ceramic or metallic material, and a layer of the nitrogen-oxide-removing catalyst supported on the carrier. | 03-17-2011 |
| 20110031448 | Copper Powder for Conductive Paste and Conductive Paste - Copper powder is provided, which, while having fine granularity, does not loose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.07 to 10 atomic % Al inside each copper particle in the powder. | 02-10-2011 |
| 20110030354 | PARTICULATE COMBUSTION CATALYST, PARTICULATE FILTER AND EXHAUST GAS PURIFYING APPARATUS - Provided is a particulate combustion catalyst including a carrier formed of Zr oxide, a carrier formed of a Zr—Ce composite oxide, or a carrier formed of a composite oxide containing Zr, Ce, and at least one metal selected from among Nd, La, Fe, Y, Pr, Ba, Ca, Mg, Sn, and Sr; an oxide of at least one metal selected from the group consisting of Ba, Ca, Mg, and Sr, the metal oxide being supported on the carrier in an amount, as reduced to metal, of 0.5 to 30 mass % with respect to the carrier; and metallic Ag or Ag oxide, which serves as a catalyst component and is supported on the carrier. Also provided are a particulate filter coated with the catalyst; and an exhaust gas cleaning apparatus including a particulate filter coated with the catalyst. | 02-10-2011 |
| 20110013342 | METHOD FOR PRODUCING DIELECTRIC FILM AND METHOD FOR PRODUCING CAPACITOR LAYER-FORMING MATERIAL USING THE METHOD FOR PRODUCING DIELECTRIC FILM - An object of the present invention is to provide a method for producing a dielectric film excellent in the deposition stability in forming a high-density dielectric film by an electrophoresis method using a dielectric particle-dispersed slurry in which dielectric particles are dispersed. In order to achieve the object, a method for producing a dielectric film using an electrophoresis method comprising arranging a cathode electrode and an anode electrode in a dielectric particle-dispersed slurry in which the dielectric particles are dispersed and carrying out electrolysis to form a dielectric film on one of the electrodes, wherein the dielectric particles contained in the dielectric particle-dispersed slurry are the calcined dielectric particles. | 01-20-2011 |
| 20110011731 | PROCESS FOR PRODUCING INDIUM OXIDE-TYPE TRANSPARENT ELECTROCONDUCTIVE FILM - To provide a method for producing a method for producing a low-resistance and high-transmittance indium-oxide-based transparent conductive film readily obtained through crystallization, the method employing an amorphous film which can easily be patterned through etching with a weak acid. | 01-20-2011 |
| 20110005817 | CAPACITOR-FORMING MATERIAL AND PRINTED WIRING BOARD PROVIDED WITH CAPACITOR - An object of the present invention is to provide a capacitor-forming material having a stable adhesion between a dielectric layer and an electrode-forming layer. To achieve the object, the capacitor-forming material in which an oxides dielectric layer is provided between a top-electrode-forming layer and a bottom-electrode-forming layer, wherein at least one of the top-electrode-forming layer and the bottom-electrode-forming layer has a two-layer construction constituted with a bulk-metal layer and a composite layer composed of metal and metal oxide which is made to contact with the oxides dielectric layer. In particular, it is preferable to employ a capacitor-forming material having the top-electrode-forming layer which has two-layer construction constituted with the bulk-metal layer and the composite layer composed of metal and metal oxide, and has a layer construction in which the bulk-metal layer and the composite layer composed of metal and metal oxide are stacked to make the composite layer composed of metal and metal oxide contact with the oxides dielectric layer. | 01-13-2011 |
| 20100313631 | Fluid Discrimination Method and Fluid Discrimination Apparatus - A fluid discrimination apparatus and a fluid discrimination method are provided for carrying out with accuracy a fluid discrimination such as a fluid type discrimination, a concentration discrimination, the fluid existence or nonexistence discrimination, and a fluid temperature discrimination for a discriminated fluid that is stored in a tank or the like. A characteristic measured value as an index value that indicates the characteristics of the fluid to be discriminated is measured, and a discrimination of a fluid is carried out by comparing the fluid discrimination data that indicates the relationship between a fluid that has been measured in advance and a characteristic value of the fluid with the characteristic measured value. | 12-16-2010 |
| 20100294021 | Fluid Identification Device and Fluid Identification Method - A fluid identification device of long life for identification of a target fluid. The device uses at least two liquid type detection parts each of which is equipped with both of a temperature detector and a heating element, selects electrical conduction to any one of the heating elements, and identifies the target fluid based on a fluid temperature detection signal of the temperature detector in the fluid detection part not including the heating element whose electrical conduction has been selected and an output of the fluid type detection circuit. | 11-25-2010 |
| 20100245030 | Processes for Producing Thin-Film Sensors, Thin-Film Sensors and Thin-Film Sensor Modules - It is an object to provide processes for the production of thin-film sensors whereby crystals are strongly oriented without cost-adding steps such as heating and variations in electrical properties are small among the obtainable products. A process of producing a thin-film sensor is a process of producing a thin-film sensor that include an insulating substrate and an electrical resistor which is made of a metal and is provided on the insulating substrate, the process including a step of forming the electrical resistor by sputtering the metal while applying a negative direct-current voltage to the insulating substrate. | 09-30-2010 |
