MEMC ELECTRONIC MATERIALS, S.P.A. Patent applications |
Patent application number | Title | Published |
20160017513 | GAS DOPING SYSTEMS FOR CONTROLLED DOPING OF A MELT OF SEMICONDUCTOR OR SOLAR-GRADE MATERIAL - A crystal pulling apparatus for producing an ingot is provided. The apparatus includes a furnace and a gas doping system. The furnace includes a crucible for holding a melt. The gas doping system includes a feeding tube, an evaporation receptacle, and a fluid flow restrictor. The feeding tube is positioned within the furnace, and includes at least one feeding tube sidewall, a first end through which a solid dopant is introduced into the feeding tube, and an opening opposite the first end through which a gaseous dopant is introduced into the furnace. The evaporation receptacle is configured to vaporize the dopant therein, and is disposed near the opening of the feeding tube. The fluid flow restrictor is configured to permit the passage of solid dopant therethrough and restrict the flow of gaseous dopant therethrough, and is disposed within the feeding tube between the first end and the evaporation receptacle. | 01-21-2016 |
20140060422 | METHOD OF LOADING A CHARGE OF POLYSILICON INTO A CRUCIBLE - A method of loading a crucible includes loading a first layer of polysilicon chunks into the crucible and loading a second layer of granular polysilicon into the crucible to form a polysilicon charge such that the packing density of the polysilicon charge within the crucible is greater than 0.70. | 03-06-2014 |
20140033968 | Controlled Doping Device For Single Crystal Semiconductor Material and Related Methods - A doping device for a furnace containing a melt includes an upper chamber configured to hold solid dopant particles, a lower chamber, and a feeding tube coupled between the upper chamber and the lower chamber. The feeding tube is configured to supply dopant gas from the upper chamber to the lower chamber, and the lower chamber is configured to diffuse dopant gas over a top surface of the melt. | 02-06-2014 |
20130327506 | METHOD FOR TRANSFERRING HEAT BETWEEN TWO PROCESS STREAMS - Shell and tube heat exchangers that include a baffle arrangement that improves the temperature profile and flow pattern throughout the exchanger and/or that are integral with a reaction vessel are disclosed. Methods for using the exchangers including methods that involve use of the exchanger and a reaction vessel to produce a reaction product gas containing trichlorosilane are also disclosed. | 12-12-2013 |
20130237126 | System For Machining Seed Rods For Use In A Chemical Vapor Deposition Polysilicon Reactor - A method for machining a profile into a silicon seed rod using a machine. The silicon seed rod is capable of being used in a chemical vapor deposition polysilicon reactor. The machine includes a plurality of grinding wheels. The method includes grinding a v-shaped profile into a first end of the silicon seed rod with one of the plurality of grinding wheels and grinding a conical profile in a second end of the silicon seed rod with another of the plurality of grinding wheels. | 09-12-2013 |
20130224099 | METHODS FOR REACTING COMPOUNDS - Shell and tube heat exchangers that include a baffle arrangement that improves the temperature profile and flow pattern throughout the exchanger and/or that are integral with a reaction vessel are disclosed. Methods for using the exchangers including methods that involve use of the exchanger and a reaction vessel to produce a reaction product gas containing trichlorosilane are also disclosed. | 08-29-2013 |
20130206163 | Methods and Systems For Removing Contaminants From A Wire Of A Saw - A system for ultrasonically cleaning one or more wires of a wire saw for slicing semiconductor or solar material into wafers. The system includes an ultrasonic transducer connected to a sonotrode. The system also includes a sonotrode plate adjacent to one or more of the wires. The sonotrode plate has an opening that exposes the sonotrode to one or more of the wires. The system further includes a tank for delivering a flow of liquid to contact the sonotrode and one or more of the wires. The tank is positioned on the same side of the wires as the sonotrode plate. The ultrasonic transducer is configured to vibrate and form cavitations in the liquid for the removal of contaminants from a surface of one or more of the wires. | 08-15-2013 |
20130174828 | Systems and Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw - Systems and methods are disclosed for controlling the surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by changing the temperature and/or flow rate of a temperature-controlling fluid that comes in contact with the ingot. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology. | 07-11-2013 |
20130144421 | Systems For Controlling Temperature Of Bearings In A Wire Saw - Systems and are disclosed for controlling the temperature of bearings in a wire saw machine. The systems described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by controlling the temperature of bearings in the wire saw by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings supporting wire guides of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology. | 06-06-2013 |
20130144420 | Systems For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw - Systems are disclosed for controlling the surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings supporting wire guides of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology. | 06-06-2013 |
20130139801 | Methods For Controlling Displacement Of Bearings In A Wire Saw - Methods are disclosed for controlling the displacement of bearings in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by controlling displacement of bearings in the wire saw by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings supporting wire guides of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology. | 06-06-2013 |
20130139800 | Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw - Methods are disclosed for controlling surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings supporting wire guides of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology. | 06-06-2013 |
