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MAG-CON ENGINEERING

MAG-CON ENGINEERING Patent applications
Patent application numberTitlePublished
20100163686DOUBLE IMPEDANCE BOND - A low profile double impedance bond for placement between a pair of rails and for electrical connection to opposite sides of a pair of insulated breaks on the pair of rails, the impedance bond comprising a rectangular enclosure attachable to ties supporting the pair of rails, the enclosure having a pair of ends and a pair of sides, each side for alignment parallel to one of the rails, the impedance bond having four coils each formed of a strip of copper foil with two ends wound in a spiral configuration about a core, the impedance bond having a terminal connection array formed of a plurality of copper conductors, the conductors, cores, and coils are arranged in a low profile manner on a single platform allowing quick installation inbetween rails.07-01-2010