| MARLOW INDUSTRIES, INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120000207 | SYSTEM AND METHOD FOR THERMOELECTRIC PERSONAL COMFORT CONTROLLED BEDDING - A condensate management system is adapted for use in a personal comfort system with an air conditioning system having a thermoelectric engine including a thermoelectric core, a supply heat exchanger and an exhaust heat exchanger. Condensate is managed by a primary condensate management system configured to draw condensate away from the thermoelectric core, the supply heat exchanger and/or the exhaust heat exchanger using wicking material. Optionally, a secondary condensation management system may be included which is configured to generate a condensate air flow operable for drawing moisture away from a collection tray. | 01-05-2012 |
| 20110314837 | SYSTEM AND METHOD FOR THERMOELECTRIC PERSONAL COMFORT CONTROLLED BEDDING - A system and method for controlling ventilation in a bed (mattress) includes an user-controlled air conditioning control system for generating and supplying a conditioned air flow to a distribution layer/system located on or near the mattress. The distribution layer/system includes a spacer structure surrounded by fabric material(s) and configured to receive the conditioned air flow and provide a cooling or heating effect to a body adjacent the mattress. | 12-29-2011 |
| 20110289684 | SYSTEM AND METHOD FOR THERMOELECTRIC PERSONAL COMFORT CONTROLLED BEDDING - A distribution system is adapted for use with a mattress and a personal comfort system with an air conditioning system operable for outputting a conditioned air flow. The distribution system includes at least top and bottom layers of fabric material and a spacer structure disposed between the bottom and top layers. The spacer structure defines an internal volume within the distribution layer and is configured to enable the received conditioned air flow to flow therethrough. This flow of conditioned air has a cooling or heating effect on a body on the mattress. | 12-01-2011 |
| 20110271994 | Hot Side Heat Exchanger Design And Materials - In certain embodiments, a hot side heat exchanger (HSHX) includes a folded fin structure including a plurality of fins. Each of the plurality of fins is formed from a composite fin material having a first fin layer positioned between a second fin layer and a third fin layer, the first fin layer being a first material and the second and third fin layers being a second material. A base plate is in thermal communication with the plurality of folded fins. The base plate is formed from a composite base plate material having a first base plate layer and a second base plate layer, the first base plate layer being a first material and the second base plate layer being the second material. The first material has a greater thermal conductivity than the second material and the second material has greater corrosion resistance and high temperature strength than the first material. | 11-10-2011 |
| 20100199687 | Temperature control device - A temperature control device includes a thermoelectric device and a first sink. The thermoelectric device includes a plurality of thermoelectric elements electrically interconnected with one another by a plurality of electrical interconnects which are coupled between an interior surface of a first plate and an interior surface of a second plate. The first sink has a flat bottom and a plurality of generally parallel fins extending out of the flat bottom. Also, the flat bottom is coupled to an exterior surface of the first plate by a coupling media that includes a resilient and thermally-conductive pad. | 08-12-2010 |
| 20100081191 | ANISOTROPIC HEAT SPREADER FOR USE WITH A THERMOELECTRIC DEVICE - A well block for use with a Polymerase Chain Reaction (PCR) Cycler may include a body for holding a plurality of specimen vials, a base for attaching the well block to a temperature control device, and a temperature plate coupled to the base. Further, the temperature plate may include an anisotropic material for transferring thermal energy between the body and the temperature control device. | 04-01-2010 |
| 20090211619 | Thermoelectric Material and Device Incorporating Same - A thermoelectric device includes a plurality of thermoelectric elements coupled between a first plate and a second plate. The plurality of thermoelectric elements are electrically interconnected with one another by a plurality of electrical interconnects and the plurality of thermoelectric elements include at least one thermoelectric element comprising a material having the formula A | 08-27-2009 |
| 20090093078 | System and Method for High Temperature Compact Thermoelectric Generator (TEG) Device Construction - A method for creating an array of thermoelectric elements includes applying a first coating of dielectric material to P-type wafers and N-type wafers to form coated P-type wafers and coated N-type wafers. A P/N-type ingot is formed from the coated P-type wafers and the coated N-type wafers. The coated P-type wafers and the coated N-type wafers are alternatingly arranged in the P/N-type ingot. P/N-type wafers comprising P-type elements and N-type elements are sliced from the P/N-type ingot and a second coating of the dielectric material is applied to the P/N-type wafers to form coated P/N-type wafers. Furthermore, a P/N-type array from the coated P/N-type wafers. | 04-09-2009 |
| 20090090544 | System and Method for Substrate with Interconnects and Sealing Surface - A method includes providing a base. At least one lead is deposited on the base, the at least one lead including a trace of electrically conductive material having a first end and a second end. A dielectric layer is deposited on a portion of the at least one lead between the first end and the second end. A sealing surface is deposited on a portion of the dielectric layer, the sealing surface including a contiguous shape of metal separating an enclosed area of the base located inside the contiguous shape from an open area of the base located outside the contiguous shape. The first end of the at least one lead is located in the enclosed area and the second end of the at least one lead is located in the open area. Moreover, the dielectric layer electrically insulates the at least one lead from the sealing surface. | 04-09-2009 |
| 20090090409 | System and Method for Assembling a Microthermoelectric Device - A method for creating an array of thermoelectric elements may include providing a rigid block including P-type material layers and N-type material layers stacked in an alternating relationship and bonded together by an adhesive. First channels may be formed in the block parallel to the P-type material layers and the N-type material layers and may partially extend through a depth of the block leaving an uncut bottom on the block. The first channels may be filled with an electrically and thermally insulating material and second channels may be formed in the block, transverse to the first channels. The second channels may partially extend through the depth of the block. The second channels may be filled with the electrically and thermally insulating material and the uncut bottom may be removed from the block. | 04-09-2009 |
| 20080245397 | System and Method of Manufacturing Thermoelectric Devices - A method of forming an P/N-type array of P-type and N-type material includes stacking a plurality of P-type material wafers and a plurality of N-type material wafers into a P/N-type array. At least one spacer is provided between adjacent wafers. The P-type material wafers and the N-type material wafers are boned together the into a composite P/N-type brick. The method may also include providing a second composite P/N-type brick. A plurality of channels and fingers are created in the first and second composite P/N-type bricks. The first and second composite P/N-type bricks are fit together to form a P/N-type mosaic. Alternatively, the method may include providing a single P/N-type brick. A plurality of channels is created in the composite P/N-type brick. The channels are then back filled with an electrically and thermally insulating adhesive so that a P/N-type grid of P-type elements and N-type elements is formed. | 10-09-2008 |
