| MACRONIX INTERNATIONAL CO., LTD. Patent applications |
| Patent application number | Title | Published |
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| 20120033518 | CURRENT SINK SYSTEM FOR SOURCE-SIDE SENSING - Source-side sensing techniques described herein determine the data value stored in a memory cell based on the difference in current between the read current from the source terminal of the memory cell and a sink current drawn from the read current. The sink current is drawn in response to the magnitude of a reference current provided by a reference current source such as a reference cell. | 02-09-2012 |
| 20120025278 | SCHOTTKY DIODE - A Schottky diode comprises an ohmic layer that can serve as a cathode and a metal layer that can serve as an anode, and a drift channel formed of semiconductor material that extends between the ohmic and metal layers. The drift channel includes a heavily doped region adjacent to the ohmic contact layer. The drift channel forms a Schottky barrier with the metal layer. A pinch-off mechanism is provided for pinching off the drift channel while the Schottky diode is reverse-biased. As a result, the level of saturation or leakage current between the metal layer and the ohmic contact layer under a reverse bias condition of the Schottky diode is reduced. | 02-02-2012 |
| 20120022957 | System and Method of Managing Contactless Payment Transactions Using a Mobile Communication Device as a Stored Value Device - A method handling payment transactions in a system using mobile communication devices as stored value devices is disclosed. A transaction operations server receives multiple records of the transaction from the stored value device—one via a communication channel through the telecommunication provider network, and another via an independent communication channel. The records are reconciled at the transaction server for transaction verification. | 01-26-2012 |
| 20120020138 | TRANSISTOR HAVING AN ADJUSTABLE GATE RESISTANCE AND SEMICONDUCTOR DEVICE COMPRISING THE SAME - A memory device comprises an array of memory cells each capable of storing multiple bits of data. The memory cells are arranged in memory strings that are connected to a common source line. Each memory cell includes a programmable transistor connected in series with a resistance. The transistor includes a gate dielectric that is switchable between a plurality of different resistance values. The threshold voltage of the transistor changes according to the resistance value of the gate dielectric. Memory states of the memory cells can thus be associated with respective resistance values of the dielectric layer of the transistor. | 01-26-2012 |
| 20120019232 | Current Source with Tunable Voltage-Current Coefficient - A current source providing an output current with a fixed current range includes a bias circuit, a resistor, a current mirror, and a controller. The bias circuit provides a first voltage weighted with a first tunable coefficient and a second voltage weighted with a second tunable coefficient. The resistor has a tunable resistance for determining a bias current according to a voltage difference between the first and the second voltages and the tunable resistance. The current mirror generates the output current according to the bias current. The controller adjusts the tunable resistance and one of the first and the second tunable coefficients to achieve a voltage-current coefficient with different values, while the bias current and the output current are kept within a fixed current range. | 01-26-2012 |
| 20120018845 | Polysilicon Plug Bipolar Transistor For Phase Change Memory - Memory devices and methods for manufacturing are described herein. A memory device described herein includes a plurality of memory cells. Memory cells in the plurality of memory cells comprise respective bipolar junction transistors and memory elements. The bipolar junction transistors are arranged in a common collector configuration and include an emitter comprising doped polysilicon having a first conductivity type, the emitter contacting a corresponding word line in a plurality of word lines to define a pn junction. The bipolar junction transistors include a portion of the corresponding word line underlying the emitter acting as a base, and a collector comprising a portion of the single-crystalline substrate underlying the base. | 01-26-2012 |
| 20120018790 | NON-VOLATILE MEMORY AND FABRICATING METHOD THEREOF - A non-volatile memory including a substrate, a stacked gate structure, two doped regions and a plurality of spacers is provided. The stacked gate structure is disposed on the substrate, wherein the stacked gate structure includes a first dielectric layer, a charge storage layer, a second dielectric layer and a conductive layer in sequence from bottom to top relative to the substrate. The doped regions are disposed in the substrate at two sides of the stacked gate structure, respectively, and bottom portions of the doped regions contact with the substrate under the doped regions. The spacers are respectively disposed between each side of each of the doped regions and the substrate, and top portions of the spacers are lower than top portions of the doped regions. | 01-26-2012 |
| 20120016472 | Color Tactile Vision System - A tactile display writer unit includes a probe having a contact tip, and at least a first actuator and a second actuator coupled to the probe, whereby activation of the actuators results in a displacement of the probe tip in one or more of a z-direction and in a lateral direction having a vector in an x-y plane. Also, a display writer includes a plurality of such units supported in an x-y array. The writer units may have a third actuator coupled to the probe. Also, a tactile vision system includes such a display writer, an image processor, and an image sensor. The processor transforms RGB image information from the image sensor into hue-based information having two or more attributes; and the actuators in the tactile display writer are activated by the information attributes. Also, a method for producing a tactile color stimulus at a site on the skin of a subject includes providing a probe having a contact tip; displacing the tip at the contact site in a direction generally normal to the skin surface at the site to an extent that relates one attribute of a hue-based model of the color, and displacing the tip in at least one lateral direction generally in a plane parallel to the skin surface at the site to an extent that relates to at least one additional attribute of the color. | 01-19-2012 |
| 20120011300 | METHOD AND APPARATUS FOR HIGH-SPEED BYTE-ACCESS IN BLOCK-BASED FLASH MEMORY - Techniques utilizing an erase-once, program-many progressive indexing structure manage data in a flash memory device which avoids the need to perform sector erase operations each time data stored in the flash memory device is updated. As a result, a large number of write operations can be performed before a sector erase operation is needed. Consequently, block-based flash memory can be used for high-speed byte access. | 01-12-2012 |
| 20120008388 | NON-VOLATILE MEMORY AND OPERATION METHOD THEREOF - An operation method of a non-volatile memory suitable for a multi-level cell having a first storage position and a second storage position is provided. The operation method includes: setting a main voltage distribution group and a plurality of secondary voltage distribution groups, wherein each of the main voltage distribution group and the secondary voltage distribution groups includes N threshold-voltage distribution curves, and N is an integer greater than 2; selecting a first operation level and a second operation level according to a programming command; programming the first storage position according to the threshold-voltage distribution curve corresponding to the first operation level in the main voltage distribution group; selecting one of the secondary voltage distribution groups according to the first operation level and programming the second storage position according to the threshold-voltage distribution curve corresponding to the second operation level in the selected secondary voltage distribution group. | 01-12-2012 |
| 20120008363 | Diode-Less Array for One-Time Programmable Memory - A one-time programmable memory array includes a first row conductor extending in a first row direction and disposed at a first elevation, a second row conductor extending in a second row direction and disposed at a second elevation and a column conductor extending in a column direction and disposed adjacent to the first row conductor and adjacent to the second row conductor. The array also includes a dielectric layer covering at least a portion of the column conductor, a fuse link coupled between the dielectric layer on the column conductor and the second row conductor. | 01-12-2012 |
| 20120002484 | OPERATION METHODS FOR MEMORY CELL AND ARRAY FOR REDUCING PUNCH THROUGH LEAKAGE - A method for programming a first memory cell in a memory array. In a specific embodiment, each memory cell has a drain, a source, a channel, and a control gate overlying a charge storage material and the channel. The source of the first memory cell is coupled to the drain of a second memory cell. A voltage is applied to the drain of the first memory cell, and the source of the second memory cell is grounded. The method includes floating the drain of the second memory cell and the source of the first memory cell and turning on the channels of the first and second memory cells, effectively forming an extended channel region. Hot carriers are injected to the charge storage material of the first cell to program the first memory cell. The extended channel lowers electrical fields and reduces punch through leakage in unselected memory cells. | 01-05-2012 |
| 20120000423 | HDP-CVD SYSTEM - An HDP-CVD system is described, including an HDP-CVD chamber for depositing a material on a wafer, and a pre-heating chamber disposed outside of the HDP-CVD chamber to pre-heat the wafer, before the wafer is loaded in the HDP-CVD chamber, to a temperature higher than room temperature and required in the deposition step to be conducted in the HDP-CVD chamber. The pre-heating chamber is equipped with a heating lamp for the pre-heating. The wafer has been formed with a trench before being pre-heated. | 01-05-2012 |
| 20110317493 | Method and Apparatus of Performing An Erase Operation on a Memory Integrated Circuit - Various discussed approaches improve the over erase issue and the coupling effect, and include (A) multilevel contacts between (i) the first outer selected word line of an erase group, and (ii) the first unselected word line outside the ease group neighboring the first outer selected word line; (B) a sufficient separation distance between (i) the first outer selected word line of an erase group, and (ii) the first unselected word line outside the ease group neighboring the first outer selected word line. These are examples of electrically isolating (i) the first outer selected word line of an erase group, from (ii) the first unselected word line outside the ease group neighboring the first outer selected word line. | 12-29-2011 |
| 20110317480 | PHASE CHANGE MEMORY CODING - An integrated circuit phase change memory can be pre-coded by inducing a first resistance state in some cells and the memory, and a second resistance state and some other cells in the memory to represent a data set. The integrated circuit phase change memory is mounted on a substrate after coding the data set. After mounting the integrated circuit phase change memory, the data set is read by sensing the first and second resistance states, and changing cells in the first resistance state to a third resistance state and changing cells in the second resistance state to a fourth resistance state. The first and second resistance states maintain a sensing margin after solder bonding or other thermal cycling process. The third and fourth resistance states are characterized by the ability to cause a transition using higher speed and lower power, suitable for a mission function of a circuit. | 12-29-2011 |
| 20110317471 | Nonvolatile stacked nand memory - A memory cell is arranged to enhance the electrical field of the memory element. The memory cell has a metal-oxide memory element, a nonconductive element, and a conductive element. The metal-oxide memory element is in a current path between a first electrode at a first voltage and a second electrode at a second voltage. The nonconductive element is adjacent to the metal-oxide memory element. | 12-29-2011 |
| 20110316096 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A semiconductor device can be manufactured by a method that includes forming a structure that includes a plurality of layers of semiconductor material. One or more etching processes are performed on the multi-layered semiconductor structure, and then an Ar/O | 12-29-2011 |
| 20110305088 | HOT CARRIER PROGRAMMING IN NAND FLASH - A memory device includes a plurality of memory cells arranged in series in the semiconductor body, such as a NAND string, having a plurality of word lines. A selected memory cell is programmed by hot carrier injection using a boosted channel potential to establish the heating field. Boosted channel hot carrier injection can be based on blocking flow of carriers between a first side of a selected cell and a second side of the selected cell in the NAND string, boosting by capacitive coupling the first semiconductor body region to a boosted voltage level, biasing the second semiconductor body region to a reference voltage level, applying a program potential greater than a hot carrier injection barrier level to the selected cell and enabling flow of carriers from the second semiconductor body region to the selected cell to cause generation of hot carriers. | 12-15-2011 |
| 20110305074 | SELF-ALIGNED BIT LINE UNDER WORD LINE MEMORY ARRAY - A memory device is described that comprises a plurality of bit lines and an array of vertical transistors arranged on the plurality of bit lines. A plurality of word lines is formed along rows of vertical transistors in the array which comprise thin film sidewalls of word line material and arranged so that the thin film sidewalls merge in the row direction, and do not merge in the column direction, to form word lines. The word lines provide “surrounding gate” structures for embodiments in which the vertical transistors are field effect transistors. Memory elements are formed in electrical communication with the vertical transistors. A fully self-aligned process is provided in which the word lines and memory elements are aligned with the vertical transistors without additional patterning steps. | 12-15-2011 |
| 20110304341 | METHOD OF TESTING INTEGRATED CIRCUITS - A method of testing integrated circuits includes providing an integrated circuit test system that has a voltage supply and a plurality of control channels. A first switching element is connected between the voltage supply and a first integrated circuit, and a second switching element is connected between the voltage supply and the second integrated circuit. The switching elements can include, for example, electromagnetic relays. The relays are controlled by respective test system control channels to selectively provide electrical power to each of the integrated circuits. | 12-15-2011 |
| 20110303968 | Nonvolatile Memory Array With Continuous Charge Storage Dielectric Stack - An integrated circuit of an array of nonvolatile memory cells has a dielectric stack layer over the substrate, and implanted regions in the substrate under the dielectric stack layer. The dielectric stack layer is continuous over a planar region, that includes locations of the dielectric stack layer that store nonvolatile data, such that these locations are accessed by word lines/bit lines. | 12-15-2011 |
| 20110300682 | CHARGE TRAPPING DEVICES WITH FIELD DISTRIBUTION LAYER OVER TUNNELING BARRIER - A memory cell comprising: a semiconductor substrate with a surface with a source region and a drain region disposed below the surface of the substrate and separated by a channel region; a tunneling barrier dielectric structure with an effective oxide thickness of greater than 3 nanometers disposed above the channel region; a conductive layer disposed above the tunneling barrier dielectric structure and above the channel region; a charge trapping structure disposed above the conductive layer and above the channel region; a top dielectric structure disposed above the charge trapping structure and above the channel region; and a top conductive layer disposed above the top dielectric structure and above the channel region are described along with devices thereof and methods for manufacturing. | 12-08-2011 |
| 20110292728 | INTEGRATED CIRCUIT OF DEVICE FOR MEMORY CELL - A reading method for a multi-level cell (MLC) memory includes the following steps. A number of word line voltages are sequentially provided to an MLC memory cell. A number of bit line voltages corresponding to the word line voltages are sequentially provided to the MLC memory cell. One of the word line voltages is higher than another one of the word line voltages, and one of the bit line voltages corresponding to the one of the word line voltages is lower than another one of the bit line voltages corresponding to the another one of the word line voltages. | 12-01-2011 |
| 20110291638 | Clock Integrated Circuit - The clock circuit of an integrated circuit operates with tolerance of variation in power. A compensation circuit is powered by a supply voltage. The compensation circuit generates a compensated voltage reference, which is compensated for variation in the supply voltage. The compensated voltage reference is compared by comparison circuitry against an output of timing circuitry, to determine timing of the clock signal. | 12-01-2011 |
