| LINGSEN PRECISION INDUSTRIES, LTD. Patent applications |
| Patent application number | Title | Published |
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| 20110293119 | MICROELECTROMECHANICAL MICROPHONE CARRIER MODULE - An MEM microphone carrier module is composed of a substrate and a cover plate. The substrate includes a space layer, a bottom layer, a recession recessed from a top side of the space layer, and a groove formed in the recession. The bottom layer has a metallic plate defining a predetermined pattern and exposed outside a surface thereof. The bottom layer is a single-layer structure formed by the molding of the metallic plate and the insulating glue, such that the substrate is thinner to need lower production cost and take less assembly time than the prior art. | 12-01-2011 |
| 20110241039 | PRE-MOLDED SUPPORT MOUNT OF LEAD FRAME-TYPE FOR LED LIGHT MODULE - A pre-molded support mount of lead frame-type for an LED light module includes an insulative substrate and a lead frame embodied inside the insulative substrate and provided with a positive electrical contact and a negative electrical contact, which are exposed out of the insulative substrate. A plurality of LED chips can be mounted on the pre-molded support mount and electrically connected in series or in parallel through the lead frame. The pre-molded support mount has the advantage of being capable of simplifying manufacturing process and saving manufacturing costs in production of the LED light module. | 10-06-2011 |
| 20110180924 | MEMS MODULE PACKAGE - A MEMS module package includes a carrier, a lid capped on the carrier, a spacer disposed between the carrier and the lid, and a chip mounted on the spacer and electrically connected with the carrier. The spacer has a channel in communication between a chamber and a receiving hole of the lid, and the chip is received in the chamber of the lid and corresponding to the channel of the spacer. Therefore, an external signal can be transmitted from the receiving hole of the lid into the chamber of the lid through the channel of the spacer so as be received by the chip. | 07-28-2011 |
| 20110174532 | CAP FOR MEMS PACKAGE - A cap for a MEMS package includes a main body having a bottom surface, a top surface, a plurality of accommodations recessed from the bottom surface towards the top surface, and a plurality of slots recessed from the top surface towards the bottom surface in a way that the top surface is defined into a plurality of regions corresponding to the accommodations respectively. After completion of the MEMS package, the package can be cut along the slots into a plurality of MEMS package units, such that the cutting work can be done quickly and the cutting burrs can be minimized. | 07-21-2011 |
| 20100165596 | Lead frame for quad flat no-lead package - A lead frame for a quad flat no-lead package includes a plurality of units arranged in a matrix manner and each having four comers. Each of the corners extends outwards to define an attaching portion for attachment to a UV tape such that four sides of each of the units won't fly off when the sides are cut off. | 07-01-2010 |
| 20100127368 | LEAD FRAME - A lead frame includes a plurality of units arranged in a matrix manner. Each unit has an external frame defining an accommodation area, a die mount pad disposed in the accommodation area of the external frame, a plurality of leads connected with the external frame and arranged around the die mount pad, a short bar having two ends respectively electrically connected with the die mount pad and one of the leads, and a plurality of support bars each having a straight section connected with the external frame, and a continuous curved section connected with the die mount pad. By means of the continuous curved sections of the support bars, thermal deformation and/or displacement of the lead frame can be prevented. | 05-27-2010 |
| 20100096711 | MICROELECTROMECHANICAL SYSTEM MICROPHONE PACKAGE - An MEMS microphone package includes a substrate, a cover, a plurality of conductive members, and an insulative adhesive. The cover is mounted to the substrate. The conductive members are disposed between the substrate and the cover. Each of the conductive members can be a golden wire, a conductive bump, or a conductive metal. Upper ends of the conductive members are connected with the cover and the lower ends of the conductive members are connected with the substrate to enable a conductive loop. The insulative adhesive encapsulates the conductive members. In this way, the substrate, the conductive members, and the cover jointly construct a shielding against EMI. | 04-22-2010 |
| 20090286355 | FLIP-CHIP PROCESS BY PHOTO-CURING ADHESIVE - A flip-chip process includes the steps of disposing a plurality of spherical contact members on a surface of a wafer; forming a photo-curing adhesive layer on the surface of the wafer, wherein said photo-curing adhesive layer covers a part of each of the spherical contact members to expose the spherical contact members of the photo-curing adhesive layer; solidifying the photo-curing adhesive layer by exposure; cutting the wafer into a plurality of chