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LINTEC CORPORATION

LINTEC CORPORATION Patent applications
Patent application numberTitlePublished
20120132831ENERGY APPLICATION DEVICE AND ENERGY APPLICATION METHOD - An energy application device applies optical energy on an adhesion sheet by a light radiator and, subsequently, applies heat energy on the adhesion sheet by a heater. With this arrangement, even the adhesion sheet, which includes an adhesive layer having an energy barrier that cannot be overcome only with optical energy, is enabled to start a photoreaction by overcoming an energy barrier with the heat energy from the heater.05-31-2012
20120130336ADHESIVE SHEET - The present invention provides an adhesive sheet for attaching to a plasticized vinyl chloride resin article such as a blood bag made of a plasticized vinyl chloride resin, and having a center-line surface roughness Ra of 1.0 μm or higher, which includes a film substrate and a heat-sensitive adhesive layer formed on a backside surface of the film substrate, wherein the heat-sensitive adhesive layer is composed of a resin containing a crystalline polyester resin as a main component. The adhesive sheet of the present invention is excellent in adhesive property when the adhesive sheet is attached to the article made of a plasticized vinyl chloride resin. The adhesive strength of the adhesive sheet of the present invention is not decreased even after an autoclave treatment or storage at a low temperature.05-24-2012
20120121917LAMINATE, METHOD FOR PRODUCING SAME, ELECTRONIC DEVICE MEMBER, AND ELECTRONIC DEVICE - Disclosed is a laminate comprising a gas barrier layer and a conductor layer, the gas barrier layer being formed of a material that includes at least an oxygen atom, a carbon atom, and a silicon atom, the gas barrier layer having an oxygen atom content that gradually decreases from a surface of the gas barrier layer in a depth direction, and having a carbon atom content that gradually increases from the surface of the gas barrier layer in the depth direction. Also disclosed are a method of producing the laminate, an electronic device member that includes the laminate, and an electronic device that includes the electronic device member. The above laminate exhibits an excellent gas harrier capability and excellent interlayer adhesion, and the conductor layer of the above laminate has high surface smoothness. Since the above laminate enables an increase in flexibility and a reduction in weight, the laminate may suitably be used as an electronic device member for a display (e.g., organic EL display), a solar battery, or the like. Since the laminate enables roll-to-roll mass production, cost can be reduced.05-17-2012
20120111392BACK PROTECTIVE SHEET FOR SOLAR CELL MODULE, SOLAR CELL MODULE PROVIDED WITH SAME, AND PRODUCTION METHOD OF SOLAR CELL MODULE - A back protective sheet for a solar cell module in which a thermoplastic resin sheet containing heat-expandable particles is formed on at least one side of a base sheet, a solar cell module having this back protective sheet for a solar cell module, and a production method of this solar cell module.05-10-2012
20120108761FORMED ARTICLE, METHOD OF PRODUCING SAME, ELECTRONIC DEVICE MEMBER, AND ELECTRONIC DEVICE - A formed article comprising a layer obtained by implanting ions into a polycarbosilane compound-containing layer, a method of producing the formed article, an electronic device member, and an electronic device comprising the electronic device member. The formed article has an excellent gas barrier capability, excellent transparency, excellent bendability, excellent adhesion, and excellent surface flatness.05-03-2012
20120101221FORMED ARTICLE, METHOD OF PRODUCING SAME, ELECTRONIC DEVICE MEMBER, AND ELECTRONIC DEVICE - A formed article comprising a gas barrier layer that is formed of a material including at least an oxygen atom, a carbon atom, and a silicon atom, the gas barrier layer including an area (A) where an oxygen atom content rate gradually decreases, and a carbon atom content rate gradually increases in a depth direction from a surface, the area (A) including a partial area (A04-26-2012
20120094131PROTECTIVE SHEET FOR SOLAR CELL MODULE - Provided is a protective sheet for a solar cell module having a resin sheet, a vapor deposited layer containing an inorganic oxide provided on at least one side thereof, and a fluorine resin layer containing a silane coupling agent laminated on the vapor deposited layer.04-19-2012
20120088880Formed Article, Method for Producing Same, Electronic Device Member, and Electronic Device - Disclosed is a formed article comprising a layer obtained by implanting ions of a hydrocarbon compound into a polyorganosiloxane compound-containing layer. Also disclosed are: a method of producing the formed article, the method comprising implanting ions of a hydrocarbon compound into a surface of a polyorganosiloxane compound-containing layer of a formed body that includes the polyorganosiloxane compound-containing layer in its surface; an electronic device member that includes the formed article; and an electronic device that includes the electronic device member. The present invention provides; a formed article which exhibits an excellent gas barrier capability, transparency, bendability, antistatic performance, and surface flatness; a method of producing the formed article, an electronic device member, and an electronic device.04-12-2012
20120081775DISPLAY DEVICE - There is disclosed an electrochromic passive-matrix display, wherein each passively addressed pixel cell comprises an electrolyte ionically connecting an electrochromic and electrochemically active polymer and a layer of electrically conducting carbon. Thus, each pixel has a pronounced threshold voltage sufficient for reducing cross talk in an electrochromic display.04-05-2012
20120064321FORMED ARTICLE, METHOD FOR PRODUCING THE FORMED ARTICLE, MEMBER FOR ELECTRONIC DEVICE, AND ELECTRONIC DEVICE - A formed article includes a gas barrier layer that is formed of a material including at least an oxygen atom and a silicon atom, a surface area of the gas barrier layer having an oxygen atom content rate of 60 to 75%, a nitrogen atom content rate of 0 to 10%, and a silicon atom content rate of 25 to 35%, based on the total content of oxygen atoms, nitrogen atoms, and silicon atoms, and having a film density of 2.4 to 4.0 g/cm03-15-2012
20120041116FORMED ARTICLE, METHOD FOR PRODUCING SAME, ELECTRONIC DEVICE MEMBER, AND ELECTRONIC DEVICE - Disclosed is a formed article comprising an ion-implanted layer obtained by implanting ions of a silicon compound into a polymer layer. Also disclosed are: a method of producing the formed article, the method comprising implanting ions of a silicon compound into a surface of a polymer layer of a formed body that includes the polymer layer in its surface; an electronic device member comprising the formed article; an electronic device comprising the electronic device member. Consequently, the present invention provides: a formed article which has excellent gas barrier capability, bendability and surface flatness; a method of producing the formed article, an electronic device member comprising the formed article; an electronic device comprising the electronic device member.02-16-2012
20120034460PROTECTIVE SHEET FOR BACK SURFACE OF SOLAR CELL MODULE, AND SOLAR CELL MODULE PROVIDED THEREWITH - A protective sheet for the back surface of a solar cell module prepared by laminating a thermal adhesive sheet to at least one surface of a base sheet with a urethane-based adhesive layer disposed therebetween, wherein the thermal adhesive sheet contains a pigment and the urethane-based adhesive layer contains a silane coupling agent. The pigment is preferably an inorganic pigment or a carbon black.02-09-2012
20120034423METHOD OF FORMING METAL OXIDE FILM AND METAL OXIDE FILM - The present invention provides; a method for forming a metal oxide film which has both a surface irregularity and a predetermined pattern or either and has few unevenness of surface specific resistance, light transmittance and the like, and such the metal oxide film.02-09-2012
20120034276SOLID PREPARATION - A solid preparation 02-09-2012
20120031485GAS BARRIER FILM AND ELECTRONIC DEVICE - Disclosed is a gas barrier film, which demonstrates superior gas barrier properties and surface smoothness, demonstrates a high degree of adhesion between layers and is resistant to cracking when bent, and an electronic device provided therewith. A gas barrier film of the present invention has a base, and a polyorganosiloxane layer and an inorganic material layer sequentially provided on at least one side of the base, and the inorganic material layer is deposited by dynamic ion mixing method.02-09-2012
20120031474BACK PROTECTIVE SHEET FOR SOLAR CELL MODULE, PRODUCTION METHOD OF SAME AND SOLAR CELL MODULE - A back protective sheet for a solar cell module in which a fluorine resin layer containing a pigment is formed on at least one side of a base sheet, wherein the density of the pigment in the direction of thickness of the fluorine resin layer is higher on the side opposite from the base sheet than on the side facing the base sheet.02-09-2012
20120024377PROTECTIVE SHEET FOR SOLAR CELL MODULE AND PRODUCTION METHOD THEREOF, AND SOLAR CELL MODULE - There is provided a protective sheet for solar cell module including a substrate film and a heat bondable layer laminated on one side of the substrate film, wherein the heat bondable layer is formed from a thermoplastic resin, exhibits a dimensional variation of not more than 0.3% before and after a heat treatment at 150° C. for 30 minutes and serves as an adhesive layer to be used for bonding with an encapsulant that constitutes the solar cell module.02-02-2012
20120021059SOLID PREPARATION - A solid preparation 01-26-2012
20120012183ORGANIC THIN-FILM SOLAR CELL AND METHOD OF PRODUCING SAME - Providing an organic thin-film solar cell that can be easily manufactured and then mass produced at low cost while increasing the photoelectric conversion efficiency, and the method of producing the same.01-19-2012
20120012165PROTECTIVE SHEET FOR SOLAR BATTERY MODULE, SOLAR BATTERY MODULE, AND METHOD FOR PRODUCING SOLAR BATTERY MODULE - Disclosed are a protective sheet for a solar battery module including a base material sheet and a heat-fusible sheet made of a heat-fusible resin having a melting point measured by differential scanning calorimetry (a DSC method) of 80° C. or higher and lower than 130° C., laminated on one surface of the base material sheet, and including an air-flow path on a surface of the heat-fusible sheet; and a solar battery module using the same.01-19-2012
20120006710PACKAGE MATERIAL FOR ADHESIVE BANDAGE AND PACKAGED ADHESIVE BANDAGE - Disclosed herein is a package material for adhesive bandage which is used for packaging therein an adhesive bandage including a surface base having one surface, an adhesive layer provided on the one surface of the surface base and a releasing sheet attached to the adhesive layer so as to cover it. The package material comprises a first sheet having a first sheet base and a first cold seal layer provided on the first sheet base, and a second sheet having a second sheet base and a second cold seal layer provided on the second sheet base. The first cold seal layer faces the surface base of the adhesive bandage and the second cold seal layer faces the releasing sheet of the adhesive bandage when the adhesive bandage is packaged in the package material. Further, each of the first cold seal layer and the second cold seal layer is formed of a mixture of rubber and acrylic resin, and an amount of the rubber contained in the first cold seal layer is smaller than an amount of the rubber contained in the second cold seal layer.01-12-2012