| 20110286283 | 3D TWO-BIT-PER-CELL NAND FLASH MEMORY - A 3D memory device is described which includes bottom and top memory cubes having respective arrays of vertical NAND string structures. A common source plane comprising a layer of conductive material is between the top and bottom memory cubes. The source plane is supplied a bias voltage such as ground, and is selectively coupled to an end of the vertical NAND string structures of the bottom and top memory cubes. Memory cells in a particular memory cube are read using current through the particular vertical NAND string between the source plane and a corresponding bit line coupled to another end of the particular vertical NAND string. | 11-24-2011 |
| 20110286258 | NONVOLATILE MEMORY DEVICE HAVING A TRANSISTOR CONNECTED IN PARALLEL WITH A RESISTANCE SWITCHING DEVICE - A memory device comprises an array of memory cells each capable of storing multiple bits of data. The memory cells are arranged in memory strings that are connected to a common source line. Each memory cell includes a programmable transistor connected in parallel with a resistance switching device. The transistor is switchable between a plurality of different threshold voltages associated with respective memory states. The resistance switching device is configured to be switchable between a plurality of different resistances associated with respective memory states. | 11-24-2011 |
| 20110280058 | NONVOLATILE MEMORY DEVICE - A memory device comprises an array of memory cells each capable of storing multiple bits of data. Each memory cell includes a programmable transistor in series with a resistance switching device. The transistor is switchable between a plurality of different threshold voltages associated with respective memory states. The resistance switching device is configured to be switchable between a plurality of different resistances associated with respective memory states. | 11-17-2011 |
| 20110278528 | SELF ALIGNED FIN-TYPE PROGRAMMABLE MEMORY CELL - A fin-type programmable memory cell includes a bottom electrode electrically coupled to an access device, a top electrode, and an L-shaped memory material element electrically coupled to the bottom and top electrodes. A memory array includes an array of such memory cells, electrically coupled to an array of access devices. Method for making a memory cell, includes: forming a dielectric support layer over a bottom electrode, the dielectric support layer having an upper surface; forming a cavity through the dielectric support layer, exposing a surface of the bottom electrode and defining a dielectric support structure having a sidewall; forming a film of memory material over the dielectric support structure and in the cavity; depositing a dielectric spacer layer over the memory material film; forming a dielectric sidewall spacer from the dielectric spacer layer and a memory material structure having a generally horizontal portion underlying the dielectric sidewall spacer and a generally vertical portion between the dielectric sidewall spacer and the sidewall of the dielectric support structure; forming a dielectric fill; planarizing the dielectric fill to expose upper ends of the vertical portion of the memory material structure; depositing a top electrode material over the planarized dielectric fill; and forming a top electrode from the top electrode material and a memory material element from the memory material structure. | 11-17-2011 |
| 20110273936 | ERASE PROCESS FOR USE IN SEMICONDUCTOR MEMORY DEVICE - A method of erasing memory cells of a memory device includes programming memory cells if the erasing procedure is suspended. The erasing procedure can include pre-programming, erasing, and soft-programming of memory cells in a selected memory unit. If a suspend command is received, for example to allow for a read operation of memory cells of another unit of memory, the erasing procedure stops the pre-programming, erasing, or soft-programming, and proceeds with programming one or more memory cells of the memory unit that was being erased. | 11-10-2011 |
| 20110273930 | Diode Memory - A diode memory device has an intermediate structure between the two terminals, such as a p terminal and the n terminal. | 11-10-2011 |
| 20110273237 | Oscillator With Frequency Determined By Relative Magnitudes of Current Sources - An oscillator circuit includes a circuit loop and multiple current sources. The circuit loop includes an output having the oscillating signal. The multiple current sources are turned on independently of a phase of the oscillating signal. The current sources control magnitudes of both charging current and discharging current at nodes of the circuit loop, including the output. Relative magnitudes of different current sources determine a frequency of the oscillating signal. | 11-10-2011 |
| 20110267889 | A HIGH SECOND BIT OPERATION WINDOW METHOD FOR VIRTUAL GROUND ARRAY WITH TWO-BIT MEMORY CELLS - A non-volatile VG memory array employing memory semiconductor cells capable of storing two bits of information having a non-conducting charge trapping dielectric, such as silicon nitride, layered in associating with at least one electrical insulating layer, such as an oxide, is disclosed. Bit lines of the memory array are capable of transmitting positive voltage to reach the source/drain regions of the memory cells of the array. A method that includes the hole injection erasure of the memory cells of the array that lowers the voltage threshold of the memory cells to a value lower than the initial voltage threshold of the cells is disclosed. The hole injection induced lower voltage threshold reduces the second bit effect such that the window of operation between the programmed and un-programmed voltage thresholds of the bits is widened. The programming and read steps reduce leakage current of the memory cells in the array. | 11-03-2011 |
| 20110267881 | MEMORY ARRAY - A memory array is shown, including memory cells with source and drain doped regions, and global bit lines coupled to the doped regions via select transistors. The connections of the select transistors are configured such that the respective loading capacitances of two global bit lines respectively coupled to the source and the drain of a memory cell to be read do not vary with the memory cell to be read. | 11-03-2011 |
| 20110266601 | Single Gate Semiconductor Device - A semiconductor device has a gate multiple doping regions on both sides of the gate. The gate can be shared by a transistor and a capacitor. | 11-03-2011 |
| 20110263125 | METHOD OF FORMING MARK IN IC-FABRICATING PROCESS - A method of forming a mark in an IC fabricating process is described. Two parts of the mark each including a plurality of linear patterns are respectively defined by two exposure steps that either belong to two lithography processes respectively or constitute a double-exposure process including X-dipole and Y-dipole exposure steps. | 10-27-2011 |
| 20110263075 | Vacuum Jacket For Phase Change Memory Element - A memory device including a phase change element and a vacuum jacket. The device includes a first electrode element; a phase change element in contact with the first electrode element; an upper electrode element in contact with the phase change element; a bit line electrode in contact with the upper electrode element; and a dielectric fill layer surrounding the phase change element and the upper electrode element, spaced from the same and sealed by the bit line electrode to define a vacuum jacket around the phase change element and upper electrode element. | 10-27-2011 |
| 20110255350 | METHOD OF OPERATING MEMORY CELL - A method of operating a memory cell is provided. The memory cell has first, second, third and fourth storage regions in a charge-storage layer between a substrate and a word line. The first and second storage regions are respectively adjacent to lower and upper portions at one side of the protruding part of the substrate, and the third and fourth storage regions are respectively adjacent to lower and upper portions at the other side of the same. The second and third storage regions are regarded as a top storage region. When the top storage region is programmed, a first positive voltage is applied to the word line, a second positive voltage is applied to a top bit line in a top portion of the protruding part, and a bottom voltage is applied to first and second bottom bit lines in the substrate beside the protruding part respectively. | 10-20-2011 |
| 20110255349 | METHOD OF OPERATING NON-VOLATILE MEMORY CELL - A method of operating a memory cell for 3D array of this invention is described as follows. Carriers of a first type are injected into a charge storage layer of the memory cell by applying a double-side biased (DSB) voltage to double sides of the memory cell. Carriers of a second type are injected into the charge storage layer by applying FN voltages. | 10-20-2011 |
| 20110250729 | METHOD FOR FABRICATING MEMORY - A method for fabricating a memory is described. Word lines are provided in a first direction. Bit lines are provided in a second direction. A top electrode is formed connecting to a corresponding word line. A bottom electrode is formed connecting to a corresponding bit line. A resistive layer is formed on the bottom electrode. At least two separate L-shaped liners are formed, wherein each L-shaped liner has variable resistive materials on both ends of the L-shaped liner and each L-shaped liner is coupled between the top electrode and the resistive layer. | 10-13-2011 |
| 20110242891 | OPERATION METHODS FOR MEMORY CELL AND ARRAY FOR REDUCING PUNCH THROUGH LEAKAGE - A method for programming a first memory cell in a memory array. In a specific embodiment, each memory cell has a drain, a source, a channel, and a control gate overlying a charge storage material and the channel. The source of the first memory cell is coupled to the drain of a second memory cell. A voltage is applied to the drain of the first memory cell, and the source of the second memory cell is grounded. The method includes floating the drain of the second memory cell and the source of the first memory cell and turning on the channels of the first and second memory cells, effectively forming an extended channel region. Hot carriers are injected to the charge storage material of the first cell to program the first memory cell. The extended channel lowers electrical fields and reduces punch through leakage in unselected memory cells. | 10-06-2011 |
| 20110242874 | RESISTIVE MEMORY AND METHOD FOR CONTROLLING OPERATIONS OF THE SAME - A resistive memory and a method for controlling operations of the resistive memory are provided. The resistive memory has a first memory layer, a second memory layer and a medium layer. Each of the first memory layer and the second memory layer is used to store data. The medium layer is formed between the first memory layer and the second memory layer. The method comprises at least a step of measuring a resistance between the first memory layer and the second memory layer, and determining which one of a first state, a second state and a third state is a state of the resistive memory according to the measured resistance. | 10-06-2011 |
| 20110241100 | STACKED NON-VOLATILE MEMORY DEVICE AND METHODS FOR FABRICATING THE SAME - A stacked non-volatile memory device comprises a plurality of bit line and word line layers stacked on top of each other. The bit line layers comprise a plurality of bit lines that can be formed using advanced processing techniques making fabrication of the device efficient and cost effective. The device can be configured for NAND operation. | 10-06-2011 |
| 20110241078 | Stacked Bit Line Dual Word Line Nonvolatile Memory - An arrangement of nonvolatile memory devices, having at least one memory device level stacked level by level above a semiconductor substrate, each memory level comprising an oxide layer substantially disposed above a semiconductor substrate, a plurality of word lines substantially disposed above the oxide layer; a plurality of bit lines substantially disposed above the oxide layer; a plurality of via plugs substantially in electrical contact with the word lines and, an anti-fuse dielectric material substantially disposed on side walls beside the bit lines and substantially in contact with the plurality of bit lines side wall anti-fuse dielectrics. | 10-06-2011 |
| 20110241077 | INTEGRATED CIRCUIT 3D MEMORY ARRAY AND MANUFACTURING METHOD - A 3D memory device is based on an array of conductive pillars and a plurality of patterned conductor planes including left side and right side conductors adjacent the conductive pillars at left side and right side interface regions. Memory elements in the left side and right side interface regions comprise a programmable element and a rectifier. The conductive pillars can be selected using two-dimensional decoding, and the left side and right side conductors in the plurality of planes can be selected using decoding on a third dimension, combined with left and right side selection. | 10-06-2011 |
| 20110238939 | MEMORY DEVICES WITH DATA PROTECTION - A memory device comprises a memory array, a status register, a status-register write-protect bit and a security register. The memory array contains a number of memory blocks. The status register includes at least one protection bit indicative of a protection status of at least one corresponding block of the memory blocks. The status-register write-protect bit is coupled with the status register for preventing a state change of the at least one protection bit. The security register includes at least one register-protection bit for preventing the state change in one of the at least one protection bit of the status register and the status-register write-protect bit. | 09-29-2011 |
| 20110230024 | METHOD FOR MANUFACTURING NON-VOLATILE MEMORY - A method for manufacturing a non-volatile memory is provided. The method comprises steps of providing a substrate. Thereafter, a plurality of first doped regions are formed in the substrate and then a plurality of trenches are formed in a portion of the first doped regions. A plurality of second doped regions are formed in a portion of the substrate under the bottoms of the trenches respectively. Then, a charge storage layer is formed conformal to a surface of the substrate and a conductive layer is formed over the substrate, wherein the conductive layer covers the charge storage layer and fills in the trenches. | 09-22-2011 |
| 20110227552 | Apparatus of Supplying Power and Method Therefor - A power supply apparatus and a method for supplying power are provided. The apparatus, for use in a system having a first power signal, includes an assistance unit and a power supply device. The assistance unit outputs at least one maintaining signal according to the first power signal selectively. The power supply device outputs a second power signal, wherein the power supply device maintains the second power signal according to the at least one maintaining signal, for example, in an inactive state, such as an idle or standby state or other suitable timing. | 09-22-2011 |
| 20110220986 | MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME - A memory device including a substrate, a conductive layer, a charge storage layer, first and second dopant regions and first and second cell dopant regions is provided. A plurality of trenches is deployed in the substrate. The conductive layer is disposed on the substrate and fills the trenches. The charge storage layer is disposed between the substrate and the conductive layer. The first and second dopant regions having a first conductive type are configured in the substrate under bottoms of the trenches and in an upper portion of the substrate between two adjacent trenches, respectively. The first and second cell dopant regions having a second conductive type are configured in the substrate between lower portions of side surfaces of the trenches and in the substrate adjacent to the bottoms of the second dopant regions, respectively. The first and the second conductive types are different dopant types. | 09-15-2011 |
| 20110217818 | PHASE CHANGE MEMORY CELL HAVING VERTICAL CHANNEL ACCESS TRANSISTOR - A device includes a substrate having a first region and a second region. The first region comprises a first field effect transistor having a horizontal channel region within the substrate, a gate overlying the horizontal channel region, and a first dielectric covering the gate of the first field effect transistor. The second region of the substrate includes a second field effect transistor comprising a first terminal extending through the first dielectric to contact the substrate, a second terminal overlying the first terminal and having a top surface, and a vertical channel region separating the first and second terminals. The second field effect transistor also includes a gate on the first dielectric and adjacent the vertical channel region, the gate having a top surface that is co-planar with the top surface of the second terminal. | 09-08-2011 |
| 20110216601 | CURRENT SINK SYSTEM BASED ON SAMPLE AND HOLD FOR SOURCE SIDE SENSING - Source-side sensing techniques described herein determine the data value stored in a memory cell based on the difference in current between the read current from the source terminal of the memory cell and a sink current drawn from the read current. The sink current is drawn in response to a magnitude of an operating voltage between first and second nodes. During a first time interval, the operating voltage is set in response to a magnitude of the reference current using a feedback path. During a second time interval following the first time interval, the operating voltage is held independent of the feedback path. The data value stored in the memory cell is determined based on a difference in current between the read current and the sink current during the second time interval. | 09-08-2011 |