| 20100244281 | FLEXIBLE PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE EMPLOYING THE SAME - Objects of the present invention is to provide a flexible printed wiring board which has a simple structure, which can be produced at low cost, and which can effectively dissipate heat generated by semiconductor chips, and to provide a semiconductor device employing the flexible printed wiring board. The flexible printed wiring board of the invention has an insulating substrate, and a wiring pattern formed of a conductor layer and provided on one surface of the insulating substrate, wherein the wiring pattern includes inner leads for mounting a semiconductor chip and outer leads for input and output wire connection, and a metal layer is adhered to the wiring pattern via an insulating adhesion layer. | 09-30-2010 |
| 20100243952 | Spinel Type Lithium Transition Metal Oxide - In order to provide a novel spinel type lithium transition metal oxide (LMO) having excellent power performance characteristics, in which preferably both the power performance characteristics and the cycle performance at high temperature life characteristics may be balanced, a novel spinel type lithium transition metal oxide with excellent power performance characteristics is proposed by defining the inter-atomic distance Li—O to be 1.978 Å to 2.006 Å as measured by the Rietveld method using the fundamental method in a lithium transition metal oxide represented by the general formula Li | 09-30-2010 |
| 20100243435 | Sputtering Target for Magnetic Recording Film and Method for Manufacturing the Same - Provided is a sputtering target for a magnetic recording film, in which film formation efficiency and film characteristics can be improved by suppressing growth of crystal grains, reducing magnetic permeability, and increasing density. A method for manufacturing such a sputtering target is also provided. The sputtering target is composed of a matrix phase which includes Co and Pt and a metal oxide phase for example. The sputtering target has a magnetic permeability in the range of 6 to 15 and a relative density of 90% or more. | 09-30-2010 |
| 20100155237 | Sputtering target and method for producing sintered oxide - Provided is a sputtering target for forming a transparent conductive film, which has low resistivity and excellent transparency, can be relatively easily patterned in amorphous state by weak acid etching and relatively easily crystallized. A method for manufacturing an oxide sintered body is also provided. The sputtering target is provided for forming the amorphous-state transparent conductive film. The sputtering target is provided with the oxide sintered body containing indium oxide, tin, if needed, and barium. | 06-24-2010 |
| 20100155103 | ELECTRICALLY CONDUCTIVE INK - The invention relates to an electrically conductive ink comprising fine metal particles, an inorganic binder, and a solvent. The inorganic binder comprises a coupling agent containing Ti or Al or a chelate containing Ti or Al. It is preferred that the inorganic binder is present in an amount of 1 to 50 parts by weight per 100 parts by weight of the fine metal particles in the conductive ink. An electrical conductor thin film is produced by the process of printing the conductive ink on a substrate to form a printed pattern by additive processing and firing the printed pattern at 100° C. to 950° C. | 06-24-2010 |
| 20100136437 | NONAQUEOUS SECONDARY BATTERY AND METHOD OF PRODUCING THE SAME - A nonaqueous secondary battery having a negative electrode containing a silicon active material and a nonaqueous solvent containing a fluorine-containing solvent. The active material layer has a fluorine content of 5 to 30 wt % based on the silicon content after at least 100 charge/discharge cycles at a rate of 50% or more of the battery's capacity. The battery is suitably produced by a method including applying a slurry containing silicon active material particles to a current collector, electroplating the resulting coating layer using a plating bath at a pH higher than 7 to coat at least part of the surface of the particles with copper, acid washing the coating layer to make a negative electrode, assembling the negative electrode together with a positive electrode, a separator, and a nonaqueous electrolyte containing a fluorine-containing solvent into a nonaqueous secondary battery, and subjecting the battery to a first charge operation at a low rate of 0.005 to 0.03 C. | 06-03-2010 |
| 20100117025 | Lithium Transition Metal Oxide Having Layered Structure - In a lithium transition metal oxide having a layered structure, one is provided, which is particularly excellent as a positive electrode active material of a battery on board of an electric vehicle or a hybrid vehicle in particular. A lithium transition metal oxide having a layered structure is proposed, wherein the ratio of the crystallite diameter determined by Measurement Method 1 according to the Rietveld method with respect to the mean powder particle diameter (D50) determined by the laser diffraction/scattering-type particle size distribution measurement method is 0.05 to 0.20. | 05-13-2010 |
| 20100108368 | RESIN COMPOSITION FOR FORMING INSULATING LAYER OF PRINTED WIRING BOARD - Disclosed is a halogen-free resin composition for printed wiring board production, which is remarkably reduced in quality deterioration due to moisture absorption of a semi-cured resin film (layer). Also disclosed is a copper film with resin or the like. The resin composition is characterized by containing a component A (one or more resins selected from the group consisting of bisphenol-A epoxy resins, bisphenol-F epoxy resins and bisphenol-AD epoxy resins, which have an epoxy equivalent of not more than 200, while being in a liquid state at 25 DEG C.), a component B (a linear polymer having a crosslinkable functional group), a component C (a crosslinking agent), a component D (an imidazole-based epoxy resin curing agent) and a component E (a phosphorus-containing epoxy resin). The resin composition is also characterized by containing 0.5-3.0% by weight of phosphorus atoms per 100% by weight of the resin composition. In the copper foil with resin, a resin layer is formed by using the resin composition. | 05-06-2010 |
| 20100089758 | METHOD OF PREPARING ELECTROLYTIC COPPER SOLUTION ACIDIFIED WITH SULFURIC ACID, SULFURIC-ACID-ACIDIFIED ELECTROLYTIC COPPER SOLUTION PREPARED BY THE PREPARATION METHOD, AND ELECTRODEPOSITED COPPER FILM - An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid. | 04-15-2010 |
