MICRON MACHINERY CO., LTD Patent applications |
Patent application number | Title | Published |
20160059372 | CENTERLESS GRINDING APPARATUS - Some implementations of the described invention provide an improved centerless grinding apparatus in which grinding is efficiently operated by reducing the idle time of the grinding wheel. While the described apparatus can comprise any suitable feature, in some cases, it includes a first regulating wheel and a second regulating wheel are axially aligned side by side. In some cases, a first grinding area is provided between the first regulating wheel and a first blade. In some cases, a second grinding area is provided between the second regulating wheel and a second blade. Additionally, in some cases, a grinding wheel is mounted on a grinding wheel Z-slide to be moved reciprocatively between the first grinding area and the second grinding area. In this way, grinding is efficiently operated by reducing the idle time of the grinding wheel. | 03-03-2016 |
20150231718 | HIGH-FREQUENCY-VIBRATION-ASSISTED ELECTROLYTIC GRINDING METHOD AND DEVICE THEREFOR - To provide a high-frequency-vibration-assisted electrolytic grinding method and a device therefor in which micro abrasive grains can be used so as to improve the grinding accuracy and efficiency. A high-frequency-vibration-assisted electrolytic grinding method in which a work is grinded by a grinding stone while electrolytic reaction is performed by applying a voltage between the grinding stone and the work through an electrolytic solution and high-frequency vibration is transmitted to the grinding stone or the work wherein; the grinding stone has non-conductive micro abrasive grains with grain sizes of less than #400 in accordance with the JIS R6001 standard of grinding stones for precision polishing projecting from its surface formed of conductive binding material, and the distance between the grinding stone and the work, which is regulated by the projecting lengths of the micro abrasive grains from the base of the grinding stone, is set to less than 0.02 mm. | 08-20-2015 |
20100173571 | CENTERLESS GRINDING METHOD - To provide a centerless grinding method which facilitates a tooling change and enables automation. A blade | 07-08-2010 |