| 20110210776 | Clock Integrated Circuit - The clock circuit of an integrated circuit operates with variations such as temperature, ground noise, and power noise. Various aspects of an improved clock integrated circuit address one or more of the variations in temperature, ground noise, and power noise. | 09-01-2011 |
| 20110204447 | ESD TOLERANT I/O PAD CIRCUIT INCLUDING A SURROUNDING WELL - An electrostatic discharge tolerant device includes a semiconductor body having a first conductivity type, and a pad. A surrounding well having a second conductivity type is laid out in a ring to surround an area for an electrostatic discharge circuit in the semiconductor body. The surrounding well is relatively deep, and in addition to defining the area for the electrostatic discharge circuit, provides the first terminal of a diode formed with the semiconductor body. Within the area surrounded by the surrounding well, a diode coupled to the pad and a transistor coupled to the voltage reference are connected in series and form a parasitic device in the semiconductor body. | 08-25-2011 |
| 20110204441 | LOW ON-RESISTANCE LATERAL DOUBLE-DIFFUSED MOS DEVICE - A lateral-double diffused MOS device is provided. The device includes: a first well having a first conductive type and a second well having a second conductive type disposed in a substrate and adjacent to each other; a drain and a source regions having the first conductive type disposed in the first and the second wells, respectively; a field oxide layer (FOX) disposed on the first well between the source and the drain regions; a gate conductive layer disposed over the second well between the source and the drain regions extending to the FOX; a gate dielectric layer between the substrate and the gate conductive layer; a doped region having the first conductive type in the first well below a portion of the gate conductive layer and the FOX connecting to the drain region. A channel region is defined in the second well between the doped region and the source region. | 08-25-2011 |
| 20110198698 | BIT LINE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - A semiconductor device including a substrate, a plurality of stacked gate structures, a plurality of doped regions, a plurality of liner layers, a plurality of conductive layers, a plurality of dielectric layers and a plurality of word lines is provided. The substrate has a plurality of trenches therein. The stacked gate structures are on the substrate between the trenches. The doped regions are in the substrate at sidewalls or bottoms of the trenches. The liner layers are on at least a portion of sidewalls of the stacked gate structures and on sidewalls of the trenches. The conductive layers are in the trenches and electrically connected to the doped regions. The dielectric layers are on the conductive layers and between the stacked gate structures. The word lines are on the substrate and electrically connected to the stacked gate structures. | 08-18-2011 |
| 20110198686 | NITRIDE READ ONLY MEMORY DEVICE WITH BURIED DIFFUSION SPACERS AND METHOD FOR MAKING THE SAME - A method for making a nitride read only memory device with buried diffusion spacers is disclosed. An oxide-nitride-oxide (ONO) layer is formed on top of a silicon substrate, and a polysilicon gate is formed over the ONO layer. The polysilicon gate is formed less than a length of the ONO layer. Two buried diffusion spacers are formed beside two sidewalls of the polysilicon gate and over the ONO layer. Two buried diffusion regions are implanted on the silicon substrate next to the two buried diffusion spacers. The two buried diffusion regions are then annealed such that the approximate interfaces of the buried diffusion regions are under the sidewalls of the polysilicon gate. The structure of a nitride read only memory device with buried diffusion spacers is also described. | 08-18-2011 |
| 20110198557 | METHOD FOR FABRICATION OF CRYSTALLINE DIODES FOR RESISTIVE MEMORIES - The present invention, in one embodiment, provides a method of producing a PN junction the method including at least the steps of providing a Si-containing substrate; forming an insulating layer on the Si-containing substrate; forming a via through the insulating layer to expose at least a portion of the Si-containing substrate; forming a seed layer of the exposed portion of the Si containing substrate; forming amorphous Si on at least the seed layer; converting at least a portion of the amorphous Si to provide crystalline Si; and forming a first dopant region abutting a second dopant region in the crystalline Si. | 08-18-2011 |
| 20110191728 | INTEGRATED CIRCUIT HAVING LINE END CREATED THROUGH USE OF MASK THAT CONTROLS LINE END SHORTENING AND CORNER ROUNDING ARISING FROM PROXIMITY EFFECTS - An integrated circuit that includes a line end created through use of a mask that controls line end shortening and corner rounding arising from proximity effects is provided. The mask includes a main feature having opaque and transmissive areas arranged to reflect a patterned feature of the line end, at least one of an opaque edge or a transmissive edge located at each end of the main feature, wherein the opaque edge has a set of transmissive assist features arranged therein such that the set of transmissive assist features align alternately with the transmissive areas of the main feature, and the transmissive edge has a set of opaque assist features arranged therein such that the set of opaque assist features align alternately with the opaque areas of the main feature. | 08-04-2011 |
| 20110189836 | ION/IOFF IN SEMICONDUCTOR DEVICES BY UTILIZING THE BODY EFFECT - A method for reducing leakage current of a semiconductor device includes supplying a substantially constant and non-zero bulk bias to a relatively low threshold voltage semiconductor device during formation of a conductive channel of the semiconductor device and during the formation of a non-conductive channel of the semiconductor device. | 08-04-2011 |
| 20110189819 | Resistive Memory Structure with Buffer Layer - A memory device comprises first and second electrodes with a memory element and a buffer layer located between and electrically coupled to them. The memory element comprises one or more metal oxygen compounds. The buffer layer comprises at least one of an oxide and a nitride. Another memory device comprises first and second electrodes with a memory element and a buffer layer, having a thickness of less than 50 Å, located between and electrically coupled to them. The memory comprises one or more metal oxygen compounds. An example of a method of fabricating a memory device includes forming first and second electrodes. A memory, located between and electrically coupled to the first and the second electrodes, is formed; the memory comprises one or more metal oxygen compounds and the buffer layer comprises at least one of an oxide and a nitride. | 08-04-2011 |
| 20110182123 | FLASH MEMORY AND MANUFACTURING METHOD AND OPERATING METHOD THEREOF - A flash memory and a manufacturing method and an operating method thereof are provided. The flash memory includes a substrate, a charge-trapping structure, a first gate, a second gate, a third gate, a first doped region and a second doped region. The substrate has a protrusion portion. The charge-trapping structure is disposed over the substrate. The first gate and the second gate are disposed respectively over the charge-trapping structure at two sides of the protrusion portion. The top surfaces of the first gate and the second gate are lower than the top surface of the charge-trapping structure located on the top of the protrusion portion. The third gate is disposed over the charge-trapping structure located on the top of the protrusion portion. The first doped region and the second doped region are disposed respectively in the substrate at two sides of the protrusion portion. | 07-28-2011 |
| 20110180864 | MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME - A memory device is provided, including a substrate, a conductive layer, a charge storage layer, a plurality of isolation structures, a plurality of first doped regions, and a plurality of second doped regions. The substrate has a plurality of trenches. The conductive layer is disposed on the substrate and fills the trenches. The charge storage layer is disposed between the substrate and the conductive layer. The isolation structures are disposed in the substrate between two adjacent trenches, respectively. The first doped regions are disposed in an upper portion of the substrate between each isolation structure and each trench, respectively. The second doped regions are disposed in the substrate under a bottom portion of the trenches, in which each isolation structure is disposed between two adjacent second doped regions. | 07-28-2011 |
| 20110180775 | PROGRAMMABLE METALLIZATION CELL WITH ION BUFFER LAYER - A programmable metallization device, comprises a first electrode; a memory layer electrically coupled to the first electrode and adapted for electrolytic formation and destruction of a conducting bridge therethrough; an ion-supplying layer containing a source of ions of a first metal element capable of diffusion into and out of the memory layer; a conductive ion buffer layer between the ion-supplying layer and the memory layer, and which allows diffusion therethrough of said ions; and a second electrode electrically coupled to the ion-supplying layer. Circuitry is coupled to the device to apply bias voltages to the first and second electrodes to induce creation and destruction of conducting bridges including the first metal element in the memory layer. The ion buffer layer can improve retention of the conducting bridge by reducing the likelihood that the first metallic element will be absorbed into the ion supplying layer. | 07-28-2011 |
| 20110176378 | Memory Program Discharge Circuit - A memory integrated circuit has an array of nonvolatile memory cells, bit lines accessing the array of nonvolatile memory cells, and bit line discharge circuitry. The bit lines have multiple discharge paths for a bit line at a same time, during a program operation. | 07-21-2011 |
| 20110175203 | INTEGRATED CIRCUIT WITH IMPROVED INTRINSIC GETTERING ABILITY - An integrated circuit with improved intrinsic gettering ability is described, having a bulk micro-defect (BMD) density of 3.85×10 | 07-21-2011 |
| 20110175050 | Metal Oxide Resistance Based Semiconductor Memory Device With High Work Function Electrode - Various aspect are directed to a memory device or memory cell with a metal-oxide memory element arranged in electrical series along a current path between at least a first electrode, a metal-oxide memory element adjacent to the first electrode, and a second electrode. The first electrode comprises an electrode material having a first work function. The metal-oxide memory element comprises a metal-oxide material having a second work function. The first work function is greater than the second work function. Thermionic emission characterizes the current through this memory. | 07-21-2011 |
| 20110173512 | MEMORY AND METHOD FOR CHECKING READING ERRORS THEREOF - A method for checking reading errors of a memory includes the following steps. A first data fragment is received. A first count index according to the first data fragment is generated, wherein the first count index is corresponding to a quantity of one kind of binary value in the first data fragment. The first data fragment is written into the memory. The first data fragment is read from the memory as a second data fragment. A second count index is generated according to the second data fragment. The first count index is compared with the second count index. | 07-14-2011 |
| 20110170351 | Memory Cell Array of Memory - A memory cell array of a memory comprises a main memory cell array, including local bit lines, word lines and memory cells, and a selected array, including a global bit line, a bit line transistor (BLT) control line, a transistor and a fixed value memory cell. The local bit lines comprise first and second local bit lines. Each memory cell for storing data corresponds and is connected to one local bit line and one word line. The transistor is coupled to the global bit line, first local bit line and BLT control line, and selectively turns on to connect the global bit line to the first local bit line. The fixed value memory cell coupled to the global bit line, second local bit line, and BLT control line is programmed to a fixed value so that a threshold voltage thereof is greater than a threshold voltage of the transistor. | 07-14-2011 |
| 20110169175 | OVERLAY MARK - An overlay mark is used in pattern registration on a semiconductor wafer with an oxide layer. Four sets of two trenches each are formed in the oxide layer. Each trench in a set is parallel to the other trench of the same set. The trenches are configured such that each set forms one side of a box shape. | 07-14-2011 |
| 20110165753 | Method for Making Self Aligning Pillar Memory Cell Device - A method for making a memory cell assembly includes forming a memory cell access layer over a substrate to create an access device with a bottom electrode. A memory material layer is formed over the memory cell access layer in electrical contact with the bottom electrode. A first electrically conductive layer is formed over the memory material layer. A first mask, extending in a first direction, is formed over the first electrically conductive layer and then trimmed so that those portions of the first electrically conductive layer and the memory material layer not covered by the first mask are removed. | 07-07-2011 |
| 20110164461 | Memory Device - A memory device comprises first memory block having first boundary cell and second memory block having second boundary cell. Data of the first and the second boundary cells are outputted simultaneously corresponding to a plurality of column selection signals. | 07-07-2011 |
| 20110163288 | Manufacturing Method for Pipe-Shaped Electrode Phase Change Memory - A method for manufacturing a memory cell device includes forming a bottom electrode comprising a pipe-shaped member, a top, a bottom and sidewalls having thickness in a dimension orthogonal to the axis of the pipe-shaped member, and having a ring-shaped top surface. A disc shaped member is formed on the bottom of the pipe-shaped member having a thickness in a dimension coaxial with the pipe-shaped member that is not dependent on the thickness of the sidewalls of the pipe-shaped member. A layer of phase change material is deposited in contact with the top surface of the pipe-shaped member. A top electrode in contact with the layer of programmable resistive material. An integrated circuit including an array of such memory cells is described. | 07-07-2011 |
| 20110161750 | Pre-Code Device, and Pre-Code System and Pre-Coding Method Thereof - A pre-code device includes firstly memory circuit, an address decoder, and an alternative logic circuit. The first memory circuit includes a number of memory blocks and at east a replacing block. The memory blocks are pointed by a number of respective physical addresses. The replacing block is pointed by a replacing address. The address decoder decodes an input address to provide a pre-code address. The alternative logic circuit looks up an address mapping table, which maps defect physical address among the physical addresses to the replacing address, to map the pre-code address to the replacing address when the pre-code address corresponds to the defect physical address. The alternative logic circuit correspondingly pre-codes the pre-code data to the replacing block. | 06-30-2011 |
| 20110161718 | Command Decoding Method and Circuit of the Same - A decoding circuit for decoding a command is provided. The received command is transmitted during at least two clock periods of a clock signal, and the received command is divided to a former encoded data and a latter encoded data. The decoding circuit includes a pre-trigger signal generating unit, a comparing unit, and a starting signal generating unit. The pre-trigger signal generating unit receives the former encoded data and generates a pre-trigger signal when the former encoded data of the received command matches the corresponding former encoded data of a predetermined command. The comparing unit generates a match signal when the latter encoded data of the received command is the same with the latter encoded data of the predetermined command. The starting signal generating unit outputs a starting signal according to the pre-trigger signal and the match signal. The starting signal starts a corresponding operation of the predetermined command. | 06-30-2011 |
| 20110159682 | METHODS OF MANUFACTURING MEMORY DEVICES - A method of manufacturing a memory device is disclosed. The method includes providing a substrate, forming a number of memory sectors on the substrate, wherein each of the memory sectors is coupled to an adjacent one via a first diffused region in the substrate and is coupled to another adjacent one via at least one second diffused region in the substrate, forming a first dielectric layer on the memory sectors, forming a first conductive structure through the first dielectric layer to the first diffused region, and at least one second conductive structure through the first dielectric layer to the at least one second diffused region, forming a patterned first mask layer on the first dielectric layer, the first conductive structure and the at least one second conductive structure, the patterned first mask layer exposing the first conductive structure, and etching back the first conductive structure. | 06-30-2011 |
| 20110157986 | MEMORY AND OPERATING METHOD THEREOF - A memory and an operating method thereof are provided therein. When searching a boundary of a threshold voltage distribution of the memory, data errors resulted from tail bits of the memory would be corrected. Therefore, a sensing window could be broader, and the boundary of the threshold voltage distribution could be determined precisely. | 06-30-2011 |
| 20110156259 | METAL-TO-CONTACT OVERLAY STRUCTURES AND METHODS OF MANUFACTURING THE SAME - The present invention provides a semiconductor device with a metal-to-contact overlay structure. The semiconductor device includes a substrate, a dielectric layer on the substrate, a contact coupled to the substrate in the dielectric layer, a first conductive region on the contact in the dielectric layer, a dielectric sidewall on the contact in the dielectric layer, the dielectric sidewall surrounding the first conductive region, and a second conductive region on the first conductive region on the dielectric layer. | 06-30-2011 |
| 20110156102 | MEMORY DEVICE AND METHOD OF FABRICATING THE SAME - A memory array including a plurality of memory cells, a plurality of word lines, a dummy word line, at least a first conductive region and at least a first plug is provided. Each word line is coupled to corresponding memory cells. A dummy word line is directly adjacent to an outmost word line of the plurality of word lines. The first conductive region is disposed only between the dummy word line and the outmost word line. The first plug is located between the dummy word line and the outmost word line. | 06-30-2011 |
| 20110149675 | Local Word Line Driver - A two transistor word line driver is disclosed. An example disclosed word line driver is simplified with common signals on the gates of the p-type and the n-type transistors. An example disclosed word line driver consumes less power by applying a negative voltage to a word line driver selected from multiple word line drivers. | 06-23-2011 |
| 20110149671 | Operation Method and Leakage Controller for a Memory and a Memory Applying the Same - An operation method for a memory is provided. The operation method includes: starting a power on procedure on the memory; checking leakage for a bit line of the memory; and if the bit line has leakage, performing a leakage recovery on the bit line until the bit line passes the checking leakage step. | 06-23-2011 |
| 20110149669 | Sense Amplifier and Data Sensing Method Thereof - A data sensing method for sensing storage data stored in a memory cell includes the steps of: biasing a sensing node and a reference node to a first voltage in response to a first control signal; discharging the sensing node and the reference node via the memory cell and a reference memory cell, respectively; enabling a latch circuit to amplify a voltage difference between the sensing node and the reference node. | 06-23-2011 |
| 20110140193 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device having a non-volatile memory and a method of manufacturing the same are provided. The semiconductor device includes a base material and a stack structure. The stack structure disposed on the base material at least includes a tunneling layer, a trapping layer and a dielectric layer. The trapping layer is disposed on the tunneling layer. The dielectric layer has a dielectric constant and is disposed on the trapping layer. The dielectric layer is transformed from a first solid state to a second solid state when the dielectric layer undergoes a process. | 06-16-2011 |
| 20110138216 | Clock Integrated Circuit - The clock circuit of an integrated circuit operates with variations such as temperature, ground noise, and power noise. Various aspects of an improved clock integrated circuit address one or more of the variations in temperature, ground noise, and power noise. | 06-09-2011 |
| 20110138213 | Clock Integrated Circuit - The clock circuit of an integrated circuit operates with variations such as temperature, ground noise, and power noise. Various aspects of an improved clock integrated circuit address one or more of the variations in temperature, ground noise, and power noise. | 06-09-2011 |
| 20110133814 | TX OUTPUT COMBINING METHOD BETWEEN DIFFERENT BANDS - An output buffer includes a first output transistor, a first switch, a second switch and a third switch. The first output transistor is connected to a first operational voltage for outputting the first operational voltage as the data signal. The first switch is connected to a bulk of the first output transistor for receiving an enable signal. The second switch is connected to the first switch and a second operational voltage for receiving the enable signal, wherein the second operational voltage is lower than the first operational voltage. The third switch includes a first terminal connected to the bulk of the first output transistor, a control terminal connected to the first switch, and a second terminal connected to the first operational voltage. | 06-09-2011 |
| 20110133804 | CLOCK INTEGRATED CIRCUIT - The clock circuit of an integrated circuit operates with variations such as temperature, ground noise, and power noise. Various aspects of an improved clock integrated circuit address one or more of the variations in temperature, ground noise, and power noise. | 06-09-2011 |
| 20110133150 | Phase Change Memory Cell with Filled Sidewall Memory Element and Method for Fabricating the Same - Memory cells are described along with methods for manufacturing. A memory cell described herein includes a bottom electrode, a top electrode overlying the bottom electrode, a via having a sidewall extending from a bottom electrode to a top electrode, and a memory element electrically coupling the bottom electrode to the top electrode. The memory element has an outer surface contacting a dielectric sidewall spacer that is on the sidewall of the via, and comprises a stem portion on the bottom electrode and a cup portion on the stem portion. A fill material is within an interior defined by an inner surface of the cup portion of the memory element. | 06-09-2011 |
| 20110128809 | Method and Apparatus of Addressing A Memory Integrated Circuit - A memory integrated circuit has control circuitry that accesses memory cells of the memory integrated circuit. The control circuitry is responsive to commands including a first command and a second command. The first command specifies a high order set of address bits. The second command specifies a low order set of address bits. The high order set of address bits and the low order set of address bits constitute a complete access address of the memory integrated circuit. The first command and the second command have different in command codes. | 06-02-2011 |
| 20110128791 | Method and Apparatus of Performing an Erase Operation on a Memory Integrated Circuit - Various discussed approaches include an improved grouping of edge word lines and center word lines of an erase group during erase verify and erase sub-operations of an erase operation. In another approach, changed voltage levels of edge word lines to address the over-erase issue of the erase group, and also improve erase time performance. Another approach uses dummy word lines. | 06-02-2011 |
| 20110122721 | Y-Decoder and Decoding Method Thereof - A Y-decoder includes a selection unit and a Y-MUX. The selection unit is coupled to the memory array for selecting the column lines. The Y-MUX is coupled to the selection unit for supplying a voltage to the selected column line. The Y-MUX includes a first switch, a second switch, a third switch and a fourth switch coupled in parallel. The first switch and the second switch are respectively for receiving a first shielding voltage and a second shielding voltage. The third switch and the fourth switch are respectively for receiving a first sensing voltage and a second sensing voltage. | 05-26-2011 |
| 20110122690 | METHOD FOR PROGRAMMING MULTI-LEVEL CELL AND MEMORY APPARATUS - A method for programming a multi-level cell and a memory apparatus are described, wherein each cell has two storage sites. The method includes making the first storage site have a first Vt level and the second storage site have a second Vt level. The first Vt level is selected from M Vt levels. When the first Vt level is the i-th level among the M Vt levels, the second Vt level is selected from n | 05-26-2011 |
| 20110121411 | THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MANUFACTURING AND OPERATING THE SAME - The invention provides a semiconductor cell comprising a gate, a dielectric layer, a channel layer, a source region, a drain region and an oxide region. The dielectric layer is adjacent to the gate. The channel layer is adjacent to the dielectric layer and is formed above a source region, a drain region, and an oxide region. | 05-26-2011 |
| 20110121253 | MEMORY DEVICE - A memory device is described. The memory device comprises a bottom electrode, a first pair of spacers, a second pair of spacers and a phase-change element. The bottom electrode has a lower horizontal portion and a vertical portion, and the vertical portion has a top surface and a side. The first pair of spacers covers the side of the vertical portion. The second pair of spacers covers a first portion of the top surface of the vertical portion. The phase-change element is contacted a second portion of the top surface of the vertical portion. | 05-26-2011 |
| 20110116317 | PROGRAM AND ERASE METHODS WITH SUBSTRATE TRANSIENT HOT CARRIER INJECTIONS IN A NON-VOLATILE MEMORY - The present invention describes a uniform program method and a uniform erase method of a charge trapping memory by employing a substrate transient hot electron technique for programming, and a substrate transient hot hole technique for erasing, which emulate an FN tunneling method for NAND memory operation. The methods of the present invention are applicable to a wide variety of charge trapping memories including n-channel or p-channel SONOS types of memories and floating gate (FG) type memories. the programming of the charge trapping memory is conducted using a substrate transient hot electron injection in which a body bias voltage Vb has a short pulse width and a gate bias voltage Vg has a pulse width that is sufficient to move electrons from a channel region to a charge trapping structure. | 05-19-2011 |
| 20110116309 | Refresh Circuitry for Phase Change Memory - A memory device as described herein includes a reference array of phase change memory cells and a memory array of phase change memory cells, where a difference between a current data set stored in the reference array and an expected data set is used to determine when to refresh the memory array. The high resistance state for the reference array is a “partial reset” state having a minimum resistance less than that of the high resistance state for the memory array. Sense circuitry is adapted to read the memory cells of the reference array and to generate a refresh command signal if there is a difference between a current data set stored in the reference array and an expected data set, and control circuitry responsive to the refresh command signal to perform a refresh operation on the memory cells of the memory array. | 05-19-2011 |
| 20110116308 | MULTIPLE PHASE CHANGE MATERIALS IN AN INTEGRATED CIRCUIT FOR SYSTEM ON A CHIP APPLICATION - An integrated circuit includes a plurality of memory cells on a substrate, in which a first set of memory cells uses a first memory material, and a second set of memory cells uses a second memory material. The first and second memory materials have different properties such that the first and second sets of memory cells have different operational memory characteristics, such as switching speeds, retention and endurance. | 05-19-2011 |
| 20110115551 | CHARGE PUMP UTILIZING EXTERNAL CLOCK SIGNAL - A method of generating a pumping voltage in an integrated circuit includes receiving an external clock signal from outside of the integrated circuit. The frequency of the received external clock signal is changed according to one or more modulation ratios, resulting in one or more respective modulated external clock signal. The external clock signal or one of the modulated external clock signals is then selected for use as a pump clock signal. The pump clock signal is used for driving the pump capacitance of a pump circuit for generating the pumping voltage. | 05-19-2011 |
| 20110108792 | Single Crystal Phase Change Material - A method for fabricating a phase change memory (PCM) cell includes forming a dielectric layer over an electrode, the electrode comprising an electrode material; forming a via hole in the dielectric layer such that the via hole extends down to the electrode; and growing a single crystal of a phase change material on the electrode in the via hole. A phase change memory (PCM) cell includes an electrode comprising an electrode material; a dielectric layer over the electrode; a via hole in the dielectric layer; and a single crystal of a phase change material located in the via hole, the single crystal contacting the electrode at the bottom of the via hole. | 05-12-2011 |
| 20110104881 | METHOD OF REDUCING WORDLINE SHORTING - A method of fabricating a memory device includes providing a substrate having an insulating layer, forming first, second, and third conductive layers on the insulating layer, forming a mask on the third conductive layer, etching through the third conductive layer and a first portion thickness of the second conductive layer using the mask to provide an etched sidewall portions of the third conductive layer and an etched upper surface of the second polysilicon layer, and forming a liner layer along the etched sidewall portions and the etched upper surface. | 05-05-2011 |
| 20110097825 | Methods For Reducing Recrystallization Time for a Phase Change Material - A method for reducing recrystallization time for a phase change material of a memory cell element in conjunction with the manufacture of a memory cell device can be carried out as follows. A phase change material, a buffer layer material and a cladding layer material are selected. The buffer layer material is deposited on the substrate, the phase change material is deposited on the buffer layer, and the cladding layer material is deposited on the phase change material to form a memory cell element. The thickness of the phase change material is preferably less than 30 nm and more preferably less than 10 nm. The recrystallization time of the phase change material of the memory cell element is determined. If the recrystallization time is not less than a length of time X, these steps are repeated while changing at least one of the selected materials and material thicknesses. | 04-28-2011 |
| 20110095353 | ONE-TRANSISTOR CELL SEMICONDUCTOR ON INSULATOR RANDOM ACCESS MEMORY - Silicon-oxide-nitride-oxide-silicon SONOS-type devices (or BE-SONOS) fabricated in Silicon-On-Insulator (SOI) technology for nonvolatile implementations. An ultra-thin tunnel oxide can be implemented providing for very fast program/erase operations, supported by refresh operations as used in classical DRAM technology. The memory arrays are arranged in divided bit line architectures. A gate injection, DRAM cell is described with no tunnel oxide. | 04-28-2011 |
| 20110089578 | WAFER STRUCTURE - A wafer structure includes a plurality of dies, an edge portion, a passivation layer, and a UV-blocking metal layer. Each of the dies having an integrated circuit formed thereon, and the circuit includes an upmost metal layer that includes bonding pads. A composite dielectric layer corresponding to dielectric layers of the integrated circuit is disposed on the edge portion, and a cavity is formed in the composite dielectric layer over the edge portion. The passivation layer is located over the whole wafer and covers the upmost metal layer. The UV-blocking metal layer is located on the passivation layer and covers the edge portion and at least a portion of each of the dies. The cavity, the passivation layer, and the UV-blocking metal layer result in an alignment mark. | 04-21-2011 |
| 20110089480 | MEMORY AND MANUFACTURING METHOD THEREOF - A memory having isolated dual memory cells is provided. A first isolation wall and a second isolation wall are separately disposed between a source and a drain on a substrate. An isolation bottom layer and a polysilicon layer are orderly disposed on the substrate between the first and the second isolation walls. A first charge storage structure and a first gate are orderly disposed on the substrate between the first isolation wall and the source. A second charge storage structure and a second gate are orderly disposed on the substrate between the second isolation wall and the drain. A word line disposed on the polysilicon layer, the first gate, the second gate, the first isolation wall and the second isolation wall is electrically connected to the first gate, the second gate and the polysilicon layer. | 04-21-2011 |
| 20110089393 | Memory and Method of Fabricating the Same - A memory, comprising a metal portion, a first metal layer and second metal oxide layer is provided. The first metal oxide layer is on the metal element, and the first metal oxide layer includes N resistance levels. The second metal oxide layer is on the first metal oxide layer, and the second metal oxide layer includes M resistance levels. The memory has X resistance levels and X is less than the summation of M and N, for minimizing a programming disturbance. | 04-21-2011 |
| 20110087838 | Memory Device and Operation Method Therefor - Provided is a MLC (Multi-level cell) memory device, comprising: a memory array, including a plurality of groups each storing a plurality of bits; and an inverse bit storage section, storing a first inverse bit data including a plurality of inverse bits, the plurality of bits in the same group in the memory array being related to a respective inverse bit. | 04-14-2011 |