20120006407PROTECTIVE SHEET FOR SOLAR CELL MODULE AND SOLAR CELL MODULE INCLUDING THE SAME - The protective sheet for solar cell module of the present invention includes a substrate film and a heat bondable layer laminated on one side of the substrate film, wherein the heat bondable layer is formed from a resin material containing an olefin-based polymer that includes a (meth)acrylate unit having a glycidyl group, and serves as an adhesive layer to be used for bonding with a encapsulant that constitutes the solar cell module.01-12-2012
20120006401PROTECTIVE SHEET FOR SOLAR CELL MODULE, AND SOLAR CELL MODULE USING SAME - The invention relates to a solar cell module protective sheet which has two or more gas barrier films, each provided with a deposited layer formed of an inorganic oxide on at least one surface of a base film, in which a material constituting the solar cell module protective sheet is formed of a material transmitting light rays of a wavelength contributing to the generation of electric power, and the solar cell module protective sheet is used as a front sheet, a solar cell module using the solar cell module protective sheet, and the like. According to the invention, it is possible to provide a solar cell module protective sheet having high dampproofness and enabling stable long-term use of a solar cell when the solar cell module protective sheet is used as a front sheet or a back sheet of the solar cell module, and a solar cell module using the solar cell module protective sheet.01-12-2012
20120006388BACK PROTECTIVE SHEET FOR SOLAR CELL MODULE AND SOLAR CELL MODULE - A back protective sheet for a solar cell module in which a fluorine resin layer is formed on at least one side of a base sheet, wherein an inorganic pigment (A) having a large mean particle diameter and an inorganic pigment (B) having a small mean particle diameter are contained in the fluorine resin layer, the diameter ratio (DB/DA) of the mean particle diameter (DB) of the inorganic pigment (B) to the mean particle diameter (DA) of the inorganic pigment (A) is within the range of 0.01 to 0.3, and the total amount of the inorganic pigments (A) and (B) is within the range of 50 parts by weight to 130 parts by weight based on 100 parts by weight of the fluorine resin.01-12-2012
20110311780RELEASABLE ADHESIVE SHEET - Provided is a releasable pressure sensitive adhesive sheet, which is mainly used for a coating film for an automobile, and which is applicable to a coating film with insufficient curing immediately after drying. Specifically provided is a releasable pressure sensitive adhesive sheet for a curable coating film, which has a pressure sensitive adhesive layer on one face of a front substrate, in which a face of the pressure sensitive adhesive layer out of contact with the front substrate has a rolling circle arithmetic mean waviness (Wea) specified in JIS B0610 of 0.30 μm or less.12-22-2011
20110284159PROTECTION SHEET FOR COATING FILM - Provided is a protective sheet for a coating layer comprising a substrate sheet and provided thereon a pressure-sensitive adhesive layer, which can be applied as well to a coated surface insufficiently cured immediately after dried, and the pressure-sensitive adhesive layer described above comprises an addition reaction type silicone-based pressure-sensitive adhesive.11-24-2011
20110281509HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE - A backgrinding machine 11-17-2011
20110274933LAMINATE, METHOD FOR PRODUCING SAME, ELECTRONIC DEVICE MEMBER, AND ELECTRONIC DEVICE - A laminate comprises a gas barrier layer and an inorganic compound layer, the gas barrier layer being formed of a material that includes at least an oxygen atom, a carbon atom, and a silicon atom, the gas barrier layer having an oxygen atom content rate that gradually decreases from the surface of the gas barrier layer in the depth direction, and having a carbon atom content rate that gradually increases from the surface of the gas barrier layer in the depth direction. An electronic device member includes the laminate, and an electronic device includes the electronic device member. The laminate exhibits an excellent gas barrier capability and excellent transparency, and does not produce cracks (i.e., the gas barrier capability does not deteriorate) even when the laminate is folded. The laminate exhibits an excellent gas barrier capability and an excellent impact-absorbing capability even if an impact is applied from the outside.11-10-2011
20110274862BONDED STRUCTURE, ROOF STRUCTURE, LAMINATED SHEET FOR USE THEREIN, AND METHOD OF USING LAMINATED SHEET - The present invention relates to a bonded matter prepared by bonding a first member to a second member with a laminated sheet, wherein a contractile film constituting the above laminated sheet contracts when the bonded matter is heated, and a part of the laminated sheet is peeled off or the laminated sheet is peeled off from the member, whereby the bonded matter is prevented from being deformed; a roof structure; a laminated sheet used for the above bonded matter, wherein at least a contractile film and a peelable layer are laminated in this order, and the peelable layer is bonded to one of the above members; and when the bonded matter is heated, the peelable layer is peeled off from the above member; and a use method of a laminated sheet characterized by sticking a peelable layer surface of the laminated sheet on one surface side of one member, adhering a contractile film surface of the laminated sheet to the other member with an adhesive and bonding one member to the other member. Provided are a bonded matter which can release bonding when heated, a roof structure, a laminated sheet used for the same and a use method of the laminated sheet.11-10-2011
20110262746PRESSURE-SENSITIVE ADHESIVE SHEET - A pressure-sensitive adhesive sheet including: a base material; and a pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition that comprises a polyrotaxane (A) having at least two cyclic molecules and a linear-chain molecule passing through opening portions of the cyclic molecules wherein the cyclic molecules have each one or more reactive groups and the linear-chain molecule has blocking groups at both ends thereof, wherein the pressure-sensitive adhesive layer has an elongation at break of not smaller than 300% and a haze value of not greater than 30%, and a holding power of the pressure-sensitive adhesive sheet according to JIS Z0237, but at a measurement temperature of 80° C., is not greater than 1000 μm as the displacement of the pressure-sensitive adhesive sheet after 70,000 seconds.10-27-2011
20110256393PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET - A pressure-sensitive adhesive composition including: a (meth)acrylate copolymer (A) obtained by copolymerizing a (meth)acrylate and a reactive group-containing monomer, such that a ratio of the reactive group-containing monomer (constituent unit derived from the monomer) in the copolymer ranges from 0.01 to 15 wt %; a polyrotaxane (B) having at least two cyclic molecules and a linear-chain molecule passing through opening portions of the cyclic molecules wherein the cyclic molecules have each one or more reactive groups and the linear-chain molecule has blocking groups at both ends thereof; and a crosslinking agent (C) having a reactive group capable of reacting with the reactive group of the (meth)acrylate copolymer (A) and with the reactive group of the polyrotaxane (B).10-20-2011
20110256392PROTECTIVE SHEET FOR BACK SURFACE OF SOLAR CELL MODULE - A protective sheet for the back surface of a solar cell module that is lightweight and has excellent water vapor barrier properties. The protective sheet for the back surface of a solar cell module is prepared by laminating a base sheet having excellent electrical insulation properties to at least one surface of an aluminum-iron alloy sheet. The iron content of the aluminum-iron alloy sheet is preferably not less than 0.7 mass % and not more than 5.0 mass %. Moreover, the protective sheet for the back surface of a solar cell module preferably has a fluororesin layer, and even more preferably has a heat-adhesive layer.10-20-2011
20110251561TRANSDERMAL ADMINISTRATION DEVICE - The transdermal administration device of the present invention includes: a device body including a needle form body, which includes a plurality of microneedles formed on a surface thereof and is provided with a fluid passage hole through the front surface to a back surface thereof, and a medical fluid filling section for providing a medical fluid to the back surface of the needle form body; a stratum corneum peeling system; and a connection section for connecting the device body and the stratum corneum peeling system, 10-13-2011
20110229694EASILY APPLICABLE ADHESIVE SHEET AND METHOD OF PRODUCING THE SAME - An easily applicable adhesive sheet includes a base sheet and an adhesive layer provided on the base sheet and which includes, in a surface portion thereof, air passages each including a plurality of grooves opening at an end edge portion of the adhesive sheet. Each groove has an opening width of 3 to 100 μm; the distance between adjacent grooves is 1 to 100 μm; each air passage has a width of 7 to 900 μm; and the distance between adjacent air passages is 200 to 3,000 μm. The easily applicable adhesive sheet can be smoothly applied to an adherend without formation of blisters (i.e., even when air bubbles are formed between the adhesive sheet and the adherend upon application thereof, air is easily released), and which exhibits excellent appearance after application thereof to the adherend.09-22-2011
20110212328RELEASABLE ADHESIVE SHEET AND METHOD FOR PROTECTING INCOMPLETELY CURED COATING FILM - According to the present invention, there are provided a removable pressure sensitive adhesive sheet applicable even to a coating film incompletely cured immediately after having been dried and a method of protecting an incompletely cured coating film. The removable pressure sensitive adhesive sheet of the present invention is a removable pressure sensitive adhesive sheet characterized in that the sheet is obtained by providing a substrate sheet with a pressure sensitive adhesive layer, and that the pressure sensitive adhesive layer has a storage elastic modulus at 23° C. of 1.0×1009-01-2011
20110206927ADHESIVE SHEET - Provided is an adhesive sheet, which has a high adhesion and removability, corrodes a metal to a low degree, generates small amount of outgases, and is particularly suitable as an adhesive sheet for being adhered to an electronic part. The adhesive sheet includes an adhesive layer provided for at least one surface of a substrate sheet, in which a pressure-sensitive adhesive of which the adhesive layer is formed includes a resin composition mainly formed of an acrylic copolymer obtained by blending a carboxyl group-free acrylic copolymer obtained by copolymerizing the following components (A) to (C) with (D) an isocyanate-based cross-linking agent: (A) 76.999 to 94.999% by mass of an alkyl(meth)acrylate; (B) 5.0 to 23.0% by mass of an ethylenically unsaturated group-containing morpholine-based compound; and (C) 0.001 to 1.5% by mass of a functional group-containing unsaturated monomer; and a ratio M2/M1 of the mole number (M2) of isocyanate groups in the component (D) to the mole number (M1) of functional groups in the component (C) is 1.5 to 15.0.08-25-2011
