MICROTIPS ELECTRONICS CO., LTD. Patent applications |
Patent application number | Title | Published |
20130292094 | Heat Dissipating Device - A heat dissipating device includes an outer heat conducting unit, disposed with outer heat conducting plates, and an inner heat conducting unit. The outer heat conducting unit includes an outer surrounding wall having inner and outer wall surfaces. The inner wall surface defines a space. The outer surrounding wall further has an opening sealed by a cover. The inner heat conducting unit is formed as a separate component from the outer heat conducting unit, is received in the space, and is in thermal contact with the inner wall surface of the outer surrounding wall. | 11-07-2013 |
20130292092 | Heat Dissipating Device - A heat dissipating device includes a heat conducting member and a coolant storing unit. The heat conducting member includes a surrounding wall that defines an internal space and that is adapted to be placed in contact with a heat source, and a plurality of heat conducting plates that are spacedly disposed in the internal space, that are connected to the surrounding wall, and that cooperate with the surrounding wall to define a plurality of flow channels. The coolant storing unit stores a coolant and is in fluid connection with the heat conducting member. The flow channels extend upwardly, and the coolant flows along the flow channels when the heat of the heat source is transmitted to the coolant. | 11-07-2013 |