| 20100068511 | SURFACE-TREATED COPPER FOIL, SURFACE-TREATED COPPER FOIL WITH VERY THIN PRIMER RESIN LAYER, METHOD FOR MANUFACTURING THE SURFACE-TREATED COPPER FOIL, AND METHOD FOR MANUFACTURING THE SURFACE-TREATED COPPER FOIL WITH VERY THIN PRIMER RESIN LAYER - Object of the invention is to provide a surface-treated copper foil comprising a rust-proofing treatment layer without chromium on an electro-deposited copper foil in which the peel strength of the circuits in processing of the printed wiring board and the chemical resistance against to the peel loss and the like are excellent. To achieve the object, the surface-treated copper foil characterized in comprising a rust-proofing treatment layer and a silane coupling agent layer on a bonding surface of an electro-deposited copper foil to an insulating resin substrate wherein the rust-proofing treatment layer is prepared by forming a nickel alloy layer having a thickness by weight of 5 mg/m | 03-18-2010 |
| 20100065424 | ZINC-OXIDE-BASED TARGET - The invention provides a zinc-oxide-based target, having excellent environmental durability. The target contains zinc oxide as a predominant component, and both titanium (Ti) and gallium (Ga) in amounts of 1.1 at. % or more and 4.5 at. % or more, respectively. | 03-18-2010 |
| 20100062340 | NEGATIVE ELECTRODE FOR NONAQUEOUS SECONDARY BATTERY - A negative electrode | 03-11-2010 |
| 20100038115 | Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil - It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super low profile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine. | 02-18-2010 |
| 20100011844 | Fluid Identification Method and Fluid Identification Apparatus - A fluid identification sensor that includes a fluid identification element and a fluid temperature detecting element that is disposed separately at a predefined distance from the fluid identification element is used. A voltage is applied to the fluid identification element for a prescribed time to heat a identification target fluid. A first output value that is an electrical output value corresponding to a first temperature of a fluid identification element and a second output value that is an electrical output value corresponding to a second temperature of a fluid identification element are obtained. A fluid identification is carried out by comparing a rate of change of the first output value and the second output value with a rate of change of a first output value and a second output value for a reference fluid, which has been measured in advance. | 01-21-2010 |
| 20090317591 | Metal Composite Laminate for Producing Flexible Wiring Board and Flexible Wiring Board - A metal composite laminate for producing a flexible wiring board a wiring-forming metal layer for forming a wiring pattern that is laminated on the front surface of a flexible insulating resin layer, a support metal layer that serves as a support is laminated on the back surface of the insulating resin layer. The total thickness (W | 12-24-2009 |
| 20090314525 | Mold for Wiring Substrate Formation and Process for Producing the Same, Wiring Substrate and Process for Producing the Same, Process for Producing Multilayered Laminated Wiring Substrate and Method for Viahole Formation - A process for producing a wiring board is provided, comprising allowing a wiring board-forming mold, which comprises a support base and a mold pattern that is formed in a protruded shape on one surface of the support base wherein the sectional width of the mold pattern on the support base side is larger than the sectional width thereof on the tip side in the same section of the mold pattern, to penetrate into a curing resin layer to transfer the mold pattern, curing the curing resin layer, releasing the laminate from the mold, depositing a conductive metal, and polishing the deposited metal layer that to form a depressed wiring pattern, and a wiring board produced by this process. Further, described is a process for producing a wiring board, comprising bringing a precision mold having a mold pattern on a surface of a mold base into contact with a surface of a metal thin film formed on an organic insulating base, pressing the mold to form a depression having a shape corresponding to the mold pattern of the precision mold in the organic insulating base, thereafter forming a metal plating layer having a thickness larger than the depth of the depression to fill the plating metal in the depression, and then polishing the metal plating layer until the organic insulating base is exposed, to form a wiring pattern, and a wiring pattern produced by this process. | 12-24-2009 |
| 20090308740 | CoCrPt Base Sputtering Target and Production Process for the Same - An object of the present invention is to provide a CoCrPt base sputtering target in which high chromium-containing particles containing a chromium atom at a high concentration unevenly distributed in the above sputtering target are reduced in a size and a production amount to thereby enhance a uniformity of the target and inhibit nodules or acing from being caused and which has the targeted composition ratio. | 12-17-2009 |
| 20090293766 | Conductive ink - An object of the invention is to provide a conductive metal ink having an excellent adhesion to various kinds of substrates such as a glass substrate, and making it possible to form fine wiring or electrodes. Another object is to provide a conductive ink which can be used for ink jet printing system etc. For the purpose of achieving the objects, a conductive ink comprising a solvent, a metal powder, and an adhesion improver, which is characterized in that the adhesion improver is one or mixture selected from the group consisting of a silane coupling agent, a titanium coupling agent, a zirconium coupling agent, and an aluminum coupling agent. is adopted. Furthermore, a surface tension of the solvent is adjusted to be in the range of 15 mN/m to 50 mN/m with a surface tension adjustor to provide conductive ink suitable for ink jet printing system etc. | 12-03-2009 |
