MACDERMID ACUMEN, INC.
|MACDERMID ACUMEN, INC. Patent applications|
|Patent application number||Title||Published|
|20150259816||Electroplating of Metals on Conductive Oxide Substrates - A method of electroplating metal onto a transparent conductive oxide layer is described. The method comprises the steps of a) electroplating a zinc or zinc oxide seed layer directly onto the transparent conductive oxide layer and thereafter, b) electroplating one or more additional metal layers over the zinc layer. The one or more additional metal layers may include a cobalt strike layer electroplated over the zinc or zinc oxide seed layer and another metal layer such as copper, electroplated over the cobalt strike layer.||09-17-2015|
|20150252487||Passivation of Micro-Discontinuous Chromium Deposited From a Trivalent Electrolyte - A method of treating a substrate, wherein the substrate comprises a layer deposited from a trivalent chromium electrolyte, is described. The method includes the steps of providing an anode and the chromium(III) plated substrate as a cathode in an electrolyte comprising (i) a trivalent chromium salt; and (ii) a complexant; and passing an electrical current between the anode and the cathode to passivate the chromium(III) plated substrate. The substrate may be first plated with a plated nickel layer so that the chromium(III) plated layer is deposited over the nickel plated layer.||09-10-2015|
|20150233011||Treatment for Electroplating Racks to Avoid Rack Metallization - An electroplating rack for supporting non-conductive substrates during an electrodeposition process is described. The electroplating rack is coated with a non-conductive material, such as a PVC plastisol. The electroplating rack is treated with a non-aqueous solution comprising a metallization inhibitor prior to the electrodeposition process to inhibit rack plate up when using etchants that do not contain chromic acid.||08-20-2015|
|20150044374||Electroless Nickel Plating Solution and Method - An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value.||02-12-2015|
|20140318983||Regeneration of Etch Solutions Containing Trivalent Manganese in Acid Media - A method of regenerating an etch solution comprising a metastable complex of manganese(III) ions in a strong acid is described in which at least a portion of the manganese(III) ions in the metastable complex have been destabilized, causing them to disproportionate into manganese dioxide and manganese(II) ions. The method includes the steps of i) adding an effective amount of a reducing agent to the solution; ii) allowing the reducing agent to react with the solution to cause manganese dioxide to dissolve; and (iii) applying an electrical current to regenerate manganese(III) ions in the solution.||10-30-2014|
|20140256083||High Speed Copper Plating Process - A copper electrolyte comprising a copper nitrate salt is described. The electrolyte is suitable for use in a light induced plating process for metallizing contacts in a photovoltaic solar cell. A method of metallizing an electrical contact in a photovoltaic solar cell using the copper electrolyte is also described.||09-11-2014|
|20140163198||Method of Producing Polymeric Phenazonium Compounds - A process of making a polymeric phenazonium compound having the general formula:||06-12-2014|
|20140134338||Treatment of Plastic Surfaces After Etching in Nitric Acid Containing Media - A process for plating metal on plastic substrates, particularly ABS substrates, without the use of chrome containing etchants is disclosed. The process involves (i) etching the plastic substrate in an acidic solution of nitrate ions, and preferably silver ions, (ii) conditioning the substrate in an aqueous solution containing an amine or ammonia, (iii) activating the substrate, preferably with a palladium activator, and (iv) plating the substrate with an electroless plating solution. The process allows for complete adherent electroless plating of plastic substrates, particularly ABS substrates, without the use of chromic etchants.||05-15-2014|
|20130186862||Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid - An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of at least one acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, woven carbon fibers, lead and lead alloy. Once the electrolyte is oxidized to form a metastable complex of manganese(III) ions, a platable plastic may be contacted with the metastable complex to etch the platable plastic. In addition, a pretreatment step may also be performed on the platable plastic prior to contacting the platable plastic with the metastable complex to condition the plastic surface.||07-25-2013|
|20130186861||Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid Using an Improved Anode - An electrolytic cell and a method of electrochemical oxidation of manganese (II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of 9 to 15 molar sulfuric acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, and woven carbon fibers.||07-25-2013|
|20130136869||Method for Improving Plating on Non-Conductive Substrates - A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.||05-30-2013|
|20130078754||Light Induced Plating of Metals on Silicon Photovoltaic Cells - A method and composition for plating metal contacts on photovoltaic solar cells is described. The cell is immersed in an aqueous bath containing platable metal ions and a solubilizing agent for aluminum or aluminum alloy ions from the back side of the solar cell. The cell is then exposed to light, causing the two sides of the cell to become oppositely charged. The metal ions are plated without requiring an external electrical contact.||03-28-2013|
Patent applications by MACDERMID ACUMEN, INC.