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MEDIATEK (SHENZHEN) INC.
| MEDIATEK (SHENZHEN) INC. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20120018498 | PRE-SOLDER METHOD AND REWORK METHOD FOR MULTI-ROW QFN CHIP - A pre-solder method for a multi-row quad flat no-lead (QFN) packaged chip is provided. Solder paste is applied on at least one pad of the multi-row QFN packaged chip. The multi-row QFN packaged chip is heated, such that the solder paste on the at least one pad of the multi-row QFN packaged chip becomes solid solder before the multi-row QFN packaged chip is mounted on a substrate. | 01-26-2012 |