| 20090291319 | COPPER FOIL WITH CARRIER SHEET, METHOD FOR MANUFACTURING COPPER FOIL WITH CARRIER SHEET, SURFACE-TREATED COPPER FOIL WITH CARRIER SHEET AND COPPER-CLAD LAMINATE USING THE SURFACE-TREATED COPPER FOIL WITH CARRIER SHEET - An object of the present invention is to provide a copper foil with carrier sheet which permits releasing of the carrier sheet from the copper foil layer even when hot pressing at a temperature exceeding 300° C. is applied in the production of a printed wiring board. In order to achieve the object, a copper foil with physically releasable carrier sheet having a copper foil layer on the surface of the carrier sheet through a bonding interface layer, characterized in that the bonding interface layer is composed of a metal layer and a carbon layer. It is preferable for the bonding interface layer to be composed of a metal layer of 1 nm to 50 nm thick and a carbon layer of 1 nm to 20 nm thick. | 11-26-2009 |
| 20090269585 | BLACK COMPLEX OXIDE PARTICLES - The complex oxide particles of the present invention are conductive and exhibit a black color. The particles contain cobalt in an amount of 40 to 65% by mass in terms of the metal element based on the whole particles and at least one kind or two or more kinds of metals selected from copper, nickel and molybdenum. The particles are preferably prepared in the following manner: an aqueous solution of mixed metal salts prepared from water-soluble salts, wherein the aqueous solution contains cobalt and one kind or two or more kinds of metal element selected from copper, nickel and molybdenum, is mixed and neutralized with an alkali hydroxide to obtain a metal hydroxide slurry; the resultant slurry of metal hydroxides is kept at a pH of 10 to 13 and oxidized at a temperature of higher than 40° C. and 60° C. or less to obtain a precursor slurry; the resultant precursor slurry is aged at 80 to 150° C.; and then, after solid-liquid separation, the resultant solid is heated at 400 to 700° C. for longer than 1 hour and 3 hours or less. | 10-29-2009 |
| 20090267029 | Indium-oxide-based transparent conductive film and method for producing the film - The invention provides a transparent conductive film which exhibits low resistance and high transmittance, is an amorphous film, can be relatively readily patterned by etching with a weak acid, and can be relatively readily crystallized, and a method for producing the film. | 10-29-2009 |
| 20090252924 | NICKEL INK AND CONDUCTOR FILM FORMED OF NICKEL INK - A nickel ink having nickel particles dispersed in a dispersion medium is disclosed. The dispersion medium comprises one member or a combination of two or more members selected from the group consisting of an alcohol and a glycol both having a boiling point of 300° C. or lower at atmospheric pressure. The nickel particles have an average primary particle size of 50 nm or smaller. The nickel ink provides a conductor film with a surface smoothness having an average surface roughness Ra of 10 nm or smaller and a maximum surface roughness R | 10-08-2009 |
| 20090246677 | CARRIER CORE MATERIAL FOR AN ELECTROPHOTOGRAPHIC DEVELOPER, CARRIER, AND ELECTROPHOTOGRAPHIC DEVELOPER USING THE CARRIER - A carrier core material for an electrophotographic developer containing Li ferrite, maghemite, and Fe | 10-01-2009 |
| 20090246676 | CARRIER CORE MATERIAL FOR ELECTROPHOTOGRAPHIC DEVELOPER, CARRIER, AND ELECTROPHOTOGRAPHIC DEVELOPER USING THE CARRIER - A carrier core material for an electrophotographic developer including Li ferrite, maghemite, and Fe | 10-01-2009 |
| 20090246556 | DEHUMIDIFYING DEOXIDIZER - A dehumidifying deoxidizer containing oxygen-deficient cerium oxide and a dehumidifier is provided. The oxygen-deficient cerium oxide is preferably doped with an element increasing the oxygen absorption of the cerium oxide. The oxygen absorption sites of the cerium oxide are preferably obstructed by a site obstructing factor. The cerium oxide preferably has a fluorite type superlattice structure. Also provided are a dehumidifying and deoxidizing packet having the dehumidifying deoxidizer sealed in a bag-shaped, gas permeable casing and a dehumidifying and deoxidizing resin composition containing the dehumidifying deoxidizer and a gas permeable resin. | 10-01-2009 |
| 20090229976 | Sputtering Target Material Containing Cobalt/Chromium/Platinum Matrix Phase and Oxide Phase, and Process for Producing the Same - Sputtering target materials have improved film-sputtering properties by containing finer metal oxide particles. A process for producing a sputtering target material including a cobalt/chromium/platinum matrix phase and an oxide phase that includes two or more metal oxides including at least chromium oxide wherein the oxide phase is in the form of particles, includes sintering material powder to form the sputtering target material wherein the material powder contains chromium oxide at not less than 1.0 mol % based on the material powder. | 09-17-2009 |
| 20090183901 | Wiring Boards and Processes for Manufacturing the Same - A wiring board includes an insulating substrate and a wiring pattern. The wiring pattern includes a main body and an upper end portion and is embedded in the insulating substrate while exposing at least the upper end portion on a surface of the insulating substrate. The upper end portion has a cross-sectional width smaller than that of a lower end portion of the wiring pattern embedded in the insulating substrate. The upper end portion is formed of a metal that is more noble than a metal of the main body of the wiring pattern. | 07-23-2009 |
| 20090174520 | Laminates, Thin-Film Sensors, Thin-Film Sensor Modules, and Methods for Producing the Thin-Film Sensors - A laminate includes an insulating substrate, and a temperature-sensitive resistor made of crystals of a metal based on a platinum group element and laminated on the insulating substrate; and has a percentage of (111) planes of crystals oriented at 10° or less from the normal direction (ND direction) in a layer of the temperature-sensitive resistor being 90% or more. By controlling the orientation of crystals forming the temperature-sensitive resistor, laminates suitable as a thin-film sensor, thin-film sensors including the laminate, thin-film sensor modules including the thin-film sensor, and methods for producing the thin-film sensors are provided. | 07-09-2009 |
