LUXVUE TECHNOLOGY CORPORATION Patent applications |
Patent application number | Title | Published |
20150348504 | INTERACTIVE DISPLAY PANEL WITH EMITTING AND SENSING DIODES - Exemplary methods and systems use a micro light emitting diode (LED) in an active matrix display to emit and sense light. Display panels, systems, and methods of operation are described in which LEDs may be used for both emission and sensing. | 12-03-2015 |
20150333221 | FLEXIBLE DISPLAY AND METHOD OF FORMATION WITH SACRIFICIAL RELEASE LAYER - A flexible display panel and method of formation with a sacrificial release layer are described. The method of manufacturing a flexible display system includes forming a sacrificial layer on a carrier substrate. A flexible display substrate is formed on the sacrificial layer, with a plurality of release openings that extend through the flexible display substrate to the sacrificial layer. An array of LEDs and a plurality of microchips are transferred onto the flexible display substrate to form a flexible display panel. The sacrificial layer is selectively removed such that the flexible display panel attaches to the carrier substrate by a plurality of support posts. The flexible display panel is removed from the carrier substrate and is electrically coupled with display components to form a flexible display system. | 11-19-2015 |
20150321338 | MASS TRANSFER TOOL MANIPULATOR ASSEMBLY WITH REMOTE CENTER OF COMPLIANCE - Systems and methods for transferring a micro device or an array of micro devices to or from a substrate are disclosed. In an embodiment, a remote center robot allows on-the-fly alignment between a micro pick up array and a target substrate. The remote center robot may include a plurality of symmetric linkages that move independently and share a remote rotational center. In an embodiment, the remote rotational center may be positioned at a surface of the micro pick up array to prevent damage to the array of micro devices during transfer. | 11-12-2015 |
20150263066 | LED DEVICE WITH EMBEDDED NANOWIRE LEDS - A nanowire device and a method of forming a nanowire device that is poised for pick up and transfer to a receiving substrate are described. In an embodiment, the nanowire device includes a base layer and a plurality of nanowires on and protruding away from a first surface of the base layer. An encapsulation material laterally surrounds the plurality of nanowires in the nanowire device, such that the nanowires are embedded within the encapsulation material. | 09-17-2015 |
20150235121 | RFID TAG AND MICRO CHIP INTEGRATION DESIGN - An integrated micro chip, method of integrating a micro chip, and micro chip integration system are described. In an embodiment, a micro chip such as a micro RFID chip or integrated passive device (IPD) is electrostatically transferred and bonded to a conductive pattern including a line break. In an embodiment, the line break is formed by a suitable cutting technique such as laser laser ablation, ion beam etching, or photolithography with chemical etching to accommodate the micro chip. | 08-20-2015 |
20150187991 | LED WITH INTERNALLY CONFINED CURRENT INJECTION AREA - Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation. | 07-02-2015 |
20150187740 | ETCH REMOVAL OF CURRENT DISTRIBUTION LAYER FOR LED CURRENT CONFINEMENT - A method and structure for forming an array of LED devices is disclosed. The LED devices in accordance with embodiments of the invention may include a confined current injection area in which a current spreading layer protrudes away from a cladding layer in a pillar configuration so that the cladding layer is wider than the current spreading layer pillar. | 07-02-2015 |
20150179877 | NANOWIRE DEVICE - A nanowire device and a method of forming a nanowire device that is poised for pick up and transfer to a receiving substrate are described. In an embodiment, the nanowire device includes a base layer and a nanowire on and protruding away from a first surface of the base layer. The nanowire may include a core, a shell, and an active layer between the core and the shell. A top electrode layer may be on a second surface of the base layer opposite the first surface and in electrical contact with the core, and a bottom electrode layer may be on and electrical contact with the shell. In an embodiment, the base layer is characterized by a maximum width of the micro scale, and the nanowire is characterized by a maximum width or length of the nano scale. | 06-25-2015 |
20150179876 | LED WITH CURRENT INJECTION CONFINEMENT TRENCH - A method and structure for forming an array of LED devices is disclosed. The LED devices in accordance with embodiments of the invention may include a confined current injection area, embedded mirror, or sidewall passivation layer, and any combination thereof. | 06-25-2015 |
20150076528 | ADHESIVE WAFER BONDING WITH SACRIFICIAL SPACERS FOR CONTROLLED THICKNESS VARIATION - A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. Patterned sacrificial spacers are formed between the stabilization posts and between the micro devices. The patterned sacrificial spacers are disposed upon the patterned sacrificial spacers. | 03-19-2015 |
20150028362 | ADHESIVE WAFER BONDING WITH CONTROLLED THICKNESS VARIATION - A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. The stabilization layer is bonded to a spacer side of a carrier substrate. The spacer side of the carrier substrate includes raised spacers extending from a spacer-side surface of the carrier substrate. | 01-29-2015 |
20150021466 | MICRO PICK UP ARRAY ALIGNMENT ENCODER - Micro pick up arrays and methods for transferring micro devices from a carrier substrate are disclosed. In an embodiment, a micro pick up array alignment encoder detects relative position between a micro pick up array having an encoder scale and a target substrate having a corresponding reference scale. In an embodiment, the micro pick up array alignment encoder facilitates alignment of the micro pick up array with the target substrate. | 01-22-2015 |
