MEMSensing Microsystems (Suzhou, China) Co., Ltd. Patent applications |
Patent application number | Title | Published |
20160088402 | CAPACITIVE MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE AND METHOD FOR MANUFACTURING THE SAME - The invention relates to a capacitive MEMS microphone and a method for manufacturing the same. The microphone includes: a substrate; a first dielectric supporting layer on the substrate; a movable sensitive layer formed on the first dielectric supporting layer and having a movable diaphragm extending within the air; a backplate disposed over the movable sensitive layer and spaced from the movable diaphragm; a chamber recessed from and extending through the substrate and the first dielectric supporting layer; and an impact resisting device connecting to the movable diaphragm. The impact resisting device is exposed downwardly and disposed above the chamber. The movable sensitive layer has a number of anchors formed around the movable diaphragm, a number of flexible beams each of which is employed to connect one of the anchors to the movable diaphragm, and a bonding portion connecting to the anchor. | 03-24-2016 |
20140332909 | INTEGRATED CHIP WITH MICRO-ELECTRO-MECHANICAL SYSTEM AND INTEGRATED CIRCUIT MOUNTED THEREIN AND METHOD FOR MANUFACTURING THE SAME - The invention relates to an integrated chip with an MEMS and an integrated circuit mounted therein and a method for manufacturing the same. The method includes the steps of: S | 11-13-2014 |