| 20090029545 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The present invention provides a method of manufacturing a semiconductor device which method enables a reduction in via resistance. The method of manufacturing the semiconductor device includes the steps of removing a barrier metal film from a bottom surface of a via, with the barrier metal film remaining on a bottom surface of a trench, modifying lower wiring exposed from the bottom surface of the via to form a modified layer, removing the modified layer to form an engraving (recess portion), and depositing a copper film in the engraving, the via, and the trench to form upper wiring and a via plug. | 01-29-2009 |