| 20090166213 | PRODUCTION METHOD OF ELECTRO-DEPOSITED COPPER FOIL, ELECTRO-DEPOSITED COPPER FOIL OBTAINED BY THE PRODUCTION METHOD, SURFACE-TREATED COPPER FOIL OBTAINED BY USING THE ELECTRO-DEPOSITED COPPER FOIL AND COPPER-CLAD LAMINATE OBTAINED BY USING THE ELECTRO-DEPOSITED COPPER FOIL OR THE SURFACE-TREATED COPPER FOIL - An object of the present invention is to provide a production method which enables efficient production of an electro-deposited copper foil with further lower profile when compared to the low-profile electro-deposited copper foils which have been supplied to the market and is excellent in mechanical strength. For the purpose of achieving the object, a production method adopted obtains the electro-deposited copper foil by electrolyzing a sulfuric acid based copper electrolytic solution which contains a quaternary ammonium salt polymer having cyclic structure and chlorine, wherein for the quaternary ammonium salt polymer contained in the sulfuric acid based copper electrolytic solution, a DDAC dimer or higher polymer is used. For the quaternary ammonium salt polymer, a diallyl dimethyl ammonium chloride polymer having a number average molecular weight of 300 to 10000 is preferably used. The sulfuric acid based copper electrolytic solution preferably contains bis(3-sulfopropyl) disulfide or 3-mercapto-1-propanesulfonic acid that is a compound having a mercapto group. | 07-02-2009 |
| 20090154790 | Wiring Pattern Inspection Method and Inspection Apparatus for Flexible Printed Wiring Board - In a method for inspecting a wiring pattern on a flexible printed wiring board, light is illuminated from a front surface side of the TAB tape T while a drum is provided on the rear surface side of the TAB tape T such that a reflection method becomes main and a transmission method becomes subordinate, and when imaging a wiring pattern image of an inspection part D on the front surface side, it becomes possible to determine the quality of a wiring pattern taking advantage of the reflection method. Furthers by utilizing the indirect transmission light, defects of a short-circuiting type on the light permeable insulating film that are difficult to be detected with the reflection method can be detected as darker defects than the light permeable insulating film by the transmission method. | 06-18-2009 |
| 20090126573 | DEOXIDIZER AND PROCESS OF PRODUCING DEOXIDIZER - A deoxidizer for absorbing and removing oxygen from the surrounding atmosphere, comprising oxygen-deficient cerium oxide having a powder form with a specific surface area of 0.6 m | 05-21-2009 |
| 20090120544 | Strengthened Alpha Brass and Method for Manufacturing the Same - An object of the present invention is to provide a strengthened alpha brass having a good balance between high offset yield strength and formability without deteriorated stress relaxation resistance in comparison with conventional brass and a manufacturing method of the strengthened alpha brass. In order to achieve this object, a strengthened alpha brass having a composition of 63 wt % to 75 wt % copper, incidental impurities and the balance zinc; the strengthened alpha brass which is obtained by using a starting plate material subjected to a re-crystallization annealing to have a grain size from 1-micron meter to 2-micron meter followed by cold rolling in 5% to 40% reduction, then the plate material is low temperature annealed at a temperature equal to or higher than the temperature at which a 0.2% offset yield strength exhibits a maximum value to adjust the 0.2% offset yield strength ([Sigma] | 05-14-2009 |
| 20090108732 | White phosphor, and white light-emitting equipment of device - A white phosphor is provided, which is a white phosphor comprising a single material, wherein the light-emitting center is one element other than Mn, and emitting white light having excellent color rendering properties by near ultraviolet excitation. The white phosphor is represented by the formula Sr | 04-30-2009 |
| 20090095515 | ELECTRO-DEPOSITED COPPER FOIL, SURFACE-TREATED COPPER FOIL USING THE ELECTRO-DEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE USING THE SURFACE-TREATED COPPER FOIL, AND A METHOD FOR MANUFACTURING THE ELECTRO-DEPOSITED COPPER FOIL - An object of the present invention is to provide an electro-deposited copper foil having the equivalent low-profile surface as in a conventional low-profile electro-deposited copper foil and extremely large mechanical strength and a method for manufacturing the same. To achieve the object, the electro-deposited copper foil is formed by depositing fine copper crystal grains having a small deviation of grain-diameter that has never been obtained in the art. The electro-deposited copper foil has a low-profile and glossy surface and has extremely large mechanical strength expressed by a tensile strength as received of 70 kgf/mm | 04-16-2009 |
| 20090056437 | Liquid Level Detecting Method and Liquid Level Detecting Device - A liquid level detecting method is provided for detecting the level of a liquid at a high accuracy by performing correction by using the density of the liquid, in the case of detecting the liquid level by using a pressure sensor. The pressure sensor ( | 03-05-2009 |
| 20090053525 | NICKEL INK - Disclosed is a nickel ink which is obtained by dispersing nickel particles in a dispersion medium. This nickel ink contains a methyldimethoxysilane coupling agent. The dispersion medium contains a glycol having a boiling point at room temperature of not more than 300 & ring; C, an alkoxyethanol having 3-10 carbon atoms, and an ether having carbon atoms. The ink is preferably controlled to have a surface tension of 15-50 mN/m and a viscosity at 25 & ring; C of 0.6-60 mPa-sec. This ink is preferably used in inkjet printing systems. | 02-26-2009 |