20110198038SHEET PEELING APPARATUS AND PEELING METHOD - A sheet peeling apparatus 08-18-2011
20110195561ADHESIVE SHEET - An adhesive sheet includes a substrate and an energy-ray curable adhesive layer formed on the substrate. The energy-ray curable adhesive layer includes an energy-ray curable acrylic copolymer and a urethane acrylate. The energy-ray curable acrylic copolymer is formed by copolymerizing at least one of either a dialkyl(meth)acrylamide that has an alkyl group with carbon number of not more than 4, a phenol EO modified (meth)acrylate that has an ethylene glycol chain with a phenyl group bonded to the ethylene glycol chain, a (meth)acryloyl morpholine, or a (meth)acrylate that has an aceto-acetoxyl group, in total of 1 to 30 weight percent of all monomers to form the energy-ray curable acrylic copolymer. The energy-ray curable acrylic copolymer further includes a side chain with an unsaturated group.08-11-2011
20110189450FORMED ARTICLE, METHOD FOR PRODUCING THE SAME, ELECTRONIC DEVICE MEMBER, AND ELECTRONIC DEVICE - A formed article includes a gas barrier layer that is formed of a material that includes at least an oxygen atom, a carbon atom, and a silicon atom, the gas barrier layer having an oxygen atom content that gradually decreases from the surface of the gas barrier layer in the depth direction, and having a carbon atom content that gradually increases from the surface of the gas barrier layer in the depth direction. An electronic device member includes the formed article, and an electronic device includes the electronic device member. The formed article exhibits an excellent gas barrier capability and excellent transparency.08-04-2011
20110182954ORALLY-ADMINISTERED AGENT - An orally-administered agent is provided. The orally-administered agent comprises an intestinal medicine-containing layer containing a medicine to be released in intestines and having surfaces; intestinal collapse-controlling layers provided directly or through an arbitrary layer on the surfaces of the intestinal medicine-containing layer, respectively, at least a part of the intestinal collapse-controlling layers being collapsed in the intestines, and each of the intestinal collapse-controlling layers having a surface opposite to the intestinal medicine-containing layer; and gel-forming layers provided directly or through an arbitrary layer on the sides of the surfaces of the intestinal collapse-controlling layers, respectively, wherein the gel-forming layers are swelled and gelatinized by absorbing water to form a gel. The intestinal collapse-controlling layers are constituted of a material containing an enteric material to be dissolved by being in contact with a body fluid in the intestines. The orally-administered agent according to the present invention can be swallowed with ease and can release a medicine at intended parts of a living body (in particular, within intestines).07-28-2011
20110162790SHEET PEELING APPARATUS AND PEELING METHOD - A sheet peeling apparatus 07-07-2011
20110155328SHEET PEELING APPARATUS AND PEELING METHOD - A sheet peeling apparatus 06-30-2011
20110155314MOUNTING APPARATUS AND MOUNTING METHOD - To provide a mounting apparatus for uniting a semiconductor wafer with a ring frame, the wafer having an adhesive sheet stuck on one surface thereof. In the mounting apparatus, a portion of the adhesive sheet is preliminarily peeled off through a preliminary peeling means, the wafer is disposed inside the ring frame after a preliminarily peeled portion is formed, and a mounting tape is stuck to the ring frame and the wafer through a sticking means. The mounted wafer is fully peeled off by holding the preliminarily peeled portion.06-30-2011
20110143076PRESSURE-SENSITIVE ADHESIVE, SHEET FOR MANUFACTURING AN OPTICAL RECORDING MEDIUM AND OPTICAL RECORDING MEDIUM06-16-2011
20110136322Adhesive Sheet for a Stealth Dicing and a Production Method of a Semiconductor Wafer Device - An adhesive sheet is provided enabling to efficiently produce the very small size semiconductor chip by a stealth dicing method. An adhesive sheet for a stealth dicing includes a substrate and an adhesive layer formed on one side of the substrate, wherein a Young's modulus of the adhesive sheet at 23° C. is 200 to 600 MPa, and a storage elastic modulus of the adhesive layer at 23° C. is 0.10 to 50 MPa.06-09-2011
20110129613RELEASE SHEET AND PRODUCTION PROCESS FOR THE SAME - A process for making a release sheet which is non-silicone based and has good releasability from a pressure sensitive adhesive layer and which makes it possible to form a release agent layer at low temperature, having solvent resistance. The process comprises coating a substrate film with a release agent liquid, drying, and curing, to give a release agent layer, wherein the release agent layer is a cured layer obtained by irradiating a diene base polymer containing an intermolecular cleavage photopolymerization initiator with an active energy beam.06-02-2011
20110124812FIXING MATERIAL COMPRISING SILANE COMPOUND POLYMER AND PHOTONIC DEVICE SEALED BODY - A fixing material includes a silane compound polymer as the main component, the silane compound polymer being produced by condensing a silane compound mixture that includes at least one silane compound (1) shown by the following formula (1): R05-26-2011
20110121085ELECTRONIC CIRCUIT AND IC TAG - The present invention provides an electronic circuit which comprises a circuit line and a terminal portion connected to the circuit line, wherein the terminal portion has a folding endurance structure at a junction where the terminal portion is connected to the circuit line and the folding endurance structure of the terminal portion has a plane width gradually-increasing portion, in which the width of the terminal portion in plane view increases continuously or intermittently as the folding endurance structure of the terminal portion becomes away from the junction where the terminal portion is connected to the circuit line. The electronic circuit and an IC tag incorporating the electronic circuit of the present invention are excellent in folding endurance property, and can have an electronic circuit which is hard to break even if the electronic circuit is folded.05-26-2011
20110104874Energy Ray-Curable Polymer, an Energy Ray-Curable Adhesive Composition, an Adhesive Sheet and a Processing Method of a Semiconductor Wafer - In a pressure-sensitive adhesive composition or a pressure-sensitive adhesive sheet containing an energy ray-curable polymer, problems associated with the volatilization of a low molecular weight compound contained in the composition are overcome. An energy ray-curable polymer characterized by comprising a radical generating group, which is capable of initiating a polymerization reaction upon excitation with an energy ray, and an energy ray-polymerizable group bonded together in the main or side chain.05-05-2011
20110089337LIGHT IRRADIATION APPARATUS AND LIGHT IRRADIATION METHOD - A light irradiation apparatus 04-21-2011
20110088526SHEET CUTTING APPARATUS - A sheet cutting apparatus includes a cutting device and at least one cutter blade to be mounted detachably on the cutting device. The cutter blade has a blade holder and a blade fixed to the blade holder. The apparatus further includes a stocking device for storing the at least one cutter blade. The stocking device includes a case body, a receiving section in the case body, and a heater. The receiving section has a blade holder receiving portion for storing the blade holder and a blade receiving portion for storing the blade. The heater is arranged for heating the blade holder and the blade of the cutter blade in the receiving section. The cutting device is arranged for using the cutter blade heated by the heater.04-21-2011
20110085437SHEET FOR MULTILAYER OPTICAL RECORDING MEDIUM AND MULTILAYER OPTICAL RECORDING MEDIUM USING THE SAME - Disclosed is a sheet for producing a multilayer optical recording medium having a repeating structure wherein a plurality of optical recording layers are laminated. The sheet for a multilayer optical recording medium has a structure having a unit wherein an optical recording layer and an adhesive layer are laminated, or a structure having a unit wherein an optical recording layer, a barrier layer and an adhesive layer are laminated in this order. The maximum height roughness (Rz) of the optical recording layer or the barrier layer is not more than 500 nm. A multilayer optical recording medium is produced by using the sheet for a multilayer optical recording medium. Also disclosed is a sheet for producing, with high precision, a high-quality multilayer optical recording medium having a repeating unit wherein a plurality of optical recording layers containing a multiphoton absorbing material are laminated. A multilayer optical recording medium is also produced by using this sheet.04-14-2011
20110084602LUMINESCENT COMPOSITION, ELECTROLUMINESCENT SHEET USING THE LUMINESCENT COMPOSITION, AND PROCESS FOR PRODUCING THE ELECTROLUMINESCENT SHEET - The present invention provides a luminescent composition capable of providing an electroluminescent sheet with a high productivity at low costs in an efficient manner, an electroluminescent sheet obtained from the luminescent composition which can be mass-produced, and a process for producing the electroluminescent sheet. The present invention relates to an adhesive luminescent composition produced by kneading and dispersing an electroluminescent substance in a resin having a glass transition temperature of from −70 to 5° C.; an electroluminescent sheet including at least a first substrate, a first electrode, an electroluminescent layer, a second electrode and a second substrate which are successively laminated in this order, wherein the first substrate and the first electrode are transparent, and the electroluminescent layer is formed from the luminescent composition; and a process for producing the electroluminescent sheet, including the steps of preparing a first laminate and a second laminate by the following step (1) or (2); and bonding a side of the electroluminescent layer of the first laminate to a side of the second electrode of the second laminate, or bonding a side of the first electrode of the first laminate to a side of the electroluminescent layer of the second laminate:04-14-2011
20110080824SHEET FOR PRODUCING A MULTILAYER OPTICAL RECORDING MEDIUM AND MULTILAYER OPTICAL RECORDING MEDIUM - A sheet for producing a multilayer optical recording medium having a repeated structure in which a plurality of optical recording layers are laminated, wherein the sheet has a structure such that a unit comprising at least a release assisting layer, an optical recording layer having a thickness of 1 to 1,000 nm and a pressure sensitive adhesive layer are disposed on a process film, the release assisting layer is disposed on the surface of the process film, and a pressure sensitive adhesive layer is disposed as the outermost layer, and an absolute value of difference between refractive indices of the release assisting layer and the pressure sensitive adhesive layer at a wavelength of 660 nm is 0.11 or smaller; and a multilayer optical recording medium obtained by using the sheet. The sheet enables to release the process film and transfer the optical recording layer while the condition of the surface of the optical recording layer is kept excellent. The multilayer optical recording medium has a great recording density and exhibits excellent property for recording.04-07-2011
