| MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. Patent applications |
| Patent application number | Title | Published |
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| 20120012632 | CUTTER AND METHOD FOR CUTTING BRITTLE MATERIAL SUBSTRATE USING SAME - A cutter with which a diagonal crack can be created without fail deeply within a brittle material substrate is provided. The cutter has such a form that two cones or truncated cones are joined through the same bottom so as to share the same rotational axis, and the circumference of the above described bottom is used as the blade edge ridge line. In addition, grooves that incline at a predetermined angle relative to the direction of the rotational axis are created around this blade edge ridge line at predetermined intervals. Furthermore, the angles between the sides of the above described two cones or truncated cones and the above described bottom are different from each other. | 01-19-2012 |
| 20110232422 | Scribing wheel for brittle material and manufacturing method for same, as well as scribing method, scribing apparatus and scribing tool using the same - A scribing wheel for a brittle material includes a circumferential ridgeline in which two truncated cones have connected bottoms so as to share a rotational axis. Alternating notches and protrusions are formed along the circumference ridgeline. The protrusion are portions of the ridgeline remaining after the ridgeline is notched. The length of the notches is less than that of the protrusions so that a catch on the surface is improved while lowering the high penetrability. | 09-29-2011 |
| 20110167979 | GROOVE MACHINING TOOL FOR USE WITH A THIN-FILM SOLAR CELL - There is provided a groove machining tool supported in a holder and caused to move together with the holder in relative fashion along a scheduled scribe line over an integrated thin-film solar cell substrate to form a groove. The groove machining tool includes a tool body supported in the holder, and a blade tip part formed in a distal part of the tool body. The blade tip part includes a blade extending along a direction intersecting a direction of movement of the tool, at a first end along the direction of movement of the tool. The blade is tilted backward from the direction of movement of the tool in relation to a direction orthogonal to the direction of movement of the groove tool, as viewed from a bottom face of the blade tip part. | 07-14-2011 |
| 20110167978 | GROOVE MACHINING TOOL FOR USE WITH A THIN-FILM SOLAR CELL AND AN ANGLE REGULATION STRUCTURE - To be able to accurately adjust an angle using a simple operation when mounting a groove machining tool into a holder, there is provided a groove machining tool for use with a thin-film solar cell. The groove machining tool is retained by a holder, is caused to move together with the holder over a thin film of an integrated thin-film solar cell in one direction, and forms a groove on the thin film extending in one direction and has a tool body. The blade tip part is formed on a tip end of the tool body and has blade tips for machining grooves disposed at a tip end. An angle regulation unit is disposed on the tool body so that the blade tip part is fixed in a predetermined orientation with regard to the direction of formation of the groove when being retained by the holder. | 07-14-2011 |
| 20110113945 | Scribing wheel for brittle material and manufacturing method for same, as well as scribing method, scribing apparatus and scribing tool using the same - A scribing wheel for a brittle material includes a circumferential ridge line in which two truncated cones have connected bottoms so as to share a rotational axis. Alternating notches and protrusions are formed along the circumference ridge line. The protrusion are portions of the ridge line remaining after the ridge line is notched. The length of the notches is less than that of the protrusions so that a catch on the surface is improved while lowering the high penetrability. | 05-19-2011 |
| 20110107894 | Brittle Material Substrate Chamfering Method - [Issue] A chamfering method is provided that can be conducted even in small worksite space without using grinding members and without requiring a cleaning process after a chamfering process. | 05-12-2011 |
| 20100326138 | GLASS SUBSTRATE PROCESSING DEVICE USING LASER BEAM - A processing device is configured to irradiate a laser beam onto a glass substrate for processing. The processing device has a work table, a laser beam output section, a multi-spot focus section, a rotation drive mechanism, an optical system, and a laser beam scan section. The multi-spot focus section receives a laser beam, and splits and focuses the laser beam inputted therein into a plurality of beam focus spots. The rotation drive mechanism rotates the plurality of beam focus spots about a single center axis that is arranged in a center of the plurality of beam focus spots. The optical system guides the laser beam to the multi-spot focus section. The laser beam scan section moves all the plurality of beam focus spots rotating about the single center axis in a desired direction within a predetermined range of a plane arranged along a surface of the glass substrate. | 12-30-2010 |
| 20100276404 | LASER MACHINING METHOD AND LASER MACHINING APPARATUS - A laser machining method includes directing pulse laser light onto a surface of a brittle material substrate, and a laser light scanning step for scanning laser light along a scribe-scheduled line. The laser intensity of the pulse laser light is 1.0×10 | 11-04-2010 |
| 20100065599 | DEVICE AND METHOD FOR CUTTING OFF SUBSTRATE OF FRAGILE MATERIAL - A brittle material substrate cutting method and cutting apparatus are provided, which prevent cut faces of a brittle material substrate from contacting each other after the cutting in a break step of continuously cutting the brittle material substrate, so that a damage or contamination on the brittle material substrate due to the contact can be prevented. A brittle material substrate cutting apparatus includes: a cutting section ( | 03-18-2010 |
| 20090050610 | METHOD AND APPARATUS FOR SCRIBING BRITTLE MATERIAL BOARD AND SYSTEM FOR BREAKING BRITTLE MATERIAL BOARD - During scribing processes of a brittle material substrate, the present invention prevents the generation of an unnecessary crack deriving in an unspecified and uncontrollable direction. | 02-26-2009 |
| 20090029627 | POLISHING APPARATUS AND POLISHING METHOD - The present invention realizes a polishing apparatus capable of chamfering an end face of a large-sized substrate at a high precision for a table unit for mounting the substrate. A substrate is mounted on a table unit and is fixedly held in a predetermined reference state. A first polishing unit includes a polishing grind stone for polishing an end face of the substrate held on the table unit and substrate side edge portion supporting means for supporting the lower surface of a side edge portion of the substrate in the vicinity of the end face of the substrate to be polished by the polishing unit. The first polishing unit is moved together with the substrate side edge portion supporting means by a first polishing unit moving means along the end face of the substrate while the polishing grind stone is polishing the end face of the substrate. | 01-29-2009 |
| 20080305615 | Method of Scribing and Breaking Substrate Made of a Brittle Material and System for Scribing and Breaking Substrate - An object of the present invention is to provide a method of scribing and breaking a substrate made of a brittle material by which good-quality cutting surface of the substrate can be obtained without any defects such as chippings on the substrate. | 12-11-2008 |
| 20080286943 | Motherboard Cutting Method, Motherboard Scribing Apparatus, Program and Recording Medium - A mother substrate cutting method for cutting a plurality of unit substrates out of a mother substrate, comprises the steps of: (a) forming scribe lines on the mother substrate by scribe forming means; and (b) breaking the mother substrate along the scribe lines, wherein the step (a) includes a step of forming a first scribe line for cutting a first unit substrate out of the mother substrate and a second scribe line for cutting a second unit substrate out of the mother substrate by moving a pressure position to the mother substrate without a pressure to the mother substrate by the scribe forming means being interrupted. | 11-20-2008 |
