LSI LOGIC CORPORATION Patent applications |
Patent application number | Title | Published |
20100042966 | MULTIPLEXER IMPLEMENTATION - Disclosed is a method of improving a synthesized circuit design comprising searching the synthesized circuit design for a first instance of a first pattern of gates. The first instance is removed from the synthesized circuit design. The first instance is replaced with a non-synthesized cell. A method of altering a multiplexer implementation comprises receiving a netlist that describes a synthesized logic circuit design. Parsing the netlist to detect a first instance of a first pattern of gates that implements a first multiplexer. The first instance is replaced in the netlist with a technology implementation of the first multiplexer. | 02-18-2010 |
20100037448 | ADJUSTABLE EMI BAFFLING APPARATUS FOR DATA STORAGE SYSTEMS - The present invention is directed to an apparatus for reducing and constraining EMI (electronic magnetic radiation) emissions without affecting the internals of data storage system components. A baffle is attached to the exterior of the housing of a data storage system component by baffle mounts. The baffle is operable between a closed position, where the baffle blocks EMI emitted by connectors on the data storage system component, and an open position, where the connectors are not blocked allowing for servicing and cable management. The baffle may comprise an EMI absorbing material and be tuned to meet specific EMI requirements. The baffle mounts offsets the baffle from the data storage system component and the baffle includes a number of holes to allow airflow. The adjustable EMI baffling apparatus does not interfere with other mounted components while the data storage system component is mounted in a cabinet. | 02-18-2010 |
20090323870 | Identification Circuit with Repeatable Output Code - A comparator receives a first read of voltage differentials from a series of bit cells, compares the first read to a positive voltage offset of a given magnitude, and set bits in a first bit stream to values that are dependent upon whether the voltage differential from a given bit cell is greater than the positive voltage offset. The first bit stream is then stored in a first register. The comparator also receives a second read of the voltage differentials from the series of bit cells, compares the second read to a negative voltage offset of the given magnitude, and sets bits in a second bit stream to values that are dependent upon whether the voltage differential from a given bit cell is greater than the positive voltage offset. The second bit stream is stored in a second register. The comparator then compares the first bit stream to the second bit stream, and set bits in a mask string dependent upon whether the bits in a given position of the first bit stream and the second bit stream are identical. A third register receives the mask string. The comparator additionally receives a subsequent read of the voltage differentials from the series of bit cells, compares the subsequent read to a zero voltage offset, and set bits in a subsequent bit stream to values that are dependent upon whether the voltage differential from a given bit cell is greater than the zero voltage offset. The subsequent bit stream is compared to the mask string, and bits of the subsequent bit stream that are disposed in positions set in the mask string are corrected. | 12-31-2009 |
20090283904 | FLIPCHIP BUMP PATTERNS FOR EFFICIENT I-MESH POWER DISTRIBUTION SCHEMES - Disclosed is a flipchip scheme where power and ground bumps are arranged in a striped configuration. Specifically, there are a plurality of lines of power bumps, and a plurality of lines of ground bumps. Each line of power bumps is interconnected by a mesh core power bus, and each line of ground bumps is interconnected by a mesh core ground bus. The busses are shorted across the bumps without having to use metal tab extensions. This arrangement provides that: signal routing can be provided between the lines of bumps; and/or the mesh core power busses can be provided as being wider in order to provide improved power mesh performance and/or in order to reduce or eliminate the metal required on the second top-most metal layer. | 11-19-2009 |
20090256217 | CARBON NANOTUBE MEMORY CELLS HAVING FLAT BOTTOM ELECTRODE CONTACT SURFACE - The present invention is directed to structures and methods of fabricating nanotube electromechanical memory cells having a bottom electrode with a substantially planar contact surface. The bottom electrode is configured so that during the operation of the memory cell the nanotube crossbar of the cell can make contact with a substantially planar surface of the bottom electrode. | 10-15-2009 |
20090104735 | SEMICONDUCTOR PACKAGE HAVING INCREASED RESISTANCE TO ELECTROSTATIC DISCHARGE - Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The package includes a ESD shield attached to the substrate. The ESD shield configured to increase the ESD hardness of the package. The ESD shield can further serve to stiffen the package to prevent warping and operate as a heat spreader. | 04-23-2009 |
20090030660 | METHOD AND APPARATUS FOR GENERATING FULLY DETAILED THREE-DIMENSIONAL ELECTRONIC PACKAGE AND PCB BOARD MODELS - A process is provided, which includes receiving geometrical information for a plurality of layers of an electronic structure within at least one output data file from an electronic structure design tool. At least one numerical analysis data file is created from the output data file, which contains the geometrical information and has a file structure compatible with a numerical analysis tool for characterizing the electronic structure. The numerical analysis tool is used to read the numerical analysis data file and generate a three-dimensional meshed geometric model of the electronic structure from the numerical analysis data file, wherein the model includes three-dimensional geometric models of each layer. The model can then be used, for example, to solve numerical thermal, mechanical or electrical equations that are applied to the model. | 01-29-2009 |