20110070433Sheet and Adhesive Sheet - A sheet is produced by curing an energy ray curable composition which includes a urethane acrylate oligomer and a compound having a thiol group in the molecule. The sheet has heat resistance to prevent outgassing.03-24-2011
20110068681LUMINESCENT COMPOSITION AND INORGANIC ELECTROLUMINESCENT SHEET USING THE SAME - The present invention provides a luminescent composition which is capable of providing an inorganic electroluminescent sheet with a high productivity at low costs in an efficient manner, and has a desired light transmittance (transparency) when no electric voltage is applied thereto, an inorganic electroluminescent sheet obtained from the luminescent composition which can be mass-produced, and a process for producing the inorganic electroluminescent sheet. The present invention relates to a luminescent composition including an inorganic electroluminescent substance and a binder resin, wherein a content of the inorganic electroluminescent substance is not less than 0.5 part by mass and less than 100 parts by mass on the basis of 100 parts by mass of the binder resin; and an inorganic electroluminescent sheet including at least a first transparent substrate, a first transparent electrode, an inorganic electroluminescent layer, a first transparent electrode and a second transparent substrate which are successively laminated in this order, wherein the inorganic electroluminescent layer is formed from the above luminescent composition, and the inorganic electroluminescent sheet has a light transmittance of 60% or more as measured at a wavelength of 550 nm under a non-light emitting condition.03-24-2011
20110061808SHEET STICKING APPARATUS AND STICKING METHOD - A sheet sticking apparatus 03-17-2011
20110054139ADHESIVE MAINLY COMPOSED OF POLYORGANOSILOXANE COMPOUND - Disclosed is an adhesive characterized by containing a ladder polysilsesquloxane having a repeating unit represented by formula (I) in a molecule. The adhesive contains a specific ladder polysilsesquioxane, and exhibits good adhesion to metals or synthetic resins. (In the formula, A represents a single bond or a linking group; R03-03-2011
20110045290Adhesive Sheet - An adhesive sheet includes a substrate and an energy ray curable adhesive layer formed thereon The energy ray curable adhesive layer includes an acrylic adhesive polymer having a weight average molecular weight of not less than 100,000, and a polymerizable group is bonded to the acrylic adhesive polymer through a polyalkyleneoxy group. The energy ray curable adhesive sheet improves the breaking elongation and the expandability of the cured adhesives, thereby preventing the glue residue on the adherend of the sheet after release.02-24-2011
20110034659MOLDING MATERIAL COMPOSED OF POLYORGANOSILOXANE COMPOUND, SEALING MATERIAL, AND SEALED OPTICAL DEVICE - A molding material includes a polyorganosiloxane compound having a ladder structure including a repeating unit shown by the following formula (I) in the molecule as a main component, a sealing material includes the molding material, and a sealed optical device includes an optical device that is sealed with a cured product of the sealing material. The molding material produces a cured product that exhibits excellent transparency and heat resistance for a long time.02-10-2011
20110027514FILM FOR SCATTERING PREVENTION AND PROCESS FOR PRODUCING THE SAME - A film for scattering prevention which comprises a hard coat layer formed on one face of a substrate film (W) and a pressure sensitive adhesive layer and a release sheet successively laminated on the other face of the substrate film, wherein a plurality of independent protrusions are present on the entire surface of the hard coat layer at a constant pitch; and a process for producing the film for scattering prevention which comprises applying a material for forming a hard coat layer (C) using an applicator roll (02-03-2011
20110027325ORALLY-ADMINISTERED AGENT - An orally-administered agent according to the present invention comprises: a medicine-containing layer containing a medicine and having surfaces; collapse-controlling layers respectively provided on the surfaces of the medicine-containing layer; and gel-forming layers respectively provided on the collapse-controlling layers, wherein the gel-forming layers are swelled and gelatinized by absorbing water to form a gel. The collapse-controlling layers are constituted of a material containing a stomach-soluble material to be dissolved by being in contact with gastric juice. The orally-administered agent according to the present invention can be swallowed with ease and release the medicine in intended parts, in particular, the stomach of a living body.02-03-2011
20110014463REMOVABLE ADHESIVE SHEET - The present invention provides a removable adhesive sheet, which comprises a mixture of a hot-melt removable adhesive and a ferromagnetic material. The removable adhesive sheet of the present invention can be held to the prescribed location by means of magnetic force in initial stage of the adhesion at room temperature to an article composed of a metal or the like, and further, can move easily and position easily to a correct location, and can be peeled off easily after sticking by heating.01-20-2011
20110014462EASY-TO-STICK ADHESIVE SHEET - The easily applicable adhesive sheet of the invention is characterized by having a base sheet, and an adhesive layer which is provided on the base sheet and which has, in a surface portion thereof, a plurality of air passages having grooves opening on an end edge portion of the base sheet, wherein each air passage includes therein numerous island-like protrusions whose tops are flush with the surface of the adhesive layer, and the island-like protrusions are arranged such that such that any circle inscribed in the grooves defined by side walls of the air passage and those of the protrusions has a diameter of 5 to 90 μm at the level of the surface of the adhesive layer. The invention provides an easily applicable adhesive sheet which is smoothly applied to an adherend without formation of “blisters,” and which exhibits excellent appearance after application thereof to the adherend.01-20-2011
20110014411PRESSURE-SENSITIVE ADHESIVE SHEET AND PRESSURE-SENSITIVE ADHESIVE SHEET WITH RELEASE SHEET USING THE SAME - The present invention disclose a pressure-sensitive adhesive sheet having the adhesive layer on at least one surface of the substrate, characterized in that in particular the above adhesive layer has a number of trunk-like grooves which lead to the end of the above sheet, and a number of branch-like grooves with closed terminals which branch from the trunk-like grooves. This structure provides effects in that it can be applied easily and smoothly without retaining air when adhering to an adherend and additionally the appearance of the pressure-sensitive adhesive sheet is not damaged after adhering.01-20-2011
20100328162ANTENNA CIRCUIT - The present invention provides an antenna circuit which comprises a substrate, a planar circuit consisting of a circuit line of a conductive material formed on a surface of the substrate, and at least one notch-forming part connected with the circuit line of the planar circuit, wherein cutting lines are provided in the substrate around an outer periphery of the notch-forming part, each of the cutting lines on both sides of the circuit line connected with the notch-forming part are extended in the direction of the inside of the notch-forming part from the outside of the notch-forming part, up to the substrate and the notch-forming part, and the cutting lines are approached each other in the notch-forming part to form a notch part. The antenna circuit can be destroyed even if an IC tag comprising the antenna circuit is peeled off from various direction, and the destruction rate of the circuit can be increased stably.12-30-2010
20100317173Dicing Tape and Process for Manufacturing a Semiconductor Device - A process for manufacturing a semiconductor device through an inlined operation includes the step of attaching a dicing tape to the ground surface immediately after the completion of the grinding of the reverse side. The dicing tape includes a base material and, undetachably laminated thereon, an adhesive layer that includes an adhesive component and an epoxy group-containing compound being free but that does not contain any hardener for epoxy resins.12-16-2010
20100314894Fixed Jig, Chip Pickup Method and Chip Pickup Apparatus - It is an object to provide a fixing jig which can unmovably suction a chip group produced by segmenting a semiconductor wafer into pieces, and can suction one chip by detaching the chip selectively and reliably from the chip group. A fixing jig 12-16-2010
20100311226Die-Sorting Sheet and Method for Transporting Chips Having Adhesive Layer - A die-sorting sheet includes a pressure-sensitive adhesive layer exposed on an outer periphery of the carrier sheet, and a base film exposed on a central area that is inside the outer periphery. A method for transporting a chip having an adhesive layer according to the present invention includes the steps of: providing the above die-sorting sheet that is fixed with a frame through the pressure-sensitive adhesive layer on the outer periphery; temporarily attaching a picked up chip through an adhesive layer thereof onto the base film exposed on the die-sorting sheet; and transporting the die-sorting sheet to a subsequent step while the chip is temporarily attached on the sheet through the adhesive layer.12-09-2010
20100310808RELEASE SHEET AND PRESSURE-SENSITIVE ADHESIVE ARTICLE - An electrostatic charge on a release sheet is prevented, and thus workability during paying out of a release sheet from a roll is improved.12-09-2010
20100289283Chip Pickup Method and Chip Pickup Apparatus - A method is provided for picking up a chip 11-18-2010
20100278899EDIBLE FILM - An edible film to be ingested from an oral cavity of a living body to a body thereof is provided. The edible film is comprised of a laminated body consisting of a plurality of layers. The laminated body has surfaces and the plurality of layers include two surface layers forming of the surfaces of the laminated body. At least one of the two surface layers is disposed as an antiadhesive layer for preventing the edible film from adhering to an inside wall of the oral cavity by dissolving with water. This edible film is a film that it is difficult to adhere to the inside wall of the oral cavity, and even if it adheres to the inside wall, it is possible to easily peel off the edible film therefrom.11-04-2010