20140340900 | STABILIZATION STRUCTURE INCLUDING SHEAR RELEASE POSTS - A stabilization structure includes a stabilization layer on a carrier substrate. The stabilization layer includes an array of staging cavities. An array of micro devices are within the array of staging cavities. Each micro device is laterally attached to a shear release post laterally extending from a sidewall of a staging cavity. A pressure is applied to the array of micro devices from the array of transfer heads to shear the array of micro devices off the shear release posts. The sheared off micro devices are picked up from the carrier substrate using the array of transfer heads. | 11-20-2014 |
20140267683 | METHOD OF FABRICATING A LIGHT EMITTING DIODE DISPLAY WITH INTEGRATED DEFECT DETECTION TEST - A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities. | 09-18-2014 |
20140241844 | Micro Pick Up Array Mount With Integrated Displacement Sensor - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices. | 08-28-2014 |
20140241843 | Mass Transfer Tool Manipulator Assembly - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices. | 08-28-2014 |
20140209248 | COMPLIANT BIPOLAR MICRO DEVICE TRANSFER HEAD WITH SILICON ELECTRODES - A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes. | 07-31-2014 |
20140196851 | COMPLIANT MICRO DEVICE TRANSFER HEAD - A compliant monopolar micro device transfer head array and method of forming a compliant monopolar micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array including a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect, and each silicon electrode is deflectable into a cavity between the base substrate and the silicon electrode. A dielectric layer covers a top surface of each mesa structure. | 07-17-2014 |
20140169927 | MICRO PICK UP ARRAY WITH INTEGRATED PIVOT MOUNT - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array structure allows the micro pick up array to automatically align with the carrier substrate. Deflection of the micro pick up array may be detected to control further movement of the micro pick up array. | 06-19-2014 |
20140169924 | MICRO DEVICE TRANSFER SYSTEM WITH PIVOT MOUNT - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array. | 06-19-2014 |
20140168037 | SMART PIXEL LIGHTING AND DISPLAY MICROCONTROLLER - A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices. | 06-19-2014 |
20140159324 | COMPLIANT MICRO DEVICE TRANSFER HEAD ARRAY WITH METAL ELECTRODES - Compliant monopolar and bipolar micro device transfer head arrays and methods of formation from SOI substrates are described. In an embodiment, an array of compliant transfer heads are formed over a base substrate and deflectable toward the base substrate, and a patterned metal layer includes a metal interconnect layer electrically connected with an array of the metal electrodes in the array of compliant transfer heads. | 06-12-2014 |
20140159067 | ACTIVE MATRIX EMISSIVE MICRO LED DISPLAY - A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area. | 06-12-2014 |
20140159066 | STABILIZATION STRUCTURE INCLUDING SACRIFICIAL RELEASE LAYER AND STAGING BOLLARDS - A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is within an array of staging cavities on a carrier substrate. Each micro device is laterally retained between a plurality of staging bollards of a corresponding staging cavity. | 06-12-2014 |
20140159065 | STABILIZATION STRUCTURE INCLUDING SACRIFICIAL RELEASE LAYER AND STAGING CAVITY - A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is held within an array of staging cavities on a carrier substrate. Each micro device is laterally surrounded by sidewalls of a corresponding staging cavity. | 06-12-2014 |
20140159064 | LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE - Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer. | 06-12-2014 |
20140159043 | ACTIVE MATRIX DISPLAY PANEL WITH GROUND TIE LINES - A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area. | 06-12-2014 |
20140158415 | MICRO DEVICE TRANSFER HEAD ARRAY WITH METAL ELECTRODES - A monopolar and bipolar micro device transfer head array and method of forming a monopolar and bipolar micro device transfer array are described. In an embodiment, a micro device transfer head array includes a base substrate, a first insulating layer formed over the base substrate, and an array of mesa structures. A second insulating layer may be formed over the mesa structure, a patterned metal layer over the second insulating layer, and a dielectric layer covering the metal layer. | 06-12-2014 |
20140084482 | MICRO DEVICE STABILIZATION POST - A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface. | 03-27-2014 |
20140061687 | LED ARRAY - A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate. | 03-06-2014 |
20140048909 | COMPLIANT BIPOLAR MICRO DEVICE TRANSFER HEAD - A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes. | 02-20-2014 |
20140008813 | COMPLIANT MONOPOLOAR MICRO DEVICE TRANSFER HEAD WITH SILICON ELECTRODE - A compliant monopolar micro device transfer head array and method of forming a compliant monopolar micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array including a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect, and each silicon electrode is deflectable into a cavity between the base substrate and the silicon electrode. A dielectric layer covers a top surface of each mesa structure. | 01-09-2014 |
20130210194 | METHOD OF TRANSFERRING AND BONDING AN ARRAY OF MICRO DEVICES - Electrostatic transfer head array assemblies and methods of transferring and bonding an array of micro devices to a receiving substrate are described. In an embodiment, a method includes picking up an array of micro devices from a carrier substrate with an electrostatic transfer head assembly supporting an array of electrostatic transfer heads, contacting a receiving substrate with the array of micro devices, transferring energy from the electrostatic transfer head assembly to bond the array of micro devices to the receiving substrate, and releasing the array of micro devices onto the receiving substrate. | 08-15-2013 |
20130128585 | MICRO DEVICE ARRAY - A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate. | 05-23-2013 |
20130126827 | LIGHT EMITTING DIODE STRUCTURE - A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate. | 05-23-2013 |
20130126098 | MICRO DEVICE TRANSFER HEAD HEATER ASSEMBLY AND METHOD OF TRANSFERRING A MICRO DEVICE - A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate. | 05-23-2013 |