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MAT-TECH B.V.
DELFT, NL
| MAT-TECH B.V. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20090162622 | COMPOSITION OF A SOLDER, AND METHOD OF MANUFACTURING A SOLDER CONNECTION - The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices. | 06-25-2009 |