20080320066 | Cryptographic random number generator using finite field operations - An apparatus and method are provided in various illustrative embodiments for an integrated circuit chip that provides a fast, compact, and cryptographically strong random number generator. In one illustrative embodiment, an apparatus includes an initial random source, and a post-processing block in communicative connection with the initial random source. The post-processing block is configured to receive signals from the initial random source, to apply one or more finite field operations to the signals to generate an output, and to provide an output signal based on the output via an output channel, in this illustrative embodiment. | 12-25-2008 |
20080294799 | HIGH THROUGHPUT PIPELINED DATA PATH - Methods and apparatus to provide a high throughput pipelined data path are described. In one embodiment, an apparatus may include three stages to process inbound data packets, e.g., to align one or more bits of data. Other embodiments are also described. | 11-27-2008 |
20080272863 | PACKAGE CONFIGURATION AND MANUFACTURING METHOD ENABLING THE ADDITION OF DECOUPLING CAPACITORS TO STANDARD PACKAGE DESIGNS - The present invention is directed to a method of fabricating an integrated circuit package having decoupling capacitors using a package design conceived for use without decoupling capacitors. The package is implemented with a minimal redesign of the original design and not requiring any redesign of the signal trace pattern. The invention involves replacing top and bottom bond pads with via straps and then covering the top and bottom reference planes with a dielectric layer having conductive vias that electrically connect with the underlying via straps. Planes having the opposite polarity of the underlying reference plane are then formed on the dielectric layer. These planes include an array of bonding pads in registry with the vias. Decoupling capacitors are mounted to the top of the package and electrically connected with the plane on top of the package and the immediately underlying reference plane without the electrical connections to the capacitors passing through the signal planes of the package. | 11-06-2008 |
20080270505 | EFFICIENT HARDWARE IMPLEMENTATION OF TWEAKABLE BLOCK CIPHER - A combination of an infrequently-called tiny multiplication unit and a “differential” unit that quickly computes T | 10-30-2008 |
20080258700 | METHOD AND APPARATUS FOR ADJUSTING ON-CHIP DELAY WITH POWER SUPPLY CONTROL - An apparatus and method are provided for powering an integrated circuit chip with a supply voltage generated externally to the chip. An on-chip clock signal is generated with a ring oscillator fabricated on the integrated circuit chip. The supply voltage is altered as a function of a difference between a frequency of the on-chip clock signal and a reference clock frequency. | 10-23-2008 |
20080250283 | POWER SAVING FLIP-FLOP - A scannable flip-flop and method are provided. The flip-flop includes a clock input, a normal data input, a test data input, a normal data output and a scan data output. The flip-flop has a normal operating mode during which the normal data output is enabled and the scan data output disabled and has a scan-shift mode during which the normal data output is disabled and the scan data output is enabled. | 10-09-2008 |
20080250176 | ENHANCING PERFORMANCE OF SATA DISK DRIVES IN SAS DOMAINS - Methods and apparatus to enhance performance of Serial Advanced Technology Attachment (SATA) disk drives in Serial-Attached Small Computer System Interface (SAS) domains are described. In one embodiment, a data packets and/or commands communicated in accordance with SAS protocol may be converted into SATA protocol. Other embodiments are also described. | 10-09-2008 |
20080244491 | Generic methodology to support chip level integration of IP core instance constraints in integrated circuits - A method and apparatus are provided for generating and using timing constraints templates for IP cores that can be instantiated in an integrated circuit design. The templates include a plurality of timing constraint statements for inputs and outputs of the respective IP core. At least one of the statements includes a configurable variable, wherein the timing constraints template is configurable through the variable for each of a plurality of instances of the IP core in the integrated circuit design. | 10-02-2008 |
20080229045 | STORAGE SYSTEM PROVISIONING ARCHITECTURE - In some embodiments, a storage controller comprises a first input/output port that provides an interface to a host computer, a second input/output port that provides an interface a storage device, a processor that receives input/output requests generated by the host computer and, in response to the input/output requests, generates and transmits input/output requests to the storage device, and a memory module communicatively connected to the processor. The memory module comprises logic instructions stored in a computer-readable medium which, when executed by the processor, configure the processor to receive, from the host computer, a write input/output request that identifies a logical volume; compare an amount of storage space available in the logical volume with an amount of storage space required to complete the write operation, and allocate additional storage space to the logical volume if the amount of storage space available in the logical volume is insufficient to complete the write operation. Other embodiments may be described. | 09-18-2008 |