| 20110086482 | APPARATUS AND ASSOCIATED METHOD FOR MAKING A FLOATING GATE CELL WITH INCREASED OVERLAY BETWEEN THE CONTROL GATE AND FLOATING GATE - A method for fabricating a floating gate memory device comprises using a buried diffusion oxide that is below the floating gate thereby producing an increased step height between the floating gate and the buried diffusion oxide. The increased step height can produce a higher GCR, while still allowing decreased cell size using a virtual ground array design. | 04-14-2011 |
| 20110085384 | CURRENT SINK SYSTEM FOR SOURCE-SIDE SENSING - Source-side sensing techniques described herein determine the data value stored in a memory cell based on the difference in current between the read current from the source terminal of the memory cell and a sink current drawn from the read current. The sink current is drawn in response to the magnitude of a reference current provided by a reference current source such as a reference cell. | 04-14-2011 |
| 20110085383 | CURRENT SINK SYSTEM FOR SOURCE SIDE SENSING - Source-side sensing techniques described herein determine the data value stored in a memory cell based on the difference in current between the read current from the source terminal of the memory cell and a sink current drawn from the read current. The sink current is drawn in response to the magnitude of a reference current provided by a reference current source such as a reference cell. | 04-14-2011 |
| 20110085380 | Method of Programming a Memory - A method of programming a memory, wherein the memory includes many memory regions having multiple multi-level cells. Each memory region includes a first bit line, a second bit line, a data buffer and a protecting unit. The protecting unit, coupled to the first and second bit lines, and the data buffer, prevents a programming error from occurring. In an embodiment of the programming method, corresponding data are inputted to the data buffers respectively. The data corresponding to an n | 04-14-2011 |
| 20110085378 | Memory and Operation Method Therefor - In an operation method for a memory including a plurality of memory cells, a first reading is performed on the memory cells by applying a reference voltage; the reference voltage is moved if it is checked that the first reading result is not correct; a second reading is performed on the memory cells by applying the moved reference voltage; a first total number of a first logic state in the first reading is compared with a second total number of the first logic state in the second reading if it is checked that the second reading result is not correct; and the moving of the reference voltage is stopped if the first reading result has the same number of the first logic state as the second reading result, and the moved reference voltage is stored as a target reference voltage. | 04-14-2011 |
| 20110084397 | 3D INTEGRATED CIRCUIT LAYER INTERCONNECT - A three-dimensional 3D interconnect structure with a small footprint is described, useful for connection from above to levels of circuit structures in a multi-level device. Also, an efficient and low cost method for manufacturing the 3D interconnect structure is provided. | 04-14-2011 |
| 20110080784 | NON-VOLATILE MEMORY AND OPERATION METHOD THEREOF - An operation method of a non-volatile memory suitable for a multi-level cell having a first storage position and a second storage position is provided. The operation method includes: setting N threshold-voltage distribution curves, wherein the N threshold-voltage distribution curves correspond to N levels and N is an integer greater than 2; programming the first and the second storage positions to the 1 | 04-07-2011 |
| 20110080780 | Method for Programming a Multilevel Phase Change Memory Device - A method of programming a phase change device includes selecting a desired threshold voltage (Vth) and applying a programming pulse to a phase change material in the phase change device. The applying of the programming pulse includes applying a quantity of energy to the phase change material to drive at least a portion of this material above a melting energy level. A portion of the energy applied to the phase change material is allowed to dissipate below the melting energy level. The shape of the energy dissipation from the phase change material is controlled until the energy applied to the phase change material is less than a quenched energy level, to cause the phase change device to have the desired Vth. A remaining portion of the energy applied to the phase change material is allowed to dissipate to an environmental level. | 04-07-2011 |
| 20110080766 | Resistive Memory Device and Manufacturing Method Thereof and Operating Method Thereof - A method of manufacturing resistive memory includes the steps: forming a first implanted stacked structure having a first impurity diffusion layer, a second impurity diffusion layer, and a third impurity diffusion layer in a substrate; etching at least the first implanted stacked structure to form a plurality of second implanted stacked structures, wherein the first impurity diffusion layers are first signal lines; forming a plurality of first insulating layers between the second implanted stacked structures; etching the second implanted stacked structures to form a plurality of third implanted stacked structures, wherein the first signal lines are not etched; forming a plurality of second insulating layers between the third implanted stacked structures; forming a plurality of memory material layers electrically coupled to the third impurity diffusion layers; and forming a plurality of second signal lines perpendicular to the first signal lines and electrically coupled to the memory material layers. | 04-07-2011 |
| 20110079840 | MEMORY CELL AND MANUFACTURING METHOD THEREOF AND MEMORY STRUCTURE - A memory cell is provided. The memory cell includes a substrate, an isolation layer, a gate, a charge storage structure, a first source/drain region, a second source/drain region and a channel layer. The isolation layer is disposed over the substrate. The gate is disposed over the isolation layer. The charge storage structure is disposed over the isolation layer and the gate. The first source/drain region is disposed over the charge storage structure at two sides of the gate. The second source/drain region is disposed over the charge storage structure at top of the gate. The channel layer is disposed over the charge storage structure at sidewall of the gate and is electrically connected with the first source/drain region and the second source/drain region. | 04-07-2011 |
| 20110076825 | Method for Making a Self Aligning Memory Device - A self aligning memory device, with a memory element switchable between electrical property states by the application of energy, includes a substrate and word lines, at least the sides of the word lines covered with a dielectric material which defines gaps. An access device within a substrate has a first terminal under a second gap and second terminals under first and third gaps. First and second source lines are in the first and third gaps and are electrically connected to the second terminals. A first electrode in the second gap is electrically connected to the first terminal. A memory element in the second gap is positioned over and electrically connected to the first electrode. A second electrode is positioned over and contacts the memory element. The first contact, the first electrode, the memory element and the second electrode are self aligning. A portion of the memory element may have a sub lithographically dimensioned width. | 03-31-2011 |
| 20110075486 | CHARGE TRAPPING MEMORY CELL HAVING BANDGAP ENGINEERED TUNNELING STRUCTURE WITH OXYNITRIDE ISOLATION LAYER - A band gap engineered, charge trapping memory cell includes a charge storage structure including a trapping layer. a blocking layer, and a dielectric tunneling structure including a thin tunneling layer, a thin bandgap offset layer and a thin isolation layer comprising silicon oxynitride. The memory cell is manufactured using low thermal budget processes. | 03-31-2011 |
| 20110074030 | METHOD FOR PREVENTING Al-Cu BOTTOM DAMAGE USING TiN LINER - A semiconductor device and related method for fabricating the same include providing a stacked structure including an insulating base layer and lower and upper barrier layers with a conductive layer in between, etching the stacked structure to provide a plurality of conductive columns that each extend from the lower barrier layer, each of the conductive columns having an overlying upper barrier layer cap formed from the etched upper barrier layer, wherein the lower barrier layer is partially etched to provide a land region between each of the conductive lines, forming a liner layer over the etched stacked structure exposing the land region, and etching the liner layer and removing the exposed land region to form a plurality of conductive lines | 03-31-2011 |
| 20110073937 | Method for Fabricating a Charge Trapping Memory Device - A method for fabricating a charge trapping memory device includes providing a substrate; forming a first oxide layer on the substrate; forming a number of BD regions in the substrate; nitridizing the interface of the first oxide layer and the substrate via a process; forming a charge trapping layer on the first oxide layer; and forming a second oxide layer on the charge trapping layer. | 03-31-2011 |
| 20110069571 | Word Line Decoder Circuit Apparatus and Method - One embodiment of the technology is an apparatus, a memory integrated circuit. The memory integrated circuit has word line address decoding circuitry. The circuit allows selection of a single word line to have an erase voltage. A decoder circuit includes an inverter and logic. The inverter has an input, and an output controlling a word line to perform the erase operation. A voltage range of the input extends between a first voltage reference and a second voltage reference. Examples of voltages references are a voltage supply and a ground. In some embodiments, this wide voltage range results from the input being free of a threshold voltage drop from preceding circuitry limiting the voltage range of the input. The logic of the decoder is circuit is controlled by a word line address to determine a value of the input of the inverter during the erase operation. | 03-24-2011 |
| 20110069538 | MULTI-LEVEL CELL PROGRAMMING OF PCM BY VARYING THE RESET AMPLITUDE - A phase change memory device and a method for programming the same. The method includes determining a characterized lowest SET current and corresponding SET resistance for the phase change memory device. The method includes determining a characterized RESET current slope for the phase change memory device. The method also includes calculating a first current amplitude for a RESET pulse based on the characterized lowest SET current and the characterized RESET current slope. The method includes applying the RESET pulse to a target memory cell in the phase change memory device and measuring the resistance of the target memory cell. If the measured resistance is substantially less than a target resistance, the method further includes applying one or more additional RESET pulses. In one embodiment of the invention, the one or more additional RESET pulses have current amplitudes greater than a previously applied RESET pulse. | 03-24-2011 |
| 20110068837 | APPARATUS AND METHOD TO TOLERATE FLOATING INPUT PIN FOR INPUT BUFFER - An integrated circuit device includes a pad adapted to receive a signal from an internal or external driver, and an input buffer circuit including an input terminal coupled to the pad. The input buffer circuit includes a pass transistor having a control terminal, a first conduction terminal connected to the pad, and a second conduction terminal connected to a first voltage. The input buffer circuit also includes a latch having a terminal electrically coupled to the control terminal of the pass transistor. The input buffer circuit further includes circuitry coupled to the latch, the circuitry including a feedback transistor having a control terminal electrically coupled to the pad, a first conduction terminal electrically coupled to a second voltage, and a second conduction terminal coupled to the latch. | 03-24-2011 |
| 20110068418 | SUBSTRATE SYMMETRICAL SILICIDE SOURCE/DRAIN SURROUNDING GATE TRANSISTOR - Field effect transistors described herein include first and second terminals vertically separated by a channel region. The first and second terminals comprise first and second silicide elements respectively. The first silicide element prevents the migration of carriers from the first terminal into the underlying semiconductor body or adjacent devices which can activate parasitic devices. The first silicide element is also capable of acting as a low resistance conductive line for interconnecting devices or elements. The second silicide element provides a low resistance contact between the second terminal and overlying elements. | 03-24-2011 |
| 20110063902 | 2T2R-1T1R MIX MODE PHASE CHANGE MEMORY ARRAY - A memory device as described herein includes an array of programmable resistance memory cells. The memory device further includes sense circuitry having a dual memory cell (2T-2R) mode to read a data value stored in a pair of memory cells in the array based on a difference in resistance between a first memory cell in the pair and a second memory cell in the pair. The sense circuitry also has a single memory cell (1T-1R) mode to read a data value in a particular memory cell in the array based on the resistance of the particular memory cell. | 03-17-2011 |
| 20110062507 | SEMICONDUCTOR DEVICE AND A METHOD OF FABRICATING THE SAME - A semiconductor device is provided. The semiconductor device includes a memory device, and the memory device includes a substrate, two stacked gates, two spacers, an insulating layer, and a dielectric layer. The stacked gates having a gap therebetween are located on the substrate. The spacers having a pipe or a seam therebetween are respectively located at sidewalls of each of the stacked gates in the gap. The pipe or the seam is filled with the insulating layer. The dielectric layer is located on the substrate and covers the insulating layer and the stacked gates. | 03-17-2011 |
| 20110060962 | Method and Apparatus for Accessing Memory With Read Error By Changing Comparison - In response to a disagreement between a previously generated check code associated with previously programmed data bits and a more recently generated check code generated in response to a read command, the comparison process is changed, between i) a value representing accessed data and ii) a reference applied to such accesses to distinguish between logical levels. For example, the ratio of resistances characterizing input circuits of a sense amplifier and/or the read bias arrangement and/or a read reference of a memory integrated circuit is/are changed. | 03-10-2011 |
| 20110058430 | Voltage Regulation Method and Memory Applying Thereof - A voltage regulating method applied to a memory to regulate a word line voltage corresponding to a set of memory cells of the memory comprises the following steps. Firstly, a first value, which is for indicating an amount of data having a specific data value in a set of written data, is counted, wherein the set of written data is written into the set of memory cells. Next, a second value, which is for indicating an amount of data having the specific data value in a set of read data, is counted, wherein the set of read data is obtained by reading the set of written data. Then, a regulating voltage is determined according to a difference between the first and second values. After that, the word line voltage is regulated to be a sum of the word line voltage and the regulating voltage. | 03-10-2011 |
| 20110058414 | MEMORY WITH MULTIPLE REFERENCE CELLS - A memory includes a memory array, a sense amplifier, and a reference circuit. The memory array includes a memory cell. The sense amplifier includes a first terminal coupled to the memory cell and a second terminal. The reference circuit includes a first reference cell, a second reference cell, and a switch. The first reference cell has a first reference threshold voltage for providing a first reference current, based on a first reference word line voltage. The second reference cell has a second reference threshold voltage for providing a second reference current, based on a second reference word line voltage. The switch selectively provides one of the first and the second reference currents to the second terminal in response to a control signal. The first and the second reference word line voltages correspond to different voltage levels. | 03-10-2011 |
| 20110056432 | CONTACT BARRIER LAYER DEPOSITION PROCESS - A method for depositing a barrier layer onto a substrate is disclosed. A layer of titanium (Ti) is deposited onto the substrate using an ionized metal plasma (IMP) physical vapor deposition process. The IMP process includes: generating gaseous ions, accelerating the gaseous ions towards a titanium target, sputtering the titanium atoms from the titanium target with the gaseous ions, ionizing the titanium atoms using a plasma, and depositing the ionized titanium atoms onto the substrate to form the layer of Ti. A first layer of titanium nitride (TiN) is deposited onto the layer of Ti using a metal organic chemical vapor deposition (MOCVD) process. A second layer of TiN is deposited onto the first layer of TiN using a thermal chemical vapor deposition process. The newly completed barrier layer is annealed in the presence of nitrogen at a temperature of between about 500° C. to about 750° C. | 03-10-2011 |
| 20110055670 | Programming Method and Memory Device Using the Same - A programming method applied to a memory is provided. The memory includes a number of memory cells. The method includes the following steps. A target cell of the memory cells is programmed in response to a first programming command. The target cell is programmed in response to a second programming command. | 03-03-2011 |