20130017139 | Methods and Systems For Monitoring and Controlling Silicon Rod Temperature - Systems and methods are disclosed for monitoring and controlling silicon rod temperature. One example is a method of monitoring a surface temperature of at least one silicon rod in a chemical vapor deposition (CVD) reactor during a CVD process. The method includes capturing an image of an interior of the CVD reactor. The image includes a silicon rod. The image is scanned to identify a left edge of the silicon rod and a right edge of the silicon rod. A target area is identified midway between the left edge and the right edge. A temperature of the silicon rod in the target area is determined. | 01-17-2013 |
20130014738 | Saw For Cutting Silicon Into Seed Rods For Use In A Chemical Vapor Deposition Polysilicon Reactor - Systems and methods are provided for cutting silicon into seed rods for use in a chemical vapor deposition polysilicon reactor. A method includes cutting the silicon ingot with saw blades into silicon slabs, rotating the silicon slabs, and cutting the silicon slabs into smaller-sized silicon seed rods for use in the chemical vapor deposition polysilicon reactor. | 01-17-2013 |
20130000672 | CLEANING TOOL FOR POLYSILICON REACTOR - Systems and methods are provided for cleaning an interior surface of a chemical vapor deposition reactor bell used in the production of polysilicon. | 01-03-2013 |
20120325645 | Process and System for the Purification of Trichlorosilane and Silicon Tetrachloride - The invention concerns a process (and a corresponding plant) for the purification of trichlorosilane and/or silicon tetrachloride comprising the following steps of treating technical grade trichlorosilane and/or technical grade silicon tetrachloride: complexation of the boron impurities (trichloride (BCl | 12-27-2012 |
20120322175 | Methods and Systems For Controlling SiIicon Rod Temperature - Systems and methods are provided for controlling silicon rod temperature. In one example, a method of controlling a surface temperature of at least one silicon rod in a chemical vapor deposition (CVD) reactor during a CVD process is presented. The method includes determining an electrical resistance of the at least one silicon rod, comparing the resistance to a set point to determine a difference, and controlling a power supply to control a power output coupled to the at least one silicon rod to minimize an absolute value of the difference. | 12-20-2012 |
20120237678 | Tool For Harvesting Polycrystalline Silicon-coated Rods From A Chemical Vapor Deposition Reactor - A tool for harvesting polycrystalline silicon-coated rods from a chemical vapor deposition reactor includes a body including outer walls sized for enclosing the rods within the outer walls. Each outer wall includes a door for allowing access to at least one of the rods. | 09-20-2012 |
20120199324 | REACTOR APPARATUS AND METHODS FOR REACTING COMPOUNDS - Shell and tube heat exchangers that include a baffle arrangement that improves the temperature profile and flow pattern throughout the exchanger and/or that are integral with a reaction vessel are disclosed. Methods for using the exchangers including methods that involve use of the exchanger and a reaction vessel to produce a reaction product gas containing trichlorosilane are also disclosed. | 08-09-2012 |
20120199323 | SHELL AND TUBE HEAT EXCHANGERS AND METHODS OF USING SUCH HEAT EXCHANGERS - Shell and tube heat exchangers that include a baffle arrangement that improves the temperature profile and flow pattern throughout the exchanger and/or that are integral with a reaction vessel are disclosed. Methods for using the exchangers including methods that involve use of the exchanger and a reaction vessel to produce a reaction product gas containing trichlorosilane are also disclosed. | 08-09-2012 |
20110250366 | BELL JAR FOR SIEMENS REACTOR INCLUDING THERMAL RADIATION SHIELD - A bell jar for a Siemens reactor of the type used to deposit polycrystalline silicon on a plurality of heated silicon rods via chemical vapor deposition process. The bell jar includes a thermally conductive inner wall having an interior surface at least partially defining an interior space adapted to receive the plurality of heated silicon rods therein. A thermal radiation shield is in the interior space generally adjacent to and in opposing relationship with the interior surface of the inner wall. The thermal radiation shield is substantially opaque to thermal radiation emitted from the plurality of heated silicon rods in the interior space of the bell jar. | 10-13-2011 |
20110114469 | Process and System for the Purification of Trichlorosilane and Silicon Tetrachloride - The present disclosure relates to processes and systems for purifying technical grade trichlorosilane and/or technical grade silicon tetrachloride into electronic grade trichlorosilane and/or electronic grade silicon tetrachloride. | 05-19-2011 |
20080314728 | Process and SYSTEM for the Purification of Trichlorosilane and Silicon Tetrachloride - The invention concerns a process (and a corresponding plant) for the purification of trichlorosilane and/or silicon tetrachloride comprising the following steps of treating technical grade trichlorosilane and/or technical grade silicon tetrachloride: complexation of the boron impurities (trichloride BCI3) and other metallic impurities by addition of diphenylthiocarbazone and/or triphenylchloromethane, with the formation of complex macromolecules having high boiling point, first column distillation of the complexation step products, wherein the complexed boron impurities, together with other metallic impurities are removed as bottoms, and second column distillation of the tops of the previous distillation, wherein electronic grade trichlorosilane (plus dichlorosilane possible present) and/or silicon tetrachloride are obtained as tops and phosphorus chlorides PCI3 and phosphorus containing compounds, arsenic chlorides AsCI3 and arsenic containing compounds, aluminium compounds, antimony compounds and in general all the present metals and metalloids compounds and carbo-silanes compounds, having a certain residual amount of trichlorosilane and/or silicon tetrachloride, are obtained as bottoms. | 12-25-2008 |