| Magnecomp Corporation Patent applications |
| Patent application number | Title | Published |
|---|
| 20100271735 | Wireless Microactuator Motor Assembly for Use in a Hard Disk Drive Suspension, and Mechanical and Electrical Connections Thereto - A microactuator assembly for a hard disk drive head suspension has an expandable base of stainless steel sheet material defining a negative lead affixed to the negative electrode on the bottom surface of a piezoelectric element, and a piece of stainless steel sheet material defining a positive lead attached to the positive electrode on the top surface of the piezoelectric element. The leads may be affixed directly to the piezoelectric element via conductive adhesive. The microactuator assembly can be assembled separately, and then laser welded into place on a suspension. A bond pad made of stainless steel sheet material extends from the flexible circuit, is electrically connected to the microactuator driving voltage conductor within the flexible circuit through a via, and is electrically isolated from the suspension substrate by an insulating film. The microactuator unit positive lead is mechanically and electrically connected to the bond pad via laser welding. | 10-28-2010 |
| 20100230144 | DISK DRIVE SUSPENSION VIA FORMATION USING A TIE LAYER AND PRODUCT - A disk drive suspension interconnect, and method therefor. The interconnect has a metal grounding layer, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor. | 09-16-2010 |
| 20100230135 | Additive disk drive suspension manufacturing using tie layers for vias and product thereof - An additive process disk drive suspension interconnect, and method therefor is provided. The interconnect has a metal grounding layer of typically stainless steel or copper metallized stainless steel, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor. | 09-16-2010 |
| 20090161259 | Asymmetric Load Beam for Improving Resonance Performance of Hard Disk Drive Suspension - A structure for a load beam used in hard disk drive devices includes an asymmetric structure. The load beam exhibits longitudinal asymmetry (i.e., is asymmetric along its long axis) in regard to the weight distribution, but has a center of mass that lies along its longitudinal axis due to the provisioning of counterbalancing features, such as the addition of material, the removal of material, or a combination of adding material and removing material, or the use of an asymmetrical damping layer. | 06-25-2009 |
