20090212409 | Stackable Semiconductor Package and Stack Method Thereof - A stackable semiconductor package is disclosed. In the stackable semiconductor package, land grid array (LGA) or ball grid array (BGA) semiconductor packages are stacked in the vertical direction. The stackable semiconductor package comprises: a first semiconductor package including a first substrate, at least one first semiconductor die mounted on the first substrate to be electrically connected to the first substrate, and a first encapsulant molded on the first substrate to surround the first semiconductor die; a second semiconductor package including a second substrate, at least one second semiconductor die mounted on the second substrate to be electrically connected to the second substrate, and a second encapsulant molded on the second substrate to surround the second semiconductor die; and one or more interposers positioned between the first and second semiconductor packages to electrically connect the first substrate to the second substrate so that the first and second semiconductor packages are stacked in the vertical direction. Further disclosed is stack method of semiconductor package. | 08-27-2009 |