MAN ZAI INDUSTRIAL CO., LTD.
|MAN ZAI INDUSTRIAL CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20110226456||HEAT DISSIPATION DEVICE - A heat dissipation device has an inlet pipeline, an outlet pipeline, at least one heat-dissipating unit and at least one actuator. Each of the at least one heat-dissipating unit is connected to the inlet pipeline and the outlet pipeline and includes multiple heat-dissipating elements being connected to each other. The at least one actuator is mounted on the inlet pipeline. The heat dissipation device is mounted around a large-sized electronic appliance to absorb and dissipate the heat generated by the large-sized electronic appliance so as to effectively reduce the working temperature of the electronic appliance to normal level. Therefore, the large-sized electronic appliance can work safely and is power-saving and environmental friendly.||09-22-2011|
|20100315830||HEAT DISSIPATION DEVICE OF VEHICLE LAMP AND INTERPOSING ELEMENT THEREOF - A heat dissipation device of a vehicle lamp and an interposing element thereof are provided. The heat dissipation device is installed in a lamp room which is divided by the interposing element into a front partition and a rear partition. A heat sink is installed in the interposing elements. An air feeding fan is disposed in an air feeding channel of the interposing element, for drawing air in the front partition to the rear partition through the air feeding channel. Further, a back flow fan is disposed in the rear partition, for drawing air in the rear partition to the front partition through a back flow channel. Whereby, the air in the front partition is cooled down through an external air flow passing through the lamp cover. Then, the heat sink dissipates heat of the air flow with the relatively low temperature in the front partition to the rear partition.||12-16-2010|
|20090205809||LIQUID COOLING DEVICE - A liquid cooling device has a main liquid block, a pump, a heat sink, and at least one auxiliary liquid block that are in fluid communications. The auxiliary liquid block has a body and a partition that separates the body into a reservoir and a heat-absorbing chamber. The reservoir and the heat-absorbing chamber communicate with and other via a through hole on the partition. Since the heat-absorbing chamber is mounted to be adjacent to an electronic component that generates heat, the fluid in the heat-absorbing chamber absorbs the heat. When the fluid in the heat-absorbing chamber vaporizes and decreases the fluid in the reservoir has a higher level and thus flows to the heat-absorbing chamber via the through hole. Therefore, the heat-dissipating ability of the liquid cooling device is increased.||08-20-2009|
|20090205808||LIQUID COOLING DEVICE FOR MULTIPLE ELECTRONIC COMPONENTS - A liquid cooling device for multiple electronic components has two liquid blocks, a heat-dissipating plate, a pump and a heat sink. The two liquid blocks and the heat sink are connected and communicated with other via tubing. The pump operates to make a coolant circulate among the two liquid blocks and the heat sink. The heat-dissipating plate is integrally formed with one liquid block. The heat-dissipating plate is disposed on another separate electronic component for absorbing heat. Therefore, the liquid cooling device has only two liquid blocks, but can dissipate heat generated by three electronic components.||08-20-2009|
|20090040723||HEAT-DISSIPATING DEVICE WITH HIGH HEAT-DISSIPATING EFFICIENCY - A heat-dissipating device includes a housing, a partitioning member, a finned structure, and a high thermal-conductivity strip. The housing defines an inner space, and has a top surface formed with a retaining groove, and an inlet and an outlet. The partitioning member is disposed in the inner space so as to divide the inner space into first and second compartments that are respectively connected to the inlet and the outlet. The finned structure includes a plurality of partitioning plates disposed in the first compartment so as to divide the first compartment into a plurality of partitioned sections that are connected to form a continuous meandering fluid path, and a plurality of heat-dissipating fins disposed in each of the partitioned sections. The conductive strip is secured in the retaining groove in the top surface of the housing and has a thermal conductivity higher than that of the housing.||02-12-2009|
|20080302508||HEAT-DISSIPATING DEVICE WITH HIGH HEAT-DISSIPATING EFFICIENCY - A heat-dissipating device includes a planar plate, a cap-like cover, a finned structure, and a discharge pipe. The cap-like cover includes a base wall, and a surrounding wall that interconnects the planar plate and the base wall, that cooperates with the planar plate and the base wall to define an inner space thereamong, and that defines an inlet. The finned structure includes a plurality of partitioning plates that form a continuous meandering fluid path, and a plurality of heat-dissipating fins that are disposed in the meandering fluid path. The discharge pipe is connected to the surrounding wall of the cap-like cover, is in fluid communication with the second compartment, and has an open end disposed adjacent to the base wall of the cap-like cover.||12-11-2008|
Patent applications by MAN ZAI INDUSTRIAL CO., LTD.