| 20090047539 | SURFACE-TREATED ELECTRO-DEPOSITED COPPER FOIL AND METHOD FOR MANUFACTURING THE SAME - It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 μm to 0.7 μm, the maximum peak to valley height (PV) to be 0.05 to 1.5 μm, and the surface roughness (Rzjis) to be 0.1 μm to 1.0 μm. The electro-deposited copper foil used for the manufacturing of this surface-treated electro-deposited copper foil is manufactured by using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and using a cathode having small surface roughness, under electrolysis conditions of carrying out continuous first-step electrolysis to n-th-step electrolysis at two or more different levels of electric current density. | 02-19-2009 |
| 20090044971 | Printed Wiring Board, Process for Producing the Same and Usage of the Same - The printed wiring board includes an insulating base and a plurality of wirings formed on the surface of the insulating base, wherein the wiring circuit has a conductive undercoat layer formed on the surface of the insulating base, a Cu nodule layer formed on the upper surface of the undercoat layer, a cover plating layer formed on the upper surface of the Cu nodule layer and a first metal plating layer formed on the upper surface of the cover plating layer, and on the upper surface of the wiring circuit, a protruded and depressed surface attributable to protrusions and depressions of the upper surface of the Cu nodule layer is formed. The printed wiring board can be produced by depositing the above metal layers such as the Cu nodule layer with regulating a sidewall surface of a pattern formed from the photosensitive resin. Ruther conductive bonding is possible by the use of an adhesive only. | 02-19-2009 |
| 20090032139 | TIN POWDER, MANUFACTURING METHOD OF TIN POWDER AND CONDUCTIVE PASTE CONTAINING TIN POWDER - Object of the invention is to provide a tin powder containing fine tin particles which performs fine pitch wiring circuit easily, excellent in filling the minute diameter via holes, and exhibits low temperature fusibility. In order to achieve the object, a copper powder slurry is prepared by adding a copper powder in water with agitation and a tin solution for deposition by substitution is prepared by adding an acid to an aqueous mixture solution containing a stannous salt and thiourea. Then the copper powder slurry and the tin solution for deposition by substitution are mixed with agitation in a certain ratio of tin in the solution against to copper in the slurry to deposit tin by substitution on the surface of the copper powder. As a result, the tin powder of the present invention is obtained. | 02-05-2009 |
| 20090029186 | SURFACE-TREATED COPPER FOIL, MANUFACTURING METHOD OF THE SURFACE-TREATED COPPER FOIL, AND SURFACE-TREATED COPPER FOIL COATED WITH VERY THIN PRIMER RESIN LAYER - It is an object of the present invention to provide a surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good performance in peel strength and resistance to peel loss after chemical treatment as a printed wiring board. To achieve this object, a surface-treated copper foil comprising an rust-proofing layer and a silane coupling agent layer formed on the bonding surface of an electrodeposited copper foil to an insulating resin substrate, wherein the rust-proofing layer comprises a nickel layer having a thickness by weight of 5 to 40 mg/m | 01-29-2009 |
| 20090023007 | HIGHLY CRYSTALLINE SILVER POWDER AND METHOD FOR PRODUCING THE SAME - An object of the present invention is to provide highly crystalline silver powder which is characterized in fine particles, showing high dispersibility, it's particle size distribution is not excessively sharp but relatively broad and crystallites are large; and a method for producing the same. In order to achieve the object, a method for producing highly crystalline silver powder is characterized in that mixing a first aqueous solution and a second aqueous solution, wherein the first aqueous solution contains silver nitrate, a dispersing agent and nitric acid, and the second solution contains ascorbic acid. For dispersing agent, polyvinylpyrrolidone or gelatin is preferred. Highly crystalline silver powder produced by the above-described method is preferred to be a crystallite diameter of 300 Å or more, an average particle diameter D | 01-22-2009 |
| 20090014694 | METHOD FOR PRODUCING NICKEL PARTICLE, NICKEL PARTICLE OBTAINED BY THE PRODUCTION METHOD, AND ELECTROCONDUCTIVE PASTE USING THE NICKEL PARTICLE - The present invention is directed at providing fine nickel particles with a sharp particle size distribution, and providing an electroconductive paste using the nickel particles. In order to obtain the nickel particles capable of achieving the purpose, a method for producing the nickel particle by elevating a temperature of the reactive solution containing a nickel salt and a polyol to a reduction temperature, and reducing the nickel salt in the reactive solution which is characterized in that the reactive solution is prepared to contain a carboxylic acid or an amine having a carboxyl functional group and/or an amino functional group, and a precious metal catalyst before the solution temperature is elevated to the reduction temperature. Nickel particles obtained with the production method have an average image analytical particle diameter of 1 nm to 300 nm. | 01-15-2009 |
| 20090007496 | METHOD FOR CONTROLLING SLIDING SPEED OF VEHICLE SLIDING DOOR - Under a method to control a sliding speed in accordance with this invention, the motor is initially accelerated for a predetermined reference speed, and then during the initial acceleration period, if a rotational speed of the wire drum is of and above a given value, a difference between a rotational speed of the wire drum and a rotational speed of the motor is of and above a given value, and a rate of acceleration of the wire drum is of and above a given value, the rotational speed of the motor is reduced temporarily judging the slide door is in a state of abnormal acceleration, and then the motor is accelerated again at a lower rate than the initial acceleration toward the reference speed. | 01-08-2009 |
