| MITSUBISHI SHINDOH CO., LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110266035 | CONDUCTIVE MEMBER AND METHOD FOR PRODUCING THE SAME - [Object] To provide a conductive member which has a stable contact resistance, is difficult to be separated, and also decreases the inserting and drawing force when used for a connector. | 11-03-2011 |
| 20110265917 | HIGH-STRENGTH AND HIGH-ELECTRICAL CONDUCTIVITY COPPER ALLOY ROLLED SHEET AND METHOD OF MANUFACTURING THE SAME - In a high-strength and high-electrical conductivity copper alloy rolled sheet, 0.14 to 0.34 mass % of Co, 0.046 to 0.098 mass % of P, 0.005 to 1.4 mass % of Sn are contained, [Co] mass % representing a Co content and [P] mass % representing a P content satisfy the relationship of 3.0≦([Co]−0.007)/([P]−0.009)≦5.9, a total cold rolling ratio is equal to or greater than 70%, a recrystallization ratio is equal to or less than 45% a an average grain size of recrystallized grains is in the range of 0.7 to 7 μm, an average grain diameter of precipitates is in the range of 2.0 to 11 nm, and an average grain size of fine crystals is in the range of 0.3 to 4 μm. By the precipitates of Co and P, the solid solution of Sn, and fine crystals, the strength, conductivity and ductility of the copper alloy rolled sheet are improved. | 11-03-2011 |
| 20110265916 | HIGH-STRENGTH AND HIGH-ELECTRICAL CONDUCTIVITY COPPER ALLOY ROLLED SHEET AND METHOD OF MANUFACTURING THE SAME - A high-strength and high-electrical conductivity copper alloy rolled sheet has an alloy composition containing 0.14 to 0.34 mass % of Co, 0.046 to 0.098 mass % of P, 0.005 to 1.4 mass % of Sn and the balance including Cu and inevitable impurities, wherein [Co] mass % representing a Co content and [P] mass % representing a P content satisfy the relationship of 3.0≦([Co]−0.007)/([P]−0.009)≦5.9. In a metal structure, precipitates are formed, the shape of the precipitates is substantially circular or elliptical, the precipitates have an average grain diameter of 1.5 to 9.0 nm, or 90% or more of all the precipitates have a diameter of 15 nm or less to be fine precipitates, and the precipitates are uniformly dispersed. With the precipitation of the fine precipitates of Co and P and the solid-solution of Sn, the strength, conductivity and heat resistance are improved and a reduction in costs is realized. | 11-03-2011 |
| 20110174417 | HIGH STRENGTH AND HIGH CONDUCTIVITY COPPER ALLOY PIPE, ROD, OR WIRE - A high strength and high conductivity copper alloy pipe, rod, or wire is composed of an alloy composition containing 0.13 to 0.33 mass % of Co, 0.044 to 0.097 mass % of P, 0.005 to 0.80 mass % of Sn, and 0.00005 to 0.0050 mass % of O, wherein a content [Co] mass % of Co and a content [P] mass % of P satisfy a relationship of 2.9≦([Co]−0.007)/([P]−0.008)≦6.1, and the remainder includes Cu and inevitable impurities. The high strength and high conductivity copper alloy pipe, rod, or wire is produced by a process including a hot extruding process. Strength and conductivity of the high strength and high conductivity copper pipe, rod, or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. | 07-21-2011 |
| 20110146855 | Cu-Mg-P based copper alloy material and method of producing the same - A copper alloy material includes, by mass %, Mg of 0.3 to 2%, P of 0.001 to 0.1%, and the balance including Cu and inevitable impurities. An area fraction of such crystal grains that an average misorientation between all the pixels in each crystal grain is less than 4° is 45 to 55% of a measured area, when orientations of all the pixels in the measured area of the surface of the copper alloy material are measured by an EBSD method with a scanning electron microscope of an electron backscattered diffraction image system and a boundary in which a misorientation between adjacent pixels is 5° or more is considered as a crystal grain boundary, and a tensile strength is 641 to 708 N/mm | 06-23-2011 |
| 20110100676 | HIGH STRENGTH AND HIGH CONDUCTIVITY COPPER ALLOY ROD OR WIRE - A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0≦([Co]−0.007)/([P]−0.008)≦6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced. | 05-05-2011 |
| 20110097238 | SILVER-WHITE COPPER ALLOY AND PROCESS FOR PRODUCING THE SAME - To provide a silver-white copper alloy which represents a silver-white color equivalent to that of nickel silver and is excellent in hot workability and the like. The silver-white copper alloy includes 47.5 to 50.5 mass % of Cu, 7.8 to 9.8 mass % of Ni, 4.7 to 6.3 mass % of Mn, and the remainder including Zn, and the silver-white copper alloy has an alloy composition satisfying relationships of f1=[Cu]+1.4×[Ni]+0.3×[Mn]=62.0 to 64.0, f2=[Mn]/[Ni]=0.49 to 0.68, and f3=[Ni]+[Mn]=13.0 to 15.5 among a content [Cu] mass % of Cu, a content [Ni] mass % of Ni, and a content [Mn] mass % of Mn, and has a metal structure in which β phases at an area ratio of 2 to 17% are dispersed in an α-phase matrix. The copper alloy is provided as a hot processing material or continuous casting material formed by performing one or more heat treatments and cold processes on a hot processing raw material formed by performing a hot process on an ingot or a casting raw material obtained by continuous casting. | 04-28-2011 |