| 20110053328 | METHOD FOR MANUFACTURING MEMORY CELL - In a method for manufacturing a memory cell, a substrate is provided. A doped region with a first conductive type is formed in the substrate near a surface of the substrate. A portion of the substrate is removed to define a plurality of fin structures in the substrate. A plurality of isolation structures is formed among the fin structures. A surface of the isolation structures is lower than a surface of the fin structures. A gate structure is formed over the substrate and straddles the fin structure. The gate structure includes a gate straddling the fin structure and a charge storage structure located between the fin structure and the gate. A source/drain region is formed with a second conductive type in the fin structure exposed by the gate structure, and the first conductive type is different from the second conductive type. | 03-03-2011 |
| 20110051525 | POWER SAVING METHOD AND CIRCUIT THEREOF FOR A SEMICONDUCTOR MEMORY - A power saving method for a semiconductor memory is provided. The power saving method for a semiconductor memory including the steps of receiving a plurality of address codes, each of which has a first part code and a second part code; and activating a first boost process when the first part code of a currently received address code is different from the first part code of a last received address code, otherwise a second boost process is activated. | 03-03-2011 |
| 20110049677 | Buried Layer of An Integrated Circuit - Various aspects of the technology are directed to integrated circuit manufacturing methods and integrated circuits. In one method, a first charge type buried layer in a semiconductor material of an integrated circuit by implanting first charge type dopants of the first charge type buried layer through a sacrificial oxide over the semiconductor material and through an intermediate region of the semiconductor material transited by the implanted first charge type dopants. When the implanted dopants pass through the sacrificial oxide, damage to the semiconductor crystalline lattice is averted. If the sacrificial oxide were absent, the implanted dopants would have passed through and damaged the semiconductor crystalline lattice instead. Later, a pre-anneal oxide is grown and removed. | 03-03-2011 |
| 20110049456 | PHASE CHANGE STRUCTURE WITH COMPOSITE DOPING FOR PHASE CHANGE MEMORY - A memory device is described using a composite doped phase change material between a first electrode and a second electrode. A memory element of phase change material, such as a chalcogenide, is between the first and second electrodes and has an active region. The phase change material has a first dopant, such as silicon oxide, characterized by tending to segregate from the phase change material on grain boundaries in the active region, and has a second dopant, such as silicon, characterized by causing an increase in recrystallization temperature of, and/or suppressing void formation in, the phase change material in the active region. | 03-03-2011 |
| 20110044097 | PHASE CHANGE MEMORY AND OPERATION METHOD OF THE SAME - An operation method of phase change memory (PCM) is provided. The operation method includes applying a RESET pulse to a phase change material of the PCM, wherein the RESET pulse has a profile with a first tail such that a plurality of seeds are formed in the phase change material. Due to the design of the RESET pulse in the operation method, it can speed up the crystal process. | 02-24-2011 |
| 20110042738 | NITRIDGE READ-ONLY MEMORY CELL AND METHOD OF MANUFACTURING THE SAME - A nitride read-only memory cell and a method of manufacturing the same are provided. First, a substrate is provided, and a first oxide layer is formed on the substrate. Next, a nitride layer is deposited on the first oxide layer via a first gas and a second gas. The flow ratio of the first gas to the second gas is 2:1. After that, a second oxide layer is formed on the nitride layer. Then, a bit-line region is formed at the substrate. Afterward, a gate is formed on the second oxide layer. The first oxide layer, nitride layer, the second oxide layer and the gate compose a stack structure of the cell. Further, a spacer is formed on the side-wall of the stack structure. | 02-24-2011 |
| 20110039386 | LATERAL POCKET IMPLANT CHARGE TRAPPING DEVICES - A charge trapping memory cell is described, having pocket implants along the sides of the channel and having the same conductivity type as the channel, and which implants have a concentration of dopants higher than in the central region of the channel. This effectively disables the channel in the region of non-uniform charge trapping caused by a bird's beak or other anomaly in the charge trapping structure on the side of the channel. The pocket implant can be formed using a process compatible with standard shallow trench isolation processes. | 02-17-2011 |
| 20110038218 | Memory Chip and Method for Operating the Same - A memory chip and method for operating the same are provided. The memory chip includes a number of pads. The method includes inputting a number of first test signals to the pads respectively, wherein the first test signals corresponding to two physically-adjacent pads are complementary; inputting a number of second test signals, respectively successive to the first test signals, to the pads, wherein the first test signal and the second test signal corresponding to each of the pads are complementary; and outputting expected data from the memory chip if the first test signals and the second test signals are successfully received by the memory chip. | 02-17-2011 |
| 20110038208 | METHOD OF READING DUAL-BIT MEMORY CELL - A method of reading a dual-bit memory cell includes a controlling terminal, a first terminal, and a second terminal. The dual-bit memory cell has a first bit storage node and a second bit storage node near the first terminal and the second terminal respectively. First, a controlling voltage and a read voltage are applied to the controlling terminal and the first terminal respectively. The second terminal is grounded to measure a first output current value of the first terminal. Then, the controlling voltage and the read voltage are applied to the controlling terminal and the second terminal respectively. The first terminal is grounded to measure a second output current value of the second terminal. Afterward, the bit state of the first bit storage node and the bit state of the second bit storage node is read simultaneously according to the first output current value and the second output current value. | 02-17-2011 |
| 20110034003 | Vacuum Cell Thermal Isolation for a Phase Change Memory Device - A memory device with improved thermal isolation. The memory cell includes a first electrode element, having an upper surface; an insulator stack formed on the first electrode element, including first, second and third insulating members, all generally planar in form and having a central cavity formed therein and extending therethrough, wherein the second insulator member is recessed from the cavity; a phase change element, generally T-shaped in form, having a base portion extending into the cavity to make contact with the first electrode element and making contact with the first and third insulating members, and a crossbar portion extending over and in contact with the third insulating member, wherein the base portion of the phase change element, the recessed portions of the second insulating member and the surfaces of the first and third insulating members define a thermal isolation void; and a second electrode formed in contact with the phase change member. | 02-10-2011 |
| 20110032771 | Memory and Reading Method Thereof - A reading method applied for a memory, which includes a cell row including a first memory cell coupled to a first bit line and a second memory cell coupled to a second bit line is provided. The reading method comprises the following steps. Firstly, the first bit line coupled to a first terminal of the first memory cell is selected for reading the first memory cell in a time period. Next, the second terminal of the first memory cell is discharged via the second bit line coupled to the second memory cell in the time period. | 02-10-2011 |
| 20110032770 | High Temperature Methods for Enhancing Retention Characteristics of Memory Devices - Methods are described for improving the retention of a memory device by execution of a retention improvement procedure. The retention improvement procedure comprises a baking process of the memory device in a high temperature environment, a verifying process of the memory device that checks the logic state of memory cells, and a reprogramming process to program the memory device once again by programming memory cells in a 0-state to a high-Vt state. The baking step of placing the memory device in a high temperature environment causes a charge loss by expelling shallow trapped charges, resulting in the improvement of retention reliability. | 02-10-2011 |
| 20110026742 | METHOD OF FABRICATING INTEGRATED SEMICONDUCTOR DEVICE AND STRUCTURE THEREOF - A method of fabricating an integrated semiconductor device, comprising: providing a substrate having a first region and a second region; and forming a semiconductor unit on the first region and forming a micro electro mechanical system (MEMS) unit on the second region in one process. | 02-03-2011 |
| 20110024326 | IC PACKAGE TRAY EMBEDDED RFID - A carrier tray as described herein includes a container having pockets for holding electrical components such as integrated circuits during manufacturing, and a device coupled to the container for tracking usage of the carrier tray into and out of process chambers used for performing particular processes on the electrical components carried therein. Stations and methods of using the carrier tray are also described herein. | 02-03-2011 |
| 20110019487 | APPARATUS AND METHOD FOR DETECTING WORD LINE LEAKAGE IN MEMORY DEVICES - According to an embodiment of the present invention, a method for detecting word line leakage in a memory device includes coupling a first word line in the memory device to a voltage source while coupling a second word line in the memory device to a ground level voltage. Next, the first word line is decoupled from the voltage source. The method also includes comparing a current of the first word line with a predetermined reference current for determining a leakage condition of the word line. | 01-27-2011 |
| 20110019473 | MEMORY ARRAY AND METHOD OF OPERATING ONE OF A PLURALITY OF MEMORY CELLS - An embodiment of the invention provides a memory array including a plurality of bit lines, a plurality of memory cells and a device. Each of the plurality of memory cells has a first node, a second node and a third node, wherein the third node is coupled to one of the plurality of bit lines. The device couples the plurality of bit lines together to form a common node for one of the plurality of memory cells. | 01-27-2011 |
| 20110019456 | SENSE AMPLIFIER WITH SHIELDING CIRCUIT - A sense amplifier comprises a sense node, a reference node, a memory input stage circuit, a reference input stage circuit, an output stage circuit, and a shielding circuit. The memory input stage circuit comprises first input node for maintaining a first sense voltage established by a cell current and establishes a second sense voltage on the sense node in response to the first sense voltage. The reference input stage circuit comprises an output node and a second input node, which is for maintaining a first reference voltage established by the reference current and establishes a second reference voltage on the reference node in response to the first reference voltage. The output stage circuit obtains a sense result in response to the second reference voltage and the second sense voltage. The first shielding circuit shields the output node from being interfered with the second reference voltage on the reference node. | 01-27-2011 |
| 20110017970 | SELF-ALIGN PLANERIZED BOTTOM ELECTRODE PHASE CHANGE MEMORY AND MANUFACTURING METHOD - A method is described for self-aligning a bottom electrode in a phase change random access memory PCRAM device where a top electrode serves as a mask for self-aligning etching of the bottom electrode. The bottom electrode has a top surface that is planarized by chemical mechanical polishing. The top electrode also has a top surface that is planarized by chemical mechanical polishing. A bottom electrode layer like TiN is formed over a substrate and prior to the formation of a via during subsequent process steps. A first dielectric layer is formed over the bottom electrode layer, and a second dielectric layer is formed over the first dielectric layer. A via is formed at a selected section that extends through the first and second dielectric layers. | 01-27-2011 |
| 20110016370 | MEMORY APPARATUS AND OPERATION METHOD THEREOF - A memory apparatus and an operation method thereof are provided. The memory apparatus includes a plurality of multi-level cells and a controller. The controller encodes input data according to a target encoding code to generate a plurality of encoded subsets, and stores the encoded subsets into the multi-level cells. Thereafter, the controller could read data from the multi-level cells, perform an error correction procedure on the read data to correct and recover the read data as recovered data, and decode the recovered data according to the target encoding code. Consequently, sensing windows between threshold voltage distributions of the multi-level cells are expanded. | 01-20-2011 |
| 20110016291 | Serial Memory Interface for Extended Address Space - An integrated circuit memory device has a memory array and control logic with at least a first addressing mode in which the instruction includes a first instruction code and an address of a first length; and a second addressing mode in which the instruction includes the first instruction code and an address of a second length. The first length of the address is different from the second length of the address. | 01-20-2011 |
| 20110016288 | Serial Flash Memory and Address Transmission Method Thereof - A serial flash memory and an address transmission method thereof. The serial flash memory selectively addresses a first memory space according to a first address length or addresses a second memory space according to a second address length longer than the first address length. If the first memory space is addressed according to the first address length, a first memory address is completely received within an address time duration so that data corresponding to the first memory address is initially outputted from a starting clock. In the address transmission method, if the second memory space is addressed according to the second address length, a portion of a second memory address is received within the address time duration. The other portion of the second memory address is received within a waiting time duration so that data corresponding to the second memory address is initially outputted from the starting clock. | 01-20-2011 |
| 20110013462 | Method for Operating Memory - A memory operating method includes the following steps. First, a memory with a charge storage structure is provided. Next, the memory is biased to a first threshold voltage. Then, the memory is biased to a second threshold voltage. Next, the memory is biased to a third threshold voltage. The first threshold voltage is higher than a first level. The second threshold voltage is lower than a second level. The third threshold voltage is approximating or equal to the second level. | 01-20-2011 |
| 20110013446 | REFRESH CIRCUITRY FOR PHASE CHANGE MEMORY - A memory device as described herein includes a reference array of phase change memory cells and a memory array of phase change memory cells, where a difference between a current data set stored in the reference array and an expected data set is used to determine when to refresh the memory array. The high resistance state for the reference array is a “partial reset” state having a minimum resistance less than that of the high resistance state for the memory array. Sense circuitry is adapted to read the memory cells of the reference array and to generate a refresh command signal if there is a difference between a current data set stored in the reference array and an expected data set, and control circuitry responsive to the refresh command signal to perform a refresh operation on the memory cells of the memory array. | 01-20-2011 |
| 20110012192 | Vertical Channel Transistor Structure and Manufacturing Method Thereof - A vertical channel transistor structure is provided. The structure includes a substrate, a channel, a cap layer, a charge trapping layer, a source and a drain. The channel is formed in a fin-shaped structure protruding from the substrate. The cap layer is deposited on the fin-shaped structure. The cap layer and the fin-shaped structure have substantially the same width. The charge trapping layer is deposited on the cap layer and on two vertical surfaces of the fin-shaped structure. The gate is deposited on the charge trapping layer and on two vertical surfaces of the fin-shaped structure. The source and the drain are respectively positioned on two sides of the fin-shaped structure and opposite the gate. | 01-20-2011 |
| 20110012084 | RESISTOR RANDOM ACCESS MEMORY CELL WITH REDUCED ACTIVE AREA AND REDUCED CONTACT AREAS - A memory device has a sidewall insulating member with a sidewall insulating member length according to a first spacer layer thickness. A first electrode formed from a second spacer layer having a first electrode length according to a thickness of a second spacer layer and a second electrode formed from the second spacer layer having a second electrode length according to the thickness of the second spacer layer are formed on sidewalls of the sidewall insulating member. A bridge of memory material having a bridge width extends from a top surface of the first electrode to a top surface of the second electrode across a top surface of the sidewall insulating member, wherein the bridge comprises memory material. | 01-20-2011 |