| 20090000396 | Device and Method of Detecting Flow Rate/Liquid Kind, and Device and Method of Detecting Liquid Kind - A flow rate/liquid type detecting method for detecting the flow rate of a fluid and, at the same time, detecting any one of or both the type of the fluid and the concentration of the fluid, characterized in that, by using a flow rate/liquid type detecting apparatus comprising: a main passage through which a fluid to be detected flows, an auxiliary passage branched from the main passage, and a flow rate/liquid type detecting sensor device provided in the auxiliary passage, is provided, and in conducting any one of or both the detection of the type of the fluid and the detection of the concentration of the fluid, the auxiliary passage opening/closing valve is closed, and the fluid is allowed to temporarily stay within the flow rate/liquid type detecting sensor device to conduct any one of or both the detection of the liquid type and the detection of the concentration, and in detecting the flow rate of the fluid detected, the auxiliary passage opening/closing valve is opened to allow the fluid to flow into the flow rate/liquid type detecting sensor device to detect the flow rate. | 01-01-2009 |
| 20080316715 | Coated Copper, Method for Inhibiting Generation of Whisker, Printed Wiring Board and Semiconductor Device - A coated copper is provided which inhibits the growth of whiskers and is composed of a copper substrate or a copper alloy substrate, a copper-diffused tin layer formed on the surface of the substrate, and a pure tin layer formed on the surface of the copper-diffused tin layer. The thickness of the copper-diffused tin layer is 55% or more with respect to the total thickness of the copper-diffused tin layer and the pure tin layer. Further, a printed wiring board is provided having a wiring pattern of the copper substrate or the copper alloy substrate, and a semiconductor device. Accordingly, the generation of long whiskers having a length exceeding 15 μm which cause short circuits can be inhibited. | 12-25-2008 |
| 20080310073 | Method for Forming Oxide Dielectric Layer, and Capacitor Layer Forming Material Provided with Oxide Dielectric Layer Obtained by the Forming Method - The present invention has an object to provide a method for forming an oxide dielectric layer, which dielectric layer is formed by applying the sol-gel method, and is hardly damaged by an etching solution and excellent in dielectric characteristics such as a large electric capacitance. To achieve the object, the forming method of an oxide dielectric layer by applying a sol-gel method characterized by being provided with the following processes (a) to (c) is employed. Process (a): A solution preparing process of preparing a sol-gel solution for manufacturing an aiming oxide dielectric layer. Process (b): A coating process wherein stages of the sol-gel solution coating on the surface of a metal substrate followed by drying in an oxygen-containing atmosphere followed by pyrolysis in an oxygen-containing atmosphere sequentially is made one unit step; the one unit step is repeated twice or more times; and a pre-baking stage at 550-deg.C to 1000-deg.C in an inert gas-substituted atmosphere or the like is provided optionally between the one unit step and the next one unit step to control the film thickness. Process (c): A baking process of finally subjecting the coated metal substrate to a baking process at 550-deg.C to 1000-deg.C in an inert gas-substituted atmosphere or the like to finish the dielectric layer. | 12-18-2008 |
| 20080289865 | Method for Manufacturing Dielectric Layer Constituting Material, Dielectric Layer Constituting Material Obtained Thereby; Method for Manufacturing Capacitor Circuit Forming Piece Using Dielectric Layer Constituting Material, Capacitor Circuit Forming Piece Obtained Thereby; and Multi-Layer Printed Wiring Board Obtained by Using Dielectric Layer Constituting Material and/or Capacitor Circuit Forming Piece - An object is to obtain a dielectric layer constituting material, a capacitor circuit forming piece, etc. in which unnecessary dielectric layer is removed except capacitor circuit parts that improve accuracy of position of an embedded capacitor circuit in a multi-layer printed wiring board. For the purpose of achieving the object, “a method for manufacturing a dielectric layer constituting material characterized in that step a is a step for forming a first electrode circuit by etching a conductor layer on one side of a metal clad dielectric comprising a conductor layer on each side of a dielectric layer; step b is a step for removing the dielectric layer that is exposed between the first electrode circuits to manufacture the dielectric layer constituting material; and the step a is conducted and then the step b is conducted” is adopted. Then as a process for manufacturing a capacitor circuit forming piece, the dielectric layer constituting material obtained above is used and a process for forming a second electrode at a position facing the first electrode is conducted. | 11-27-2008 |
| 20080283283 | Material for Forming Capacitor Layer and Method for Manufacturing the Material for Forming Capacitor Layer - An object of the present invention is to provide a material for forming a capacitor layer comprising a dielectric layer formed by any one of a sol-gel method, an MOCVD method, and a sputtering deposition method. The material can reduce a leakage current of a capacitor circuit. In order to achieve the object, a material for forming a capacitor layer comprising a dielectric layer between a first conductive layer to be used for forming a top electrode and a second conductive layer to be used for forming a bottom electrode, characterized in that the dielectric layer is a dielectric oxide film formed by any one of a sol-gel method, an MOCVD method, and a sputtering deposition method; and particles constituting the dielectric oxide film are impregnated with a resin component is employed. In addition, a manufacturing method characterized in that the dielectric oxide film is formed on the surface of a material to be the bottom electrode by any one of a sol-gel method, an MOCVD method, and a sputtering deposition method; a resin varnish is impregnated into a surface of the dielectric oxide film; the resin is dried and cured to form the dielectric layer; and then a top electrode constituting layer is provided on the dielectric layer is employed. | 11-20-2008 |
| 20080280159 | Copper Foil and Method of Manufacturing the Same - The object is to provide copper foil of high adhesion even when the roughness R | 11-13-2008 |