20100276074Method for Sticking Tape - Tapes are attached to a long support film, and the support film is attached to a frame member at positions where the tape to be stuck to an adherent, such as a semiconductor wafer, is included in a frame of a frame member. The support film is pressed to stick the tape to the adherend, and the support film is released from the tape. The support film is transferred and the above operations are repeated to stick the tapes to the respective adherends. In this manner, the tension to the tape is diffused to the support film, and the frame member causes the tension of the support film to reside outside of the frame. Accordingly, the tape stuck to the adherend has reduced residual stress and the adherend such as a thin semiconductor wafer to which the tape has been stuck is free from warpage which would otherwise be caused by a tape applied under tension.11-04-2010
20100255240RELEASE SHEET AND PRESSURE-SENSITIVE ADHESIVE ARTICLE - Providing a non-silicone release sheet that has a good release property and in which blocking does not occur even after long periods of storage in a wound roll-like shape.10-07-2010
20100255066ORALLY-ADMINISTERED AGENT - An orally-administered agent comprised of a laminated body having surface layers is provided. The laminated body comprises a medicine-containing layer containing a medicine and having surfaces; and at least one gel-forming layer provided on one of the surfaces of the medicine-containing layer as one of the surface layers of the laminated body. The at least one gel-forming layer includes a gel-forming agent to be swelled and gelatinized when absorbing a water-based liquid. A water absorption speed per 1 g of the gel-forming layer with respect to water of 37° C. is 0.5 g/(g·s) or higher. A gel fraction of the gel-forming layer is 20 mass % or more when the gel-forming layer is dipped into an aqueous solution of 0.9 mass % of sodium chloride having a temperature of 37° C.10-07-2010
20100252191SHEET STICKING APPARATUS AND SHEET STICKING METHOD - A sheet sticking apparatus 10-07-2010
20100236719SHEET STICKING APPARATUS AND STICKING METHOD - Wafers W are supported respectively on inner tables 09-23-2010
20100236089UV IRRADIATION APPARATUS AND UV IRRADIATION METHOD - A UV irradiating portion 09-23-2010
20100222918TRANSFER DEVICE AND TRANSFER METHOD - A conveyance device (09-02-2010
20100221476LIGHT-BLOCKING DECORATIVE SHEET - A shading decorative sheet which is excellent in a design and used for plate glasses of buildings, partitions for dividing a room and the like is provided by the present invention, and it comprises a base layer comprising a thermoplastic resin film having a haze value of 20% or more measured through a transmitted light according to JIS K7105 and formed on one surface of the base layer, a design layer comprising a decorative part having a similar color to that of the base layer and a non-decorative part.09-02-2010
20100215881DOUBLE-FACED PRESSURE-SENSITIVE ADHESIVE SHEET USED FOR ELECTRONIC COMPONENTS AND PRODUCING METHOD THEREOF - A double-faced pressure-sensitive adhesive sheet used for electronic components is provided. The double-faced pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer; a first release sheet including at least a first release agent layer attached to one surface of the pressure-sensitive adhesive layer; and a second release sheet including at least a second release agent layer attached to the other surface of the pressure-sensitive adhesive layer. The first release agent layer is mainly constituted of an olefin-based resin and the second release agent layer is mainly constituted of a diene-based polymer material. When an peeling force of the first release sheet with respect to the pressure-sensitive adhesive layer is defined as “X” [mN/20 mm] and an peeling force of the second release sheet with respect to the pressure-sensitive adhesive layer is defined as “Y” [mN/20 mm], the following relation is satisfied: Y−X≧50. The pressure-sensitive adhesive layer, the first release agent layer and the second release layer contain substantially no silicone compound and substantially no halogen compound.08-26-2010
20100209671PRESSURE SENSITIVE ADHESIVE SHEET AND PROCESS FOR PRODUCING THE SAME - A pressure sensitive adhesive sheet which comprises a substrate sheet (08-19-2010
20100208352GLARE-PROOFING AND LIGHT-TRANSMITTING HARD COAT FILM - The present invention provides a which comprises a cured resin layer (A) of a curable composition containing an active energy ray curable compound and a microparticle dispersed therein and a cured resin layer (B) of a curable composition containing an active energy ray curable compound and a microparticle dispersed therein, and the layer (A) and the layer (B) being laminated in order on at least one surface of a light-transmitting substrate film, wherein a total film thickness of the layer (A) and the layer (B) is 1 to 10 μm, a microparticle A having an average particle size of 0.5 to 10 μm is compounded in the layer (A) in an amount of 0.5 to 60 parts by mass to 100 parts by mass of an active energy ray curable compound, and a microparticle B having an average particle size which is less than an average particle size of the microparticle A is compounded in the layer (B). The glare-proofing and light-transmitting hard coat film of the present invention can have a satisfactory level of a glare-proofing property and display a black color on an image more intensely.08-19-2010
20100190293Manufacturing Method of Semiconductor Device - The present invention has been achieved reflecting such situation, and its object is to provide a manufacturing method of a semiconductor device capable of continuously performing the mounting process which applies a so-called DBG process and a flip chip bonding method, and can contribute to simplify the manufacturing process and to improve the reliability with no void in the product. The manufacturing method of a semiconductor device according to the present invention comprises: 07-29-2010
20100189751PERCUTANEOUS ABSORPTION TYPE PATCH - A percutaneous absorption type patch adapted to be applied to a skin surface of a patient. The percutaneous absorption type patch comprises: a stratum-corneum release member constituted from a sheet-like first supporting substrate and a pressure-sensitive adhesive layer laminated on the first supporting member; a medicinal-components administration member constituted from a sheet-like second supporting substrate, a medicinal-components retention layer laminated on the second supporting substrate, and a protect layer laminated on the medicinal-components retention layer; and a sheet-like handling member interposed between the stratum-corneum release member and the medicinal-components administration member. An edge portion of the handling member is coupled to or integrated with both the first supporting substrate and the protect layer. Operations of peeling the stratum-corneum release member from the skin surface of the patient and peeling the protect layer from the medicinal-components retention layer are carried out at a time by pulling the handling member toward an operating direction.07-29-2010
20100189533METHOD OF TRANSPORTING WORK AND APPARATUS WITH WORK HANDOVER MECHANISM - When both surfaces of a wafer are sequentially subjected to processing, the wafer is made to be surely supported so that a predetermined processing and transporting can be performed. On one surface of the wafer a first fixing jig (07-29-2010
20100178469GLARE-PROOFING AND LIGHT-TRANSMITTING HARD COAT FILM - The present invention provides a glare-proofing and light-transmitting hard coat film, which comprises a cured resin layer (A) of a curable composition containing an active energy ray curable compound and a microparticle dispersed therein and a cured resin layer (B) of a curable composition containing an active energy ray curable compound and a microparticle dispersed therein, and the layer (A) and the layer (B) being laminated in order on at least one surface of a light-transmitting substrate film, wherein a center line average roughness (Ra(B)) of a surface of the layer (B) after the layer (B) is laminated, is smaller by 1 μm or more than a center line average roughness (Ra(A)) of a surface of the layer (A) before the layer (B) is laminated, and a haze value (Hz(B)) of a film after the layer (B) is laminated, is smaller by 1.5% or more than a haze value (Hz(A)) of a film after only the layer (A) is laminated and before the layer (B) is laminated. The glare-proofing and light-transmitting hard coat film of the present invention can have a satisfactory level of a glare-proofing property and display a black color on an image more intensely.07-15-2010
20100164155FIXING JIG AND METHOD OF PROCESSING WORK - A fixing jig is made up of a plate-like jig main body (07-01-2010
20100160562RELEASE AGENT AND RELEASE SHEET - According to the present invention, there is provided a release agent and a release sheet. The release sheet is composed of a base member and a release agent layer including the release agent. The release agent layer is provided on at least one surface of the base member. The release agent contains a poly(meth)acrylate that includes a mono or polyalkylene glycol (meth)acrylate unit having an alkyl or aryl end group (unit (A)), and an alkyl (meth)acrylate unit (unit (B)). The carbon number of the alkyl group in the unit (B) is from 1 to 30.06-24-2010
20100151141PROCESS FILM FOR USE IN PRODUCING CERAMIC GREEN SHEET AND METHOD FOR PRODUCTION THEREOF - There can be provided a casting film for producing a ceramic green sheet which film comprises a substrarte film, an undercoat layer and a cured layer, wherein the undercoat layer is composed of a condensation polymer from a metal alkoxide and/or a partially hydrolyzed product of a metal alkoxide, and the cured layer is formed by heat treating at 40 to 120° C., an addition reaction type silicone resin composition containing a photosensitizer in a coating amount of 0.01 to 0.3 g/m06-17-2010
20100150988FILM-LIKE ORALLY ADMINISTERED MEDICATION AND MANUFACTURING METHOD THEREFOR - Film-like orally administered medications are provided which are less likely to be attached to the oral mucous membrane upon intake and can be easily detached therefrom even if attached thereto. A film-like orally administered medication (06-17-2010
20100144120Method for Producing Chip with Adhesive Applied - A method for producing a chip (06-10-2010
20100143638SHEET MATERIAL FOR MULTILAYER OPTICAL RECORDING MEDIUM, MULTILAYER STRUCTURAL BODY FOR OPTICAL RECORDING MEDIUM, AND MULTILAYER OPTICAL RECORDING MEDIUM - A sheet material for a multilayer optical recording medium (06-10-2010
20100133703Semiconductor Chip Laminate and Adhesive Composition for Semiconductor Chip Lamination - A semiconductor chip laminate comprises a plurality of semiconductor chips and an adhesive layer through which the plurality of semiconductor chips are laminated, wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A); an epoxy resin (B); a thermal curing agent (C); and a certain organic phosphine compound (D) as a thermal curing accelerator, and the content of the organic phosphine compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight.06-03-2010
20100112262RELEASE SHEET AND PRESSURE-SENSITIVE ADHESIVE - A release sheet is provided. The release sheet comprises: a base material having one surface and the other surface; and a release agent layer provided on the one surface of the base material. The release agent layer contains substantially no silicone compound and is constituted of a polymer material containing a polyolefine-based thermoplastic elastomer of which density is in the range of 0.80 to 0.90 g/cm05-06-2010
