Mitsubishi Electrict Corporation Patent applications |
Patent application number | Title | Published |
20140367701 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The semiconductor device includes; a semiconductor element in which a metallization layer is formed on the backside side; a metallic lead frame that is arranged in parallel, with a distance spaced apart from the semiconductor element; a first bonding layer that is provided between the semiconductor element and the lead frame, and is bonded to the metallization layer; and a second bonding layer that is provided between the semiconductor element and the lead frame, and bonds the first bonding layer to the lead frame. The first bonding layer is expanded at a central portion toward the lead frame. | 12-18-2014 |
20140360850 | POWER SWITCHGEAR - Each outermost part of fixed-side connection conductors, fixed-side fixed contacts, movable-side fixed contacts, and movable-side connection conductors are placed outside of an outermost diameter of a fixed-side conductor and a movable-side conductor, as viewed from an axis line of the fixed-side conductor and the movable-side conductor as a center. This arrangement provides a power switchgear that can diminish mutual effects of currents among conduction parts to suppress decrease in a current-carrying capacity for each of the conduction parts and to increase a current-carrying capacity for a total of the conduction parts, without increasing the size of the switchgear. | 12-11-2014 |
20140346914 | STATOR WINDING OF ELECTRICAL ROTATING MACHINE - In a three-phase, four-pole, four-parallel-circuit stator winding of an electrical rotating machine, each of two sets of U-phase output terminals U1, U2 is formed of two sets of parallel circuits each formed of windings having a same pitch (one is formed of first and second winding circuits | 11-27-2014 |