| 20110012083 | PHASE CHANGE MEMORY CELL STRUCTURE - A memory cell described herein includes a memory element comprising programmable resistance memory material overlying a conductive contact. An insulator element includes a pipe shaped portion extending from the conductive contact into the memory element, the pipe shaped portion having proximal and distal ends and an inside surface defining an interior, the proximal end adjacent the conductive contact. A bottom electrode contacts the conductive contact and extends upwardly within the interior from the proximal end to the distal end, the bottom electrode having a top surface contacting the memory element adjacent the distal end at a first contact surface. A top electrode is separated from the distal end of the pipe shaped portion by the memory element and contacts the memory element at a second contact surface, the second contact surface having a surface area greater than that of the first contact surface. | 01-20-2011 |
| 20110012079 | THERMAL PROTECT PCRAM STRUCTURE AND METHODS FOR MAKING - A memory cell as described herein includes a conductive contact and a memory element comprising programmable resistance memory material overlying the conductive contact. An insulator element extends from the conductive contact into the memory element, the insulator element having proximal and distal ends and an inside surface defining an interior. The proximal end is adjacent the conductive contact. A bottom electrode contacts the conductive contact and extends upwardly within the interior from the proximal end. The memory element is within the interior extending downwardly from the distal end to contact a top surface of the bottom electrode at a first contact surface. A top electrode can be separated from the distal end of the insulator element by the memory element and contact the memory element at a second contact surface having a surface area greater than that of the first contact surface. | 01-20-2011 |
| 20110007577 | ACCESSING METHOD AND A MEMORY USING THEREOF - A memory comprises a memory cell, a sense amplifier, and a control unit. The memory cell stores a first bit and a second bit. The sense amplifier senses a first cell current and a second cell current corresponding to the first and the second bits respectively with a voltage applying on the memory cell. The control unit determines a digital state of the first bit by comparing a first reference current with the first cell current or by comparing a reference data with a first delta current between the first cell current and the second cell current. | 01-13-2011 |
| 20110006279 | PHASE CHANGE MEMORY - A phase change memory (PCM) is provided which includes a substrate, a plurality of bottom electrodes, a plurality of top electrodes, a plurality of phase change materials, and a plurality of thermal disturbance-preventing parts. The bottom electrodes are disposed in the substrate, and the top electrodes are disposed on the substrate. The phase change (PC) materials are disposed between the top and bottom electrodes, and each of the PC materials is conducted with one of the top electrodes and one of the bottom electrodes. The thermal disturbance-preventing parts are utilized to reduce the effect of thermal disturbance upon the PCM. | 01-13-2011 |
| 20110003452 | HIGH-k CAPPED BLOCKING DIELECTRIC BANDGAP ENGINEERED SONOS AND MONOS - A blocking dielectric engineered, charge trapping memory cell includes a charge trapping element that is separated from a gate by a blocking dielectric including a buffer layer in contact with the charge trapping element, such as silicon dioxide which can be made with high-quality, and a second capping layer in contact with said one of the gate and the channel. The capping layer has a dielectric constant that is higher than that of the first layer, and preferably includes a high-κ material. The second layer also has a conduction band offset that is relatively high. A bandgap engineered tunneling layer between the channel and the charge trapping element is provided which, in combination with the multilayer blocking dielectric described herein, provides for high-speed erase operations by hole tunneling. In an alternative, a single layer tunneling layer is used. | 01-06-2011 |
| 20110003446 | Semiconductor Device and Method for Manufacturing the Same - A semiconductor device includes an insulating layer, a channel structure, an insulating structure and a gate. The channel structure includes a channel bridge for connecting two platforms. The bottom of the channel bridge is separated from the insulating layer by a distance, and the channel bridge has a plurality of separated doping regions. The insulating structure wraps around the channel bridge, and the gate wraps around the insulating structure. | 01-06-2011 |
| 20110002166 | TWO-BIT NON-VOLATILE FLASH MEMORY ARRAY - A memory array comprises a semiconductor substrate, two-bit memory cells, word lines, a gate voltage source, bit lines and bit line control cells. The memory cells have a first and a second source/drain regions, each memory cell includes a dielectric trapping layer, and the dielectric trapping layer is disposed between a first oxide layer and a gate layer. The word lines are coupled to the gate layer. The gate voltage source is coupled to the word lines and configured to apply erase voltages between 14 and 20 volts to the word lines. The bit lines are in electrical communication with the first and the second source/drain regions. The bit line control cells are disposed at the beginning and end of each bit line, the bit line control cells are configured to control the electrical communication of each bit line with the first and the second source/drain regions. | 01-06-2011 |
| 20110001536 | STATIC LATCH - A static latch includes a clock-based driver, an actuation circuit, and a weak latched unit. The clock-based driver includes first node, second node, a driving unit, first pass switch, and second pass switch. The driving unit drives the first node corresponding to first voltage in response to first level of an input signal and drives the second node having second voltage in response to second level of the input signal. The first pass switch drives an output node having a latched signal corresponding to the first voltage in response to the clock signal. The second pass switch drives the output node corresponding to the second voltage in response to the inverted clock signal. The actuation circuit drives the output node corresponding to the second voltage in response to the clock signal. The weak latch unit keeps the level of the latched signal when the static latch is disabled. | 01-06-2011 |
| 20100328996 | PHASE CHANGE MEMORY HAVING ONE OR MORE NON-CONSTANT DOPING PROFILES - A phase change memory device with a memory element including a basis phase change material, such as a chalcogenide, and one or more additives, where the additive or additives have a non-constant concentration profile along an inter-electrode current path through a memory element. The use of “non-constant” concentration profiles for additives enables doping the different zones with different materials and concentrations, according to the different crystallographic, thermal and electrical conditions, and different phase transition conditions. | 12-30-2010 |
| 20100328995 | METHODS AND APPARATUS FOR REDUCING DEFECT BITS IN PHASE CHANGE MEMORY - Phase change memory devices and methods for operating described herein are based on the discovery that, following an initial high current operation applied to a phase change memory cell to establish the high resistance reset state, the current-voltage (I-V) behavior of the memory cell under different bias voltages can be used to detect if the memory cell is a defect cell having poor data retention characteristics. | 12-30-2010 |
| 20100323483 | METHOD OF FABRICATING MEMORY - A method of fabricating a semiconductor device is provided. First, a stacked structure is formed on a substrate. The stacked structure includes, from the substrate, a dielectric layer and a conductive gate in order. An ion implant process is performed to form doped regions in the substrate on the opposite sides of the stacked structure. Thereafter, source-side spacer is formed on a sidewall of the stacked structure. A thermal process is performed to activate the doped regions, thereby forming a source in the substrate under the sidewall of the stacked structure having the source-side spacer and a drain in the substrate on another side of the stacked structure. | 12-23-2010 |
| 20100322018 | Temperature Compensation Circuit and Method for Sensing Memory - A compensation circuit includes a comparator and an emulation circuit. The comparator has a first terminal, and a second terminal for receiving a reference voltage. The emulation circuit is coupled to the first terminal of the comparator. The emulation circuit responses to the temperature, so that the comparator outputs a read timing control signal at a first time spot, or outputs the read timing control signal at a second time spot, the first time spot is later than the second time spot. | 12-23-2010 |
| 20100321987 | MEMORY DEVICE AND METHOD FOR SENSING AND FIXING MARGIN CELLS - A programmable resistance memory device with a margin cell detection and refresh resources. Margin cell detection and refresh can comprise reading a selected cell, measuring a time interval which correlates with resistance of the selected cell during said reading, and enabling a refresh process if the measured time falls within a pre-specified range. The refresh process includes determining a data value stored in the selected cell, using for example a destructive read process, and refreshing the data value in the selected cell. The time interval can be measured by detecting timing within the sensing interval of a transition of voltage or current on a bit line across a threshold. | 12-23-2010 |
| 20100319174 | Adjusting Mechanism and Adjusting Method Thereof - An adjusting mechanism adjusts a boat to be parallel to a furnace having an opening and a receiving space, which has a first symmetrical line. When the boat having a second symmetrical line is inserted into the space, a first gap area is formed between sidewalls of the space and the boat. The mechanism includes an adjusting element and an adjusting tool, which is removably disposed in the opening and has a wide part, a narrow part and a through hole. The narrow part blocks the opening. When the boat is inserted into the space, a second gap area smaller than the first gap area is formed between the sidewalls of the boat and the through hole at the narrow part. The adjusting element adjusts the first and second symmetrical lines to be parallel to each other according to the second gap area. | 12-23-2010 |
| 20100314680 | MEMORY ARRAY - A memory array includes a charge storage structure and a plurality of conductive materials over the charge storage structure is provided. Each conductive material, serving as a word line, has a substantially arc-sidewall and a substantially straight sidewall. | 12-16-2010 |
| 20100314601 | PHASE CHANGE MEMORY HAVING STABILIZED MICROSTRUCTURE AND MANUFACTURING METHOD - A memory device having a phase change material element with a modified stoichiometry in the active region does not exhibit drift in set state resistance. A method for manufacturing the memory device includes first manufacturing an integrated circuit including an array of phase change memory cells with bodies of phase change material having a bulk stoichiometry; and then applying forming current to the phase change memory cells in the array to change the bulk stoichiometry in active regions of the bodies of phase change material to the modified stoichiometry, without disturbing the bulk stoichiometry outside the active regions. The bulk stoichiometry is characterized by stability under the thermodynamic conditions outside the active region, while the modified stoichiometry is characterized by stability under the thermodynamic conditions inside the active region. | 12-16-2010 |
| 20100311217 | Non-Volatile Memory Device Having A Nitride-Oxide Dielectric Layer - A non-volatile memory cell may include a semiconductor substrate; a source region in a portion of the substrate; a drain region within a portion of the substrate; a well region within a portion of the substrate. The memory cell may further include a first carrier tunneling layer over the substrate; a charge storage layer over the first carrier tunneling layer; a second carrier tunneling layer over the charge storage layer; and a conductive control gate over the second carrier tunneling layer. Specifically, the drain region is spaced apart from the source region, and the well region may surround at least a portion of the source and drain regions. In one example, the second carrier tunneling layer provides hole tunneling during an erasing operation and may include at least one dielectric layer. | 12-09-2010 |
| 20100310342 | METHOD AND APPARATUS FOR TRANSFERRING SUBSTRATE - A method and an apparatus for transferring a substrate are described. In the method, a substrate is provided on the surface of a first plate at a first position, the first plate is moved from the first position to a second position in an upper space of a second plate, the substrate is lifted away from the surface of the first plate, the first plate is moved away from the second position, and the substrate is put on the surface of the second plate from the upper space. The apparatus includes a first plate and a second plate each having a surface for carrying the substrate, wherein the first plate can be moved between the first position and the second position. | 12-09-2010 |
| 20100304541 | SYSTEMS AND METHODS FOR MEMORY STRUCTURE COMPRISING A PPROM AND AN EMBEDDED FLASH MEMORY - A memory structure that combines embedded flash memory and PPROM. The PPROM can be used as a memory structure. The flash memory can be used, e.g., as air replacement cells or back up memory, or additional memory cells. The PPROM cells are stacked on top of the flash memory cells and the PPROM density can be increased by implementing three-dimensional PPROM structures. | 12-02-2010 |
| 20100302863 | Reading Method for MLC Memory and Reading Circuit Using the Same - A reading method for a multi-level cell (MLC) memory includes the following steps. A number of word line voltages are sequentially provided to an MLC memory cell. A number of bit line voltages corresponding to the word line voltages are sequentially provided to the MLC memory cell. One of the word line voltages is higher than another one of the word line voltages, and one of the bit line voltages corresponding to the one of the word line voltages is lower than another one of the bit line voltages corresponding to the another one of the word line voltages. | 12-02-2010 |
| 20100302855 | MEMORY DEVICE AND METHODS FOR FABRICATING AND OPERATING THE SAME - The memory device is described, which includes a substrate, a conductive layer, a plurality of charge storage layers and a plurality of doped regions. The substrate has a plurality of trenches formed therein. The conductive layer is disposed on the substrate and fills the trenches. The charge storage layers are disposed between the substrate and the conductive layer in the trenches respectively, wherein the charge storage layers are separated from each other. The doped regions are configured in the substrate under bottoms of the trenches, respectively. | 12-02-2010 |
| 20100302845 | MEMORY DEVICE AND METHODS FOR FABRICATING AND OPERATING THE SAME - The memory device is described, which includes a substrate, a conductive layer, a charge storage layer, a plurality of first doped regions and a plurality of second doped regions. The substrate has a plurality of trenches formed therein. The conductive layer is disposed on the substrate and fills the trenches. The charge storage layer is disposed between the substrate and the conductive layer. The first doped regions are configured in the substrate adjacent to both sides of an upper portion of each trench, respectively. The first doped regions between the neighbouring trenches are separated from each other. The second doped regions are configured in the substrate under bottoms of the trenches, respectively. The second doped regions and the first doped regions are separated from each other, such that each memory cell includes six physical bits. | 12-02-2010 |
| 20100301918 | Level Shifter and Level Shifting Method Thereof - A level shifter includes a first level-switching device and a second level-switching device. The first level-switching device includes a first switch device, a second switch device, a first control switch and a third switch device. The first switch device is for receiving the input voltage and outputting a first voltage. The second switch device is coupled to the first switch device for outputting a first operational voltage as the output voltage according to the first voltage. The first control switch is coupled to the first switch device for receiving the first voltage. The third switch device is coupled between the first control switch and the first operational voltage and controlled by the output voltage. The second level-switching device is coupled to the first level-switching device for receiving the input voltage and accordingly outputting a second operational voltage as the output voltage. | 12-02-2010 |