20100112015Orally administered agent and an orally administered agent/supporting substrate complex - With an object of providing an orally administered agent (in particular a film-shaped orally administered agent) with which the ease and safety of taking the agent are improved, to attain this object, in an orally administered agent 05-06-2010
20100101629Light Transmissible Solar Cell Module, Process for Manufacturing Same, and Solar Cell Panel Thereof - A light transmissible solar cell module including: solar cell units, which include a transparent substrate, a minor electrode layer provided on a part of a surface of the transparent substrate, and a solar cell section provided on the minor electrode layer, arranged in multi-levels; a first connecting wire electrically connected to an electrode provided on a surface side of the solar cell section; and a second connecting wire electrically connected to the mirror electrode layer, wherein the solar cell units are arranged so that a light entering from one side hits the solar cell section of an arbitrary solar cell unit and is reflected, and the reflected light reaches another side by being reflected by the minor electrode layer of a solar cell unit arranged adjacent to the arbitrary solar cell unit.04-29-2010
20100096090STICKING APPARATUS - A sticking apparatus includes a sticking table 04-22-2010
20100092772PRESSURE-SENSITIVE ADHESIVE SHEET - The pressure sensitive adhesive sheet of the present invention is characterized by a pressure sensitive adhesive sheet in which a pressure sensitive adhesive layer is formed on at least one surface of a base material and in which a surface of the above pressure sensitive adhesive layer at a side opposite to the base material is brought into contact with a release agent layer, wherein the pressure sensitive adhesive layer and the release agent layer do not substantially contain a silicone-based compound, and the pressure sensitive adhesive layer contains an antioxidant. It has a good releasing performance from the release agent layer and is excellent in a releasing stability after ageing.04-15-2010
20100092730PRESSURE-SENSITIVE ADHESIVE SHEET AND PROCESS FOR PRODUCING THE SAME - An adhesive sheet which can be produced without using a release sheet having an uneven surface form and which can prevent or remove air bubbles and blisters and a process for producing the same are provided by an adhesive sheet prepared by laminating a non-permeable adhesive layer in which both surfaces are flat on an uneven surface of a base material having concave and convex parts in which adjacent concave parts are communicated with each other at least on one surface so that the adhesive layer is brought into contact with the convex part of the base material and a process comprising laminating a release sheet provided on a release treated surface with a non-permeable adhesive layer in which both surfaces are flat and a base material having concave and convex parts in which adjacent concave parts are communicated with each other at least on one surface so that the non-permeable adhesive layer is brought into contact with the convex part of the base material.04-15-2010
20100090323COMPOSITE TYPE SEMICONDUCTOR DEVICE SPACER SHEET, SEMICONDUCTOR PACKAGE USING THE SAME, COMPOSITE TYPE SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND COMPOSITE TYPE SEMICONDUCTOR DEVICE - The present invention provides a spacer sheet for a complex type semiconductor device provided between the semiconductor packages of a complex type semiconductor device formed by laminating plural semiconductor packages, comprising through holes of an array corresponding to electrodes which can be provided onto a substrate of one semiconductor package and which are formed in order to connect and wire one semiconductor package with the other semiconductor package and a space part corresponding to a principal part of the above one semiconductor package mounted on the substrate or a principal part of the other semiconductor package opposed to the substrate and a production process for a complex type semiconductor device in which the above spacer sheet is used. It further provides a wiring and connecting method by using a spacer sheet which satisfies securing of a distance between connection terminals and a narrow pitch at the same time in a POP type semiconductor package and a complex type semiconductor device of a POP type which is increased in a packaging density by the above wiring and connecting method.04-15-2010
20100089216SHEET CUTTING DEVICE AND CUTTING METHOD - A cutting device 04-15-2010
20100062204PRESSURE-SENSITIVE ADHESIVE FILM FOR ADHERING TO WHEEL - The present invention provides a pressure-sensitive adhesive film for adhering on a wheel which comprises a substrate film and a pressure-sensitive adhesive layer formed on one surface of the substrate film, and has a ring adhesive strength of 80 N or greater at one hour after the adhering, wherein the ring adhesive strength at one hour after the adhering indicates the exhibited maximum load as determined in a manner, which comprises adhering the pressure-sensitive adhesive film being circular with a diameter of 100 mm by means of the pressure-sensitive adhesive layer on a ring shaped coated aluminum frame of 100 mm outer diameter, 90 nm inner diameter and 5 mm width in an atmosphere of 23° C. and 50% RH, and pressing by means of a 2 kg roll, and next, making a hole of 2 mm diameter in the center of the circular pressure sensitive adhesive film, and then, inserting a shaft of a circular flat plate with shaft having a shaft of 2 mm diameter perpendicular erected on the center of a circular flat plate of 80 mm diameter into the hole, subsequently adhering the circular pressure sensitive adhesive film to the surface of the circular flat plate, and allowing to stand still in an atmosphere of 23° C. and 50% RH for one hour, and horizontally fixing the ring shaped coated aluminum frame with the adhered circular pressure sensitive adhesive film placed upside, and then lifting the shaft of the circular flat plate with shaft having the circular pressure sensitive adhesive film adhered thereto in the direction of the shaft at a shaft lifting rate of 300 mm/min.03-11-2010
20100044887METHOD FOR PRODUCING CIRCUIT SUBSTRATE, AND CIRCUIT SUBSTRATE - The method for producing a circuit substrate of the present invention is characterized in that the circuit substrate is produced using as sheet a circuit substrate sheet including an uncured layer a part of which, the part being other than a part at which a circuit chip is disposed, is selectively curable before or after disposal of said circuit chip, wherein the uncured layer has a softness that enables embedding of the circuit chip in the circuit substrate sheet upon pressing the circuit chip that has been disposed on a surface of the uncured layer. According to the method for producing the circuit substrate of the present invention, the circuit chip can be embedded inwards with high accuracy, and the circuit substrate can be produced easily with high accuracy.02-25-2010
20100025837COMPOSITE SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND SPACER SHEET USED IN THE SAME, AND METHOD FOR MANUFACTURING COMPOSITE SEMICONDUCTOR DEVICE - The present invention relates to a complex type semiconductor device formed by laminating plural semiconductor packages, wherein it comprises: 02-04-2010
20100021669RELEASE SHEET AND PRESSURE-SENSITIVE ADHESIVE ARTICLE - Disclosed herein is a release sheet including: a base material; and a release agent layer provided on the base material, wherein the release agent layer is formed by curing a material mainly constituted of a diene-based polymer and contains substantially no silicone compound, and wherein Mooney viscosity (ML01-28-2010
20100012276DOUBLE-SIDED PRINTING LABEL PRINTER - A first printing device 01-21-2010
20100006232LABEL PRINTER - There is provided a label printer 01-14-2010
20090302238Apparatus and Method for Irradiating Energy Beam - [Problem] To provide an energy beam irradiating apparatus and energy beam irradiating method that are preferable to enhance the processing performance of the equipment, reduce a gas consumption amount and reduce an equipment installation space are provided.12-10-2009
20090291300ADHESIVE SHEET - An adhesive sheet comprising a substrate and an adhesive layer formed on at least one side of the substrate, characterized in that an adhesive agent contained in the adhesive layer comprises an acrylic ester copolymer and a citrate plasticizer; the acrylic ester copolymer has a glass transition temperature of −45° C. or less; the citrate plasticizer is contained in an amount of 1.0 to 50.0 parts by mass (solid content), with respect to 100 parts by mass (solid content) of the acrylic ester copolymer; and a rate of a gel content in the adhesive agent in the adhesive layer is 70% or more, is disclosed.11-26-2009
20090291248Coating composition, coating film, method of manufacturing coating film, and optical recording medium - A coating composition containing a solvent and a coating agent having an ionizing radiation-curable compound as a principal component thereof, wherein under the following condition for the concentration a (wt %) of the coating agent in the coating composition11-26-2009
20090269537ADHESIVE SHEET AND DELIVERY SLIP - One surface of a base sheet BS is provided with a delivery information display portion BS10-29-2009
20090266217SHEET CUTTING DEVICE AND CUTTING METHOD - There is provided a method of cutting a sheet S stuck on a semiconductor wafer W having a notch N in an outer circumferential portion in accordance with a plane shape of the semiconductor wafer W. The cutting operation is carried out by using a sheet cutting device 10-29-2009
20090261084Laser Dicing Sheet and Manufacturing Method For Chip Body - An object of the present invention is to provide a laser dicing sheet which is capable of preventing cutting of dicing sheet by laser beam, damage of the chuck table and fusion of the dicing sheet to the chuck table.10-22-2009
20090258225DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET AND PRODUCTION METHOD THEREOF - Provided are a double-sided pressure-sensitive adhesive sheet which is free from an adverse affect on an electronic part or the like and is excellent in releasing performance and a production method thereof. The double-sided pressure-sensitive adhesive sheet includes: a pressure-sensitive adhesive layer; a first release sheet having a first release agent layer adhered to one surface of the pressure-sensitive adhesive layer; and a second release sheet having a second release agent layer adhered to another surface of the pressure-sensitive adhesive layer, in which: the first release agent layer and the second release agent layer are each formed by using a diene-based polymeric compound; when, at ordinary temperatures, a release force of the first release sheet to the pressure-sensitive adhesive layer is represented by X and a release force of the second release sheet to the pressure-sensitive adhesive layer is represented by Y, a relationship of Y−X≧50 is satisfied and Y represents 2,000 or less, where units of X and Y are each mN/20 mm; and the pressure-sensitive adhesive layer, the first release agent layer, and the second release agent layer are each substantially free of a silicone compound, and the production method for the double-sided pressure-sensitive adhesive sheet includes: forming a coating film by coating a top of the second release sheet with a material for forming the pressure-sensitive adhesive layer, the material containing a pressure-sensitive adhesive; forming the pressure-sensitive adhesive layer by drying the coating film; and adhering the first release sheet to a surface of an opposite side of the formed pressure-sensitive adhesive layer to which the second release sheet is adhered.10-15-2009