| 20080274871 | JIG FOR CALCINING ELECTRONIC COMPONENT - A jig for calcining an electronic component including a substrate | 11-06-2008 |
| 20080257746 | Method for Producing Metal Thin Body - A method for producing a metal thin body by electroplating, in which the relative integrated intensity of the (111) plane of the metal thin body can be increased to 65% or greater. By carrying out electroplating using an electrolytic solution (plating solution) containing 5% in volume or greater of acetonitrile and water, in particular, using an electrolytic solution (plating solution) containing 10% in volume or greater of acetonitrile and water, the relative integrated intensity of the (111) plane can be increased to 65% or greater. | 10-23-2008 |
| 20080257588 | Capacitor Layer Forming Material, Manufacturing Method Thereof, and Printed Wiring Board with Embedded Capacitor Layer Obtained Using Capacitor Layer Forming Material - A capacitor layer forming material that consists of a dielectric film making use of the sol-gel process excelling in production cost merit, being capable of producing a capacitor circuit of prolonged life having a nonconventional high electric capacity. There is provided capacitor layer forming material ( | 10-23-2008 |
| 20080257480 | Method for Manufacturing Multilayer Printed Wiring Board and Multilayer Printed Wiring Board Obtained by the Same - The object of the present invention is to provide: a method for manufacturing a multilayer printed wiring board which enables the dielectric layers to have excellent thickness uniformity, the capacitor circuits to have high registration accuracy and the unnecessary dielectric layer is removed as large as possible; and a multilayer printed wiring board with an embedded capacitor circuit manufactured by the method. To achieve this object, a method is employed in which a multilayer printed wiring board with an embedded capacitor circuit is manufactured through: a first-conductive-metal-layer laminating step where a dielectric layer and a first conductive metal layer are provided on both sides of a core material having base electrode circuits; an top-electrode forming step where the first conductive metal layer(s) locating as outer layer(s) is(are) processed into top electrodes and the dielectric layer(s) in the area other than those of circuit portions is(are) exposed; a dielectric-layer removing step where the exposed dielectric layer(s), which is(are) in the area other than those of circuit portions, is(are) removed; a second-conductive-metal laminating step where the gaps among the top electrodes are filled in and an insulating layer and a second conductive metal layer are provided on the top electrodes; and an outer layer circuit forming step where the second conductive metal layer(s) is(are) processed into outer layer circuits. | 10-23-2008 |
| 20080251947 | COF FLEXIBLE PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE - A COF flexible printed wiring board, used for a semiconductor device, contains an insulating layer, a wiring pattern formed of a conductor layer on one side of the insulating layer, on which a semiconductor chip is to be mounted, and a heat-resistant releasing layer, wherein the releasing layer is formed from a releasing agent and is provided on a surface of the insulating layer, which surface is opposite to the mounting side of the semiconductor chip, and the releasing layer and the insulating layer, as a whole, exhibit an optical transmittance of 50% or higher, excluding the area corresponding to the wiring pattern. | 10-16-2008 |
| 20080236872 | Printed Wiring Board, Process For Producing the Same and Semiconductor Device - The printed wiring board of the present invention is a printed wiring board produced by selectively etching a base film having a base metal layer and a conductive metal layer, which are formed on an insulating film, through plural etching steps comprising a conductive metal etching step and a base metal etching step to form a wiring pattern and then bringing the base film having the thus formed wiring pattern into contact with a reducing aqueous solution containing a reducing substance, wherein the amount of a residual metal derived from the etching solution on the printed wiring board is not more than 0.05 μg/cm | 10-02-2008 |
| 20080224499 | Clutch Mechanism for Power Device - A clutch mechanism of the present power device comprises a fixed gear member, a moving gear member engaged with the fixed gear member when moving to a clutch connecting position, an armature for moving the moving gear member to the clutch connecting position when rotated relatively to the moving gear member, an electromagnetic coil unit for applying a brake resistance to the armature, and a clutch holding surface for abutting against the moving gear member when the electromagnetic coil unit is turned off in the clutch connecting state and for holding the moving gear member at a brake-clutch connecting position. The abutment of the moving gear member against the clutch holding surface is released by rotating the moving gear member relatively to the armature in a state in which the electromagnetic coil unit is operated. | 09-18-2008 |
| 20080201086 | Method and Apparatus for Measuring Amount of Generated Ammonia - Method and apparatus for measuring an amount of ammonia generated from a sample solution being an aqueous urea solution, an aqueous ammonium formate solution, or an aqueous mixture thereof, includes: applying a pulse voltage to a heating element for a predetermined time to heat the sample solution using the heating element; measuring a thermal conductivity-dependent output value and a kinetic viscosity-dependent output value that are electrical outputs dependent on electric resistivity of a temperature-sensitive element; calculating a urea concentration X wt % and an ammonium formate concentration Y wt % in the sample solution from a relationship between the thermal conductivity-dependent output value and the kinetic viscosity-dependent output value; calculating a urea amount A and an ammonium formate amount B in the sample solution from their concentrations and an amount of the sample solution; and determining the amount of generated ammonia with data thus obtained. | 08-21-2008 |