| 20110094085 | METHOD FOR PRODUCING CONTOUR STRIP - A method for producing a contour strip includes a rough rolling step for rolling a plate material to form a contour molding material, a slitting step for slitting the contour molding material at the middle position in the width direction of a thick portion or a thin portion at both side edge portions thereof to form a contour slit material, and a stretching step for stretching the contour slit material to obtain a contour strip. Rolling is carried out in the rough rolling step so that Δt is 0.01 or less, e is 0.15 or less, D | 04-28-2011 |
| 20110056596 | HIGH STRENGTH AND HIGH THERMAL CONDUCTIVITY COPPER ALLOY TUBE AND METHOD FOR PRODUCING THE SAME - A high strength and high thermal conductivity copper alloy tube contains: Co of 0.12 to 0.32 mass %; P of 0.042 to 0.095 mass %; and Sn of 0.005 to 0.30 mass %, wherein a relationship of 3.0≦([Co]−0.007)/([P]−0.008)≦6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P, and the remainder includes Cu and inevitable impurities. Even when a temperature is increased by heat generated by a drawing process, a recrystallization temperature is increased by uniform precipitation of a compound of Co and P and by solid-solution of Sn. Thus, the generation of recrystallization nucleuses is delayed, thereby improving heat resistance and pressure resistance of the high strength and high thermal conductivity copper alloy tube. | 03-10-2011 |
| 20100172791 | ALUMINUM-BRONZE ALLOY AS RAW MATERIALS FOR SEMI SOLID METAL CASTING - An aluminum-bronze alloy as raw materials for Semi Solid Metal casting has a component composition containing Al of 5 to 10 mass %, Zr of 0.0005 to 0.04 mass %, and P of 0.01 to 0.25 mass %, and a balance of Cu and inevitable impurities, further containing Si of 0.5 to 3 mass % as needed, and further containing one or more kinds of Pb of 0.005 to 0.45 mass %, Bi of 0.005 to 0.45 mass %, Se of 0.03 to 0.45 mass %, and Te of 0.01 to 0.45 mass % as needed. | 07-08-2010 |
| 20100166595 | PHOSPHOR-BRONZE ALLOY AS RAW MATERIALS FOR SEMI SOLID METAL CASTING - A phosphor-bronze alloy as raw materials for Semi Solid Metal casting has a component composition containing Sn of 4 to 15 mass %, Zr of 0.0005 to 0.04 mass %, P of 0.01 to 0.25 mass %, and a balance of Cu and inevitable impurities, further containing Zn of 0.1 to 7.5 mass % as needed, and further containing one or more kinds of Pb of 0.01 to 4.5 mass %, Bi of 0.01 to 3.0 mass %, Se of 0.03 to 1.0 mass %, and Te of 0.01 to 1.0 mass % as needed. | 07-01-2010 |
| 20090320964 | HEAT RESISTANCE COPPER ALLOY MATERIALS - The present invention discloses a heat resistance copper alloy material characterized in that said copper alloy material comprises 0.15 to 0.33 mass percent of Co, 0.041 to 0.089 mass percent of P, 0.02 to 0.25 mass percent of Sn, 0.01 to 0.40 mass percent of Zn and the remaining mass percent of Cu and inevitable impurities, wherein each content of Co, P, Sn and Zn satisfies the relationships 2.4≦([Co]−0.02)/[P]≦5.2 and 0.20≦[Co]+0.5 [P]+0.9 [Sn]+0.1 [Zn]≦0.54, wherein [Co], [P], [Sn] and [Zn] are said mass percents of Co, P, Sn and Zn content, respectively; and said copper alloy material is a pipe, plate, bar, wire or worked material obtained by working said pipe, plate, bar or wire material into predetermined shapes. | 12-31-2009 |
| 20090294087 | BRASS ALLOY AS RAW MATERIALS FOR SEMI SOLID METAL CASTING - A brass alloy as raw materials for Semi Solid Metal casting has a component composition containing Zn of 8 to 40 mass %, Zr of 0.0005 to 0.04 mass %, P of 0.01 to 0.25 mass %, and a balance of Cu and inevitable impurities, further containing one or more kinds of Si of 2 to 5 mass %, Sn of 0.05 to 6 mass %, and Al of 0.05 to 3.5 mass % as needed, and further containing one or more kinds of Pb of 0.005 to 0.45 mass %, Bi of 0.005 to 0.45 mass %, Se of 0.03 to 0.45 mass %, and Te of 0.01 to 0.45 mass %. | 12-03-2009 |
| 20090016927 | BRASS ALLOY AS RAW MATERIALS FOR SEMI SOLID METAL CASTING - A brass alloy as raw materials for Semi Solid Metal casting has a component composition containing Zn of 8 to 40 mass %, Zr of 0.0005 to 0.04 mass %, P of 0.01 to 0.25 mass %, and a balance of Cu and inevitable impurities, further containing one or more kinds of Si of 2 to 5 mass %, Sn of 0.05 to 6 mass %, and Al of 0.05 to 3.5 mass % as needed, and further containing one or more kinds of Pb of 0.005 to 0.45 mass %, Bi of 0.005 to 0.45 mass %, Se of 0.03 to 0.45 mass %, and Te of 0.01 to 0.45 mass %. | 01-15-2009 |