20090250391MODIFIED POLYVINYLIDENE FLUORIDE MEMBRANE, LAMINATED MEMBRANE FOR PROTEIN ADSORPTION, AND MANUFACTURING METHODS THEREOF - A modified substrate for a protein chip wherein a protein adsorptive membrane and a protein non-adsorptive membrane are arranged on the same flat surface is provided as a substrate.10-08-2009
20090246915Adhesive Composition, Adhesive Sheet and Production Method of Semiconductor Device - The object of the present invention is to provide an adhesive composition that enables to produce conforming products with a high manufacturing yield and without breaking or chipping of the chips in the picking-up step and that enables to stably connect a wire without contaminating a wire pad part disposed at the circumference of a bonding surface during a wire bonding step that is performed after die bonding, even in the case of chips being reduced in a thickness.10-01-2009
20090246913Adhesive Composition, Adhesive Sheet and Production Method of Semiconductor Device - The object of the present invention is to provide an adhesive composition that enables to produce conforming products with a high manufacturing yield and without breaking or chipping of the chips in the picking-up step and that enables to stably connect a wire without contaminating a wire pad part disposed at the circumference of a bonding surface during a wire bonding step that is performed after die bonding, even in the case of chips being reduced in a thickness.10-01-2009
20090246516PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR PLASMA DISPLAY AND ADHESIVE SHEET PREPARED BY FORMING THE SAME - Provided is a pressure-sensitive adhesive composition for a plasma display in which a moire phenomenon can be prevented without disposing an anti-glare film and the like in order to decrease a thickness of an optical filter in a plasma display, improve a productivity of the optical filter and reduce a cost thereof and an adhesive sheet prepared by forming the same.10-01-2009
20090246509OPTICAL LAMINATE FOR PLASMA DISPLAY - Provided is an optical laminate for a plasma display in which a moire phenomenon can be prevented without disposing an anti-glare film and the like in order to decrease a thickness of an optical filter in a plasma display, improve a productivity of the optical filter and reduce a cost thereof.10-01-2009
20090229735SHEET STICKING APPARATUS AND STICKING METHOD - A sheet sticking apparatus 09-17-2009
20090220783Adhesive Sheet for Dicing and Die Bonding - An adhesive sheet for dicing and die bonding includes a base material and an adhesive layer releasably laminated on said base material, wherein said adhesive layer has a pressure sensitive adhering property at room temperature and a thermosetting property, the elastic modulus of the adhesive layer before thermosetting is 1.0×1009-03-2009
20090209718RESIN COMPOSITIONS, FILMS USING THE SAME AND PROCESS FOR PRODUCING THE FILMS - The present invention provides a resin composition containing a reactive monomer and/or oligomer having allyl ester groups, a film of the resin composition which is excellent in transparency and heat resistance and has a high thickness precision, and a process for producing such a film. The resin composition includes (A) a reactive oligomer having allyl ester groups and represented by the general formula (1):08-20-2009
20090208688Laminate Sheet, Laminate Sheet Roll, and Methods of Producing the Same - A laminate is produced in which a long release sheet 08-20-2009
20090170284Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device - The object of the present invention is to provide an adhesive composition which can form a thinner adhesive layer, which has good storage stability and which can actualize high package reliability even when exposed to severe reflow conditions in a semiconductor package in which a semiconductor chip being reduced in a thickness is mounted, and an adhesive sheet having an adhesive layer comprising the adhesive composition.07-02-2009
20090165958TAPE STICKING APPARATUS AND STICKING METHOD - A raw sheet L, in which a strip-shaped tape base material TB having a die bonding sheet portion DS with a size of substantially corresponding to the shape of a semiconductor wafer W is temporarily stuck to a strip-shaped release liner S, is fed out, and a cut-line detecting device 07-02-2009
20090151875SHEET CUTTING TABLE - A sheet cutting table 06-18-2009
20090146786MEASURING DEVICE - [Problem to be Solved] To provide a measuring device preferable to enhance capability of pickup processing when picking up each chip of a plate-shaped member individually separated into a form of chips.06-11-2009
20090136749(METH)ACRYLIC EMULSION TYPE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET - The present invention relates to a (meth)acrylic emulsion type adhesive composition comprising an emulsion type (meth)acrylic polymer obtained by emulsion-polymerizing a monomer comprising a (meth)acrylic monomer as a principal component, wherein a sodium salt and/or potassium salt-containing emulsifier is used in the emulsion-polymerization described above, and neutralization treatment is carried out by using a neutralizing agent containing sodium hydroxide and/or potassium hydroxide after the emulsion polymerization is finished and an adhesive sheet obtained by using the above composition, and the present invention provides an adhesive composition which is not yellowed with the passage of time, particularly by heating and an adhesive sheet obtained by using the above composition.05-28-2009
20090136711Pressure Sensitive Adhesive Sheet - A pressure sensitive adhesive sheet 05-28-2009
20090126542SHEET CUTTING DEVICE AND CUTTING METHOD - A cutting device 05-21-2009
20090124953Adhesive skin patch sheet - A adhesive skin patch sheet comprises a support, a pressure-sensitive adhesive layer and a release sheet laminated in that order, the release sheet is divided by a cut line into a small first release sheet and a large second release sheet, the cut line is formed so as to be convex only from the second release sheet toward the first release sheet.05-14-2009
20090123746ADHESIVE SHEET - An adhesive sheet includes a substrate and an energy-ray-curable adhesive layer formed on the substrate. The energy-ray-curable adhesive layer includes an energy-ray-curable acrylic copolymer and an energy-ray-curable urethane acrylate. The energy-ray-curable acrylic copolymer includes a side chain with an unsaturated group. The energy-ray-curable urethane acrylate includes an isocyanate unit, a polyol unit, and a (meth)acryloyl group. The polyol unit includes a plurality of types of polyols.05-14-2009
20090121363Process for Producing Circuit Substrate and Circuit Substrate Obtained in Accordance With the Process - A process for producing a circuit substrate having a resin sheet having embedded circuit chips which is obtained by embedding circuit chips into a resin sheet, which comprises steps of (a) arranging and fixing circuit chips on a substrate for processing, (b) coating the substrate for processing on which the circuit chips have been arranged and fixed with a liquid material for forming a resin sheet of an energy curing type to form an uncured coating layer, (c) curing the uncured coating layer by impressing energy to form a layer of a resin sheet having embedded circuit chips, and (d) removing the substrate for processing from the layer of a resin sheet having embedded circuit chips, and a circuit substrate obtained in accordance with the process. A circuit substrate having a resin sheet having embedded circuit chips for controlling pixels of displays and the like can be produced efficiently with excellent quality and excellent productivity.05-14-2009
20090120587SHEET STICKING TABLE - A sheet sticking table 05-14-2009
20090118434PRESSURE SENSITIVE ADHESIVE COMPOSITION FOR POLARIZATION FILM - There is disclosed pressure sensitive adhesive composition for polarization films use in the case of pasting the polarization films by means of crossed Nicols at ∠0 and 90 degrees to the front and rear sides of a liquid crystal cell which composition comprises an acrylic copolymer (A) of a(meth) acrylic ester and a monomer having a cross-linkable functional group in the molecule each as a monomer component and a cross-linking agent (B), wherein the storage elasticity of the composition after cross-linking at 0 to 50° C. is in the range of 1005-07-2009
20090117361Masking Tape - A masking tape 05-07-2009
20090117306RELEASE SHEET AND PRODUCTION PROCESS FOR THE SAME - Provided is a release sheet which is a non-silicone based and has a good releasability from a pressure sensitive adhesive layer and which makes it possible to form a release agent layer at low temperature and has a solvent resistance.05-07-2009
20090110863INFORMATION SHEET - An information sheet 04-30-2009
20090107633Apparatus and Method for Transferring, Apparatus and Method for Peeling, and Apparatus and Method for Laminating - An apparatus and method for peeling, and an apparatus and method for laminating which are preferable to reduce the overall size of the apparatus are provided. When a transport means 04-30-2009
20090096706IC Tag - According to the present invention, there is disclosed an antenna circuit characterized by comprising: 04-16-2009
20090095426TAPE STICKING APPARATUS, MOUNTING APPARATUS AND MOUNTING METHOD - A raw sheet L, in which a strip-shaped tape base material TB having a die bonding sheet portion DS with a size of substantially corresponding to the shape of a semiconductor wafer W is temporarily stuck to a strip-shaped release liner S, is fed out, and the position of the die bonding sheet portion DS is identified on the pathway of feeding out. Based on the identified result, a die cutting device 04-16-2009
20090085345DELIVERY SLIP - A delivery slip 04-02-2009
20090084503SHEET STICKING APPARATUS - A first sheet S04-02-2009
20090081852HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE - A backgrinding machine 03-26-2009
20090075429Sheet-Like Underfill Material and Semiconductor Device Manufacturing Method - A sheet-like underfill material includes a base and adhesive layer provided peelably on the base for use in a flip chip mounting process in the manufacture of a semiconductor device. The process includes laminating a sheet-like underfill material onto a circuit face of a semiconductor wafer having bumps on its circuit face and, simultaneously, allowing the bumps to pierce the adhesive layer and allowing the tops of the bumps to penetrate the base. The base has a storage elastic modulus of 1.0×1003-19-2009
20090068457PROTECTION SHEET FOR COATING FILM - Provided is a protective sheet for a coating layer comprising a substrate sheet and provided thereon a pressure-sensitive adhesive layer, which can be applied as well to a coated surface insufficiently cured immediately after dried, and the pressure-sensitive adhesive layer described above comprises an addition reaction type silicone-based pressure-sensitive adhesive.03-12-2009
