LITE-ON SINGAPORE PTE LTD.
|LITE-ON SINGAPORE PTE LTD. Patent applications|
|Patent application number||Title||Published|
|20130105822||INTEGRATED SENSING PACKAGE STRUCTURE||05-02-2013|
|20130088436||LIGHT EMITTING UNIT, MANUFACTURING METHOD THEREOF AND TOUCH PANEL HAVING THE SAME - A manufacturing method of light emitting units is shown below. First step is providing a substrate with multi circuit areas. A light emitting diode is mounted on the circuit area respectively. Next step is forming a package structure to cover the light emitting diode. Next step is dicing the package structure to form a biconic package structure. The package structure is diced twice in two directions, respectively. As above-mentioned, the light emitting unit has asymmetric light radiation pattern.||04-11-2013|
|20130077818||DETECTION METHOD OF OPTICAL NAVIGATION DEVICE - A detection method of an optical navigation device is disclosed. The device is used for determining whether an object is lifted from the optical navigation device or not. The method includes steps of reading the detection image detected by the optical navigation device, calculating the image signal value thereof during non-lift status, and integrating a historical threshold value with the image signal value according to adaptive factors for generating an adjustment threshold value serving as the navigation threshold of the detection image. The historical threshold value is the navigation threshold of a former detection image of the detection image. A step of comparing the adjustment threshold with the image signal value for determining whether the image signal value passes the navigation threshold or not may also be included. If the image signal value does not pass the navigation threshold, the object is determined as in the lift status.||03-28-2013|
|20130076880||IMAGE PROCESSING METHOD AND IMAGE CAPTURING SYSTEM - An image processing method includes the following steps. The first step is utilizing a linear image capturing apparatus with odd number of image capturing units to capture image portions of object. Next step is taking the image portions which are captured by the first-end and the right-end image capturing units as the reference and comparing the image portions which are captured by the central image capturing units with the reference so as to correct and eliminate the overlapped noise. Next step is interlacing and re-constructing the processed image portions which have no overlapped portions as the integrated image.||03-28-2013|
|20130076693||TAPPING DETECTION METHOD OF OPTICAL NAVIGATION MODULE - A tapping detection method of an optical navigation module is disclosed. The module includes an optical sensor and a processor. The method includes steps of calculating a displacement quantity of an object contacting with the optical navigation module according to a sense image sensed by the optical sensor, and comparing the displacement quantity with a displacement threshold value. When the displacement quantity is smaller than the displacement threshold value, the method further includes steps of calculating a brightness difference value of the sense image, and comparing the brightness difference value with a brightness threshold value. When the brightness difference value is smaller than the brightness threshold value, the optical navigation module may be determined to be tapped by the object.||03-28-2013|
|20130019459||METHOD FOR MANUFACTURING SENSOR UNIT - A method for manufacturing a sensor unit includes the steps of: Step 1 is providing a substrate having sensor unit areas. Each sensor unit area is partitioned into two individual circuit areas. A signal emitting device and a signal detecting device are respectively disposed on the two circuit areas. Step 2 is forming a packaging structure to cover the two circuit areas, the signal emitting device, the signal detecting device, and a cutting area between the two circuit areas using a mold. Step 3 is cutting the packaging structure along the cutting area to form a separation cut groove. Step 4 is assembling a separation member onto each sensor unit area. The separation member is disposed on the separation cut groove so that the signal emitting device and the signal detecting device on the same sensor unit area are isolated from each other.||01-24-2013|
|20130009191||SURFACE MOUNTED LED PACKAGE AND MANUFACTURING METHOD THEREFOR - A surface mounted LED package includes an insulated body, a first conductive part, a second conductive part, a LED chip and a bonding wire. The insulated body has a receiving portion and a bond-pad island. The receiving portion is formed with an inner side wall and a flat bottom. The bond-pad island is formed with a bonding plane. The first conductive part has a LED chip and a first solder pin extended to an outer surface of the insulated body. The second conductive part has a second contacting portion and a second solder pin extended to an outer surface of the insulated body. The LED chip is disposed on the second contacting portion. The bonding wire connects the LED chip to the first contacting portion. The present application further provides a manufacturing method for surface mounted LED package.||01-10-2013|
|20130004030||INTEGRATED OPTICAL MODULE - The instant disclosure relates to an integrated optic module for adapting in a finger sensing apparatus. The integrated optic module comprises an illumination portion including a light guiding array arranged to direct incident light from the electronic module toward the window module at a predetermined angle of incidence and an imaging portion having an imaging lens array arranged thereon to direct reflected light from the window module toward the electronic module for photo imaging. The micro-lens array includes an elongated recognition unit having a row axis substantially normal toward the light guiding array and a navigation unit adjoining the recognition unit and offsetting the row axis thereof. The optic module mediates a window module and an electronic module to provide both finger navigation and fingerprint recognition capabilities.||01-03-2013|
|20120223231||PROXIMITY SENSOR HAVING ELECTRO-LESS PLATED SHIELDING STRUCTURE - The instant disclosure relates to a proximity sensor having an electro-less plated optical shielding structure. The sensor includes a substrate panel having an emitter region and a receiver region; an emitter unit disposed on the emitter region and configured to emit electromagnetic signals at a particular wavelength; a receiver unit disposed on the receiver region and configured to respond to electromagnetic signals emitted by the emitter unit; a transparent molding unit disposed on the emitter region and the receiver region of the substrate panel; and an optical shielding layer selectively disposed on the external surfaces of the substrate panel and the transparent molding unit. The shielding layer has corresponding sensor ports for the emitter and the receiver units arranged toward a designated detection region. The electro-less plated optical shielding layer is highly configurable through proper masking and small in thickness, enabling further miniaturization of the sensor unit.||09-06-2012|
|20110064418||TRANSCEIVER AND BI-DIRECTIONAL SIGNAL TRANSMISSION SYSTEM THEREOF - A transceiver includes a lead-frame, a signal emitter, a signal receiver, and a coupling lens. The signal emitter and the signal receiver are attached on a same pad of the lead-frame. The coupling lens covers the signal emitter and the signal receiver. Since the positions of the signal emitter and the signal receiver are adjacent to each other, the coupling lens can be used to couple the signal emitter and the signal receiver for transmitting and receiving signals.||03-17-2011|
|20110061340||SENSOR UNIT AND METHOD FOR PACKAGING THE SAME - A method for packaging the sensor units is shown below. First step is providing a substrate, and each sensor area on the substrate is partitioned into two individual circuit areas. An emitter and a detector are installed on the two circuit areas respectively. Step two is forming a first packaging structure to cover the two circuit areas, the emitter and the detector by a mold. Next step is cutting the first packaging structure to form cut groove between and around the emitter and the detector. Next step is forming a second packaging structure in the cut grooves by the same mold. At last, the panel of sensor units is diced and separated as individual sensor units. As above-mentioned, the second packaging structure is used for isolating the signals of the emitter and the detector.||03-17-2011|
Patent applications by LITE-ON SINGAPORE PTE LTD.