| 20100301304 | BURIED SILICIDE STRUCTURE AND METHOD FOR MAKING - Methods for manufacturing buried silicide lines are described herein, along with high density stacked memory structures. A method for manufacturing an integrated circuit as described herein includes forming a semiconductor body comprising silicon. A plurality of trenches are formed in the semiconductor body to define semiconductor lines comprising silicon between adjacent trenches, the semiconductor lines having sidewalls. A silicide precursor is deposited within the trenches to contact the sidewalls of the semiconductor lines, and a portion of the silicide precursor is removed to expose upper portions of the sidewalls and leave remaining strips of silicide precursor along the sidewalls. Silicide conductors are then formed by inducing reaction of the strips of silicide with the silicon of the semiconductor lines. | 12-02-2010 |
| 20100299473 | SERIAL PERIPHERAL INTERFACE AND METHOD FOR DATA TRANSMISSION - A serial peripheral interface of an integrated circuit including multiple pins and a clock pin is provided. The pins are coupled to the integrated circuit for transmitting an instruction, an address or a read out data. The clock pin is coupled to the integrated circuit for inputting multiple timing pulses. The plurality of pins transmit the instruction, the address or the read out data at rising edges, falling edges or both edges of the timing pulses. | 11-25-2010 |
| 20100297824 | MEMORY STRUCTURE WITH REDUCED-SIZE MEMORY ELEMENT BETWEEN MEMORY MATERIAL PORTIONS - A memory cell device includes a memory cell access layer, a dielectric material over the memory cell access layer, a memory material structure within the dielectric material, and a top electrode in electrical contact with the memory material structure. The memory material structure has upper and lower memory material portions and a memory material element therebetween. The lower memory material layer is in electrical contact with a bottom electrode. The lower memory material layer has an average lateral dimension. The memory material element defines an electrical property state change region therein and has a minimum lateral dimension which is substantially less than the average lateral dimension. In some examples the memory material element is a tapered structure with the electrical property state change region at the junction of the memory material element and the lower memory material layer. | 11-25-2010 |
| 20100296328 | BURIED BIT LINE ANTI-FUSE ONE-TIME-PROGRAMMABLE NONVOLATILE MEMORY - An anti-fuse one-time-programmable (OTP) nonvolatile memory cell has a P well substrate with two P.sup.-doped regions. Another N.sup.+doped region, functioning as a bit line, is positioned adjacent and between the two P.sup.-doped regions on the substrate. An anti-fuse is defined over the N.sup.+doped region. Two insulator regions are deposited over the two P.sup.-doped regions. An impurity doped polysilicon layer is defined over the two insulator regions and the anti-fuse. A polycide layer is defined over the impurity doped polysilicon layer. The polycide layer and the polysilicon layer function as a word line. A programmed region, i.e., a link, functioning as a diode, is formed on the anti-fuse after the anti-fuse OTP nonvolatile memory cell is programmed. The array structure of anti-fuse OTP nonvolatile memory cells and methods for programming, reading, and fabricating such a cell are also disclosed. | 11-25-2010 |
| 20100295147 | ISOLATION STRUCTURE AND FORMATION METHOD THEREOF - An isolation structure comprising a substrate is provided. A trench is in the substrate. A sidewall of the trench has a first inclined surface and a second inclined surface. The first inclined surface is located on the second inclined surface. The slope of the first inclined surface is different from the slope of the second inclined surface. A length of the first inclined surface is greater than 15 nanometers. | 11-25-2010 |
| 20100295123 | Phase Change Memory Cell Having Vertical Channel Access Transistor - Memory devices are described along with methods for manufacturing. A device as described herein includes a substrate having a first region and a second region. The first region comprises a first field effect transistor comprising first and second doped regions separated by a horizontal channel region within the substrate, a gate overlying the horizontal channel region, and a first dielectric covering the gate of the first field effect transistor. The second region of the substrate includes a second field effect transistor comprising a first terminal extending through the first dielectric to contact the substrate, a second terminal overlying the first terminal and having a top surface, and a vertical channel region separating the first and second terminals. The second field effect transistor also includes a gate on the first dielectric and adjacent the vertical channel region, the gate having a top surface that is co-planar with the top surface of the second terminal. A second dielectric separates the gate of the second field effect transistor from the vertical channel region. | 11-25-2010 |
| 20100295009 | Phase Change Memory Cells Having Vertical Channel Access Transistor and Memory Plane - Memory devices are described along with methods for manufacturing. A memory device as described herein comprises a plurality of word lines overlying a plurality of bit lines, and a plurality of field effect transistors. Field effect transistors in the plurality of field effect transistors comprises a first terminal electrically coupled to a corresponding bit line in the plurality of bit lines, a second terminal overlying the first terminal, and a channel region separating the first and second terminals and adjacent a corresponding word line in the plurality of word lines. The corresponding word line acts as the gate of the field effect transistor. A dielectric separates the corresponding word line from the channel region. A memory plane comprises programmable resistance memory material electrically coupled to respective second terminals of the field effect transistors, and conductive material on the programmable resistance memory material and coupled to a common voltage. | 11-25-2010 |
| 20100293320 | METHOD AND APPARATUS FOR BYTE-ACCESS IN BLOCK-BASED FLASH MEMORY - Techniques are described herein for managing data in a block-based flash memory device which avoid the need to perform sector erase operations each time data stored in the flash memory device is updated. As a result, a large number of write operations can be performed before a sector erase operation is needed. In addition, the block-based flash memory can emulate both programming and erasing on a byte-by-byte basis, like that provided by an EEPROM. | 11-18-2010 |
| 20100291747 | Phase Change Memory Device and Manufacturing Method - A phase change memory device comprises a photolithographically formed phase change memory cell having first and second electrodes and a phase change element positioned between and electrically coupling the opposed contact elements of the electrodes to one another. The phase change element has a width, a length and a thickness. The length, the thickness and the width are less than a minimum photolithographic feature size of the process used to form the phase change memory cell. The size of the photoresist masks used in forming the memory cell may be reduced so that the length and the width of the phase change element are each less than the minimum photolithographic feature size. | 11-18-2010 |
| 20100290271 | ONE-TRANSISTOR, ONE-RESISTOR, ONE-CAPACITOR PHASE CHANGE MEMORY - Memory devices and methods for operating such devices are described herein. A memory cell as described herein comprises a transistor electrically coupled to first and second access lines. A programmable resistance memory element is arranged along a current path between the first and second access lines. A capacitor is electrically coupled to the current path between the first and second access lines. | 11-18-2010 |
| 20100289093 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device is described, which includes a substrate, a gate structure, doped regions and lightly doped regions. The substrate has a stepped upper surface, which includes a first surface, a second surface and a third surface. The second surface is lower than the first surface. The third surface connects the first surface and the second surface. The gate structure is disposed on the first surface. The doped regions are configured in the substrate at both sides of the gate structure and under the second surface. The lightly doped regions are configured in the substrate between the gate structure and the doped regions, respectively. Each lightly doped region includes a first part and a second part connecting with each other. The first part is disposed under the second surface, and the second part is disposed under the third surface. | 11-18-2010 |
| 20100284220 | OPERATION METHOD OF NON-VOLATILE MEMORY - An operation method of a non-volatile memory for reducing the second-bit effect in the non-volatile memory is suitable for an N-level memory cell having a first storage position and a second storage position (wherein N is a positive integer greater than 2). The method includes following steps: determining sets of operation levels for operating the first storage position according to the level of the second storage position; when the level of the second storage position is a lower level, operating the first storage position according to a first set of operation levels; when the level of the second storage position is a higher level, operating the first storage position according to a second set of operation levels. Each of the levels in the second set of operation levels is greater than the corresponding level in the first set of operation levels. | 11-11-2010 |
| 20100279211 | METHOD FOR DESIGNING ASSISTANT PATTERN - The invention is directed to a method for designing an assistant pattern of a mask pattern on a mask. The mask pattern has an assistant pattern arrangement region around a main pattern. The method comprising defining a reverse pattern of the main pattern. The reverse pattern is shrunken to be a first shrunken pattern with a first shrinking proportion and a first margin placed within the assistant pattern arrangement region. The reverse pattern is shrunken to be a second shrunken pattern with a second shrinking proportion and a second margin placed within the assistant pattern arrangement region. The first shrunken pattern and the second shrunken pattern are merged to define an assistant pattern of the mask pattern, wherein the assistant pattern entirely surrounds the main pattern. | 11-04-2010 |
| 20100277967 | GRADED METAL OXIDE RESISTANCE BASED SEMICONDUCTOR MEMORY DEVICE - Memory devices are described along with methods for manufacturing and methods for operating. A memory device as described herein includes a plurality of memory cells located between word lines and bit lines. Memory cells in the plurality of memory cells comprise a diode and a metal-oxide memory element programmable to a plurality of resistance states including a first and a second resistance state, the diode of the memory element arranged in electrical series along a current path between a corresponding word line and a corresponding bit line. The device further includes bias circuitry to apply bias arrangements across the series arrangement of the diode and the memory element of a selected memory cell in the plurality of memory cells. | 11-04-2010 |
| 20100276658 | Resistive Memory Structure with Buffer Layer - A memory device comprises first and second electrodes with a memory element and a buffer layer located between and electrically coupled to them. The memory element comprises one or more metal oxygen compounds. The buffer layer comprises at least one of an oxide and a nitride. Another memory device comprises first and second electrodes with a memory element and a buffer layer, having a thickness of less than 50 Å, located between and electrically coupled to them. The memory comprises one or more metal oxygen compounds. An example of a method of fabricating a memory device includes forming first and second electrodes. A memory, located between and electrically coupled to the first and the second electrodes, is formed; the memory comprises one or more metal oxygen compounds and the buffer layer comprises at least one of an oxide and a nitride. | 11-04-2010 |
| 20100276654 | Low Operational Current Phase Change Memory Structures - Memory cells described herein have an increased current density at lateral edges of the active region compared to that of conventional mushroom-type memory cells, resulting in improved operational current efficiency. | 11-04-2010 |
| 20100270593 | INTEGRATED CIRCUIT 3D MEMORY ARRAY AND MANUFACTURING METHOD - A 3D memory device is based on an array of electrode pillars and a plurality of electrode planes that intersect the electrode pillars at interface regions that include memory elements that comprise a programmable element and a rectifier. The electrode pillars can be selected using two-dimensional decoding, and the plurality of electrode planes can be selected using decoding on a third dimension. | 10-28-2010 |
| 20100265773 | 3D MEMORY ARRAY ARRANGED FOR FN TUNNELING PROGRAM AND ERASE - A 3D memory device includes an array of semiconductor body pillars and bit line pillars, dielectric charge trapping structures, and a plurality of levels of word line structures arranged orthogonally to the array of semiconductor body pillars and bit line pillars. The semiconductor body pillars have corresponding bit line pillars on opposing first and second sides, providing source and drain terminals. The semiconductor body pillars have first and second channel surfaces on opposing third and fourth sides. Dielectric charge trapping structures overlie the first and second channel surfaces, providing data storage sites on two sides of each semiconductor body pillar in each level of the 3D array. The device can be operated as a 3D AND-decoded flash memory. | 10-21-2010 |
| 20100265766 | BANDGAP ENGINEERED CHARGE TRAPPING MEMORY IN TWO-TRANSISTOR NOR ARCHITECTURE - A 2T cell NOR architecture based on the use of BE-SONOS for embedded memory includes memory cells having respective access transistors having access gates and memory transistors having memory gates arranged in series between the corresponding bit lines and one of the plural reference lines. A memory transistor in a memory cell comprises a semiconductor body including a channel having a channel surface and a charge storing dielectric stack between the memory gate and the channel surface. The dielectric stack comprises a bandgap engineered, tunneling dielectric layer contacting one of the gate (for gate injection tunneling) and the channel surface (for channel injection tunneling). The dielectric stack of the memory cell also includes a charge trapping dielectric layer on the tunneling dielectric layer and a blocking dielectric layer. | 10-21-2010 |
| 20100264396 | RING-SHAPED ELECTRODE AND MANUFACTURING METHOD FOR SAME - An electrode structure and a method for manufacturing an integrated circuit electrode includes forming a bottom electrode comprising a pipe-shaped member, filled with a conductive material such as n-doped silicon, and having a ring-shaped top surface. A disc-shaped insulating member is formed on the top of the pipe-shaped member by oxidizing the conductive fill. A layer of programmable resistance material, such as a phase change material, is deposited in contact with the top surface of the pipe-shaped member. A top electrode in contact with the layer of programmable resistance material. | 10-21-2010 |
| 20100258913 | PATTERNING METHOD AND INTEGRATED CIRCUIT STRUCTURE - A patterning method is provided. First, a mask layer and a plurality of first transfer patterns are sequentially formed on a target layer. Thereafter, a plurality of second patterns is formed in the gaps between the first transfer patterns. Afterwards, a plurality of third transfer patterns is formed, wherein each of the third transfer patterns is in a gap between a first transfer pattern and a second transfer pattern adjacent to the first transfer pattern. A portion of the mask layer is then removed, using the first transfer patterns, the second transfer patterns and third transfer patterns as a mask, so as to form a patterned mask layer. Further, a portion of the target layer is removed using the patterned mask layer as a mask. | 10-14-2010 |
| 20100254194 | MEMORY APPARATUS AND METHOD FOR OPERATING THE SAME - The invention provides a method for reading a first data storage of a memory cell. The method comprises sensing a first current of the memory cell by applying a first bit line voltage on the memory cell. When the first current is larger than a first reference current with respect to the first bit line voltage, the first data storage is determined to be at an un-programmed state. Otherwise, a second current of the memory cell is sensed by applying a second bit line voltage on the memory cell. When the difference between the first current and the second current is larger than the difference between the first reference current and the second reference current, the first data storage is determined to be at the un-programmed state. Otherwise, the first data storage is determined to be at a programmed state | 10-07-2010 |
| 20100252878 | NON-VOLATILE MEMORY CELL - A super-silicon-rich oxide (SSRO) non-volatile memory cell includes a gate conductive layer on a substrate, a source/drain in the substrate at respective sides of the gate conductive layer, a tunneling dielectric layer between the gate conductive layer and the substrate, a SSRO layer serving as a charge trapping layer between the gate conductive layer and the tunneling dielectric layer, and an upper-dielectric layer between the gate conductive layer and the SSRO layer. | 10-07-2010 |