20090065126SHEET STICKING APPARATUS AND STICKING METHOD - A sheet sticking apparatus 03-12-2009
20090061139ADHESIVE SHEET - An adhesive sheet S includes a first sheet S03-05-2009
20090053518Sheet for Forming a Protective Film for Chips - Described is a sheet for forming a protective film, which can be used suitably in a process where marking is made on the protective film formed on work such as a wafer and the like. The sheet includes a release sheet and a protective film forming layer provided on the release surface of the release sheet, wherein the protective film forming layer includes 100 parts by weight of an epoxy resin, 50 to 200 parts by weight of a binder polymer, and 100 to 2,000 parts by weight of fillers, 30% by weight or more of total 100% by weight of the said epoxy resin being selected from epoxy resins represented by the following formulae (I) and (II);02-26-2009
20090053467Pressure-Sensitive Adhesive Sheet - In a pressure-sensitive adhesive sheet 02-26-2009
20090053450LABEL LAMINATE - A label laminate includes a label L02-26-2009
20090053446ADHESIVE SHEET - An adhesive sheet S applicable to a delivery slip and the like includes a first sheet S02-26-2009
20090047458Image Receiving Sheet for Electrostatically Charged Liquid Development and Image Receiving Label for Electrostatically Charged Liquid Development - An object of the invention is to provide an image receiving sheet for electrostatically charged liquid development and an image receiving label for electrostatically charged liquid development having an image receiving layer excellent in adherence to liquid toner for electrostatic charge development and also in adherence to the substrate. As a means for solving it, the image receiving sheet for electrostatically charged liquid development of the invention is characterized by having an image receiving layer formed by applying a coating liquid containing an ethylene/methacrylic acid resin to at least one surface of a substrate followed by drying it.02-19-2009
20090036626PROTECTIVE SHEET FOR COATING FILM - Provided is a protective sheet for a coating layer comprising a substrate sheet having a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer is obtained by cross-linking of a layer through irradiating with an active energy beam, and the layer comprises a composition containing a component (A) an acrylic-based homopolymer or copolymer containing at least one selected from butyl(meth)acrylate, 2-ethylhexyl(meth)acrylate and isooctyl(meth)acrylate as a monomer component and containing no active hydrogens and a component (B) a multifunctional (meth)acrylate monomer or oligomer.02-05-2009
20090029161Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheet - The present inventions are a pressure-sensitive adhesive composition comprising a poly(meth)acrylate compound that contains a repeating unit shown by the following formula (1) in its molecule and has a melting point of 50° C. or less; a pressure-sensitive adhesive layer comprising a crosslinked product of the pressure-sensitive adhesive composition; and a pressure-sensitive adhesive sheet comprising the pressure-sensitive adhesive layer and a support, the pressure-sensitive adhesive layer being provided on one side or both sides of the support material.01-29-2009
20090028622LABEL PRINTER - The printer includes a printing unit 01-29-2009
20090026676Non-Contact Type Suction Holding Apparatus - [Problem] A non-contact type suction holding apparatus capable of reliably holding a plate-shaped member without damaging its surface by suction-holding the plate-shaped member with a portion except for its peripheral portion (main portion) in a non-contact state in which it is floated off the suction table is provided. [Means for Solving Problems] In a non-contact type suction holding apparatus 01-29-2009
20090022926LABEL - A label L is formed to include a first label area L01-22-2009
20090017296Pressure-Sensitive Adhesive Sheet for Automobile Marking - A pressure-sensitive adhesive sheet for automobile marking comprising a substrate 01-15-2009
20090017241Adhesive sheet - The present invention provide an adhesive sheet for attaching to a plasticized vinyl chloride resin article such as a blood bag made of a plasticized vinyl chloride resin, and having a center-line surface roughness Ra of 1.0 μm or higher, which comprises a film substrate and a heat-sensitive adhesive layer formed on a backside surface of the film substrate, wherein the heat-sensitive adhesive layer is composed of a resin containing a crystalline polyester resin as a main component. The adhesive sheet of the present invention is excellent in adhesive property when the adhesive sheet is attached to the article made of a plasticized vinyl chloride resin. The adhesive strength of the adhesive sheet of the present invention is not decreased even after an autoclave treatment or a storage at a low temperature. At the result, the adhesive sheet of the present invention does not cause lifting or peeling and is excellent in blocking resistance.01-15-2009
20090014911STAMPING APPARATUS AND STAMPING METHOD - There are provided with a first supporting unit 01-15-2009
20090014124Sheet peeling apparatus and peeling method - There is provided a sheet peeling apparatus and a peeling method using a plurality of peeling units capable of performing peeling off operation under optimum condition in accordance with the material, thickness or the like of a protective sheet. A sheet peeling apparatus 01-15-2009
20090005530Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element - A molding material which can produce cured products with long-lasting excellent transparency and heat resistance, a sealing material in which the molding material is used, and a sealed optical element are provided. The molding material comprises a polysilsesquioxane compound with a ladder structure having a repeating unit of the following formula (I) in the molecule as a major component.01-01-2009
20090004829Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device - An adhesive sheet which can actualize a high package reliability wherein there is no separation at the adhesive interface and no package cracking, in a package in which a semiconductor chip being reduced in thickness is mounted under severe reflow conditions after exposure to a hot and humid environment. The adhesive sheet includes a base material and, formed thereon, an adhesive layer having an adhesive composition including an acrylic copolymer (A) containing 20 to 95% by weight of a structural unit derived from a benzyl(meth)acrylate, an epoxy thermosetting resin (B), and a thermosetting agent (C).01-01-2009
20080305721TREATING METHOD FOR BRITTLE MEMBER - An object of the present invention is to provide a treating method for brittle member capable of stably holding the brittle member when applying predetermined treatments such as transportation and grinding back surface of a brittle member such as a semi-conductor wafer and separating the brittle member without breakage after finishing required treatment to thereby attaining high thickness accuracy of the brittle member.12-11-2008
20080279659TRANSFERRING DEVICE AND TRANSFERRING METHOD - A transferring device 11-13-2008
20080277041TRANSFERRING DEVICE AND TRANSFERRING METHOD - A transferring device 11-13-2008
20080271352Traffic Sign Apparatus - There is provided a traffic sign apparatus that can improve the luminance of a sign surface which emits light by ultraviolet irradiation, and the uniformity ratio of illuminance, so as to enhance the visibility thereof in the nighttime. The traffic sign apparatus 11-06-2008
20080260982Sheet to Form a Protective Shield for Chips - A sheet to form a protective film for chips includes a release sheet and a protective film forming layer formed on a detachable surface of the release sheet. The protective film forming layer includes a thermosetting and/or energy ray-curable component and a binder polymer component.10-23-2008
20080249271Adhesive containing ladder-type polysilsesquioxane and adhesive sheet - An adhesive containing a ladder-type polysilsesquioxane which firmly bonds metals and synthetic resins and an adhesive sheet having an adhesive layer formed by using the adhesive on at least one side of a substrate are provided. An adhesive comprises a ladder-type polysilsesquioxane having a recurring unit of the following formula (I) in the molecule,10-09-2008
20080242058Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device - The adhesive composition according to the present invention is characterized by including an acrylic polymer, an epoxy resin having an epoxy equivalent of 180 g/eq or less and a thermosetting agent.10-02-2008
20080241995Adhesive Sheet For Both Dicing And Die Bonding And Semiconductor Device Manufacturing Method Using The Adhesive Sheet - An adhesive sheet for dicing and die bonding includes a base material and an adhesive layer releasably laminated on said base material, wherein said adhesive layer has a pressure sensitive adhering property at room temperature and a thermosetting property, the elastic modulus of the adhesive layer before thermosetting is 1.0×1010-02-2008
20080236734Sheet Sticking Apparatus And Sticking Method - Wafers W are supported respectively on inner tables 10-02-2008
20080233392ADHESIVE SHEET - An adhesive sheet includes a substrate and an energy-ray curable adhesive layer formed on the substrate. The energy-ray curable adhesive layer includes an energy-ray curable acrylic copolymer and an energy-ray curable urethane acrylate. The energy-ray curable acrylic copolymer is formed by copolymerizing dialkyl(meth)acrylamide and includes a side chain with an unsaturated group. The energy-ray curable urethane acrylate includes an isocyanate block and a (meth)acryloyl group. The isocyanate block includes at least one of an isophorone diisocyanate, a trimethyl-hexamethyene diisocyanate, and a tetramethyl-xylene diisocyanate.09-25-2008
20080220253Adhesive Sheet - An adhesive sheet has a substrate and an adhesive layer laminated on one or both surfaces of the substrate, and has an anti-static performance. At least one of the adhesive layers contains an adhesive and a compound (1) represented by the following formula (1), and contains the compound (1) in an amount of from 0.1 to 100 parts by mass on the basis of 100 parts by mass of the adhesive.09-11-2008
20080203965LIGHT TRANSMISSIBLE SOLAR CELL MODULE, PROCESS FOR MANUFACTURING SAME, AND SOLAR CELL PANEL THEREOF - A light transmissible solar cell module including: solar cell units, which include a transparent substrate, a mirror electrode layer provided on a part of a surface of the transparent substrate, and a solar cell section provided on the mirror electrode layer, arranged in multi-levels; a first connecting wire electrically connected to an electrode provided on a surface side of the solar cell section; and a second connecting wire electrically connected to the mirror electrode layer, wherein the solar cell units are arranged so that a light entering from one side hits the solar cell section of an arbitrary solar cell unit and is reflected, and the reflected light reaches another side by being reflected by the mirror electrode layer of a solar cell unit arranged adjacent to the arbitrary solar cell unit.08-28-2008

Patent applications by LINTEC CORPORATION