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MANAC INC.
Fukuyama-shi, Hiroshima, JP
| MANAC INC. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20100059261 | REACTIVE MONOMER AND RESIN COMPOSITION CONTAINING SAME - A material for use in flexible printed wiring board having high reliability and allowing for processing fine wiring includes a compound represented by the following general formula (I): | 03-11-2010 |