MICROCOSM TECHNOLOGY CO., LTD. Patent applications |
Patent application number | Title | Published |
20150163926 | COATING DEVICE AND COATING METHOD - The disclosure provides a coating device and a coating method. The coating device is used for coating viscous ink on a substrate to form a film. The substrate includes two opposite mounting surfaces. The coating device comprising: an accommodating mechanism, a coating mechanism and a forming mechanism. The coating mechanism includes two coating units. Each coating unit includes a rotatable filling roller for filling with pressure the viscous ink in the hole on the corresponding mounting surface to form an initial layer. The forming mechanism is used for scraping the initial layer covering on the mounting surfaces to form the film. The method of coating and then adjusting the thickness of the film may improve the quality of the products. By using the above disclosure, the production line can be simplified to lower the device costs, and the manufacturing time can be reduced to improve the manufacturing efficiency. | 06-11-2015 |
20140338963 | VERTICAL CONDUCTIVE UNIT AND MANUFACTURING METHOD THEREOF - The invention provides a vertical conductive unit. The vertical conductive unit comprises an insulating layer comprising a connecting via, a first conductor, a second conductor, and a third conductor. The insulating layer comprises photosensitive polyimide, and the glass transition temperature of the photosensitive polyimide is lower than about 200° C. The invention also provides a method for manufacturing the vertical conductive unit. | 11-20-2014 |
20100252940 | POLYIMIDE SHIELD AND INTEGRATED CIRCUIT STRUCTURE HAVING THE SAME - A polyimide shield includes a base film layer that is made from polyimide, and a colored film layer that overlies the base film layer and that contains a coloring agent dispersed in a polymer. A method of making the polyimide shield includes forming the base film layer from polyimide and applying a liquid composition onto the base film layer. The liquid composition contains a polymer and the coloring agent that is dispersed in the polymer. An integrated circuit structure includes a circuitry substrate and the polyimide shield that covers the circuitry substrate. | 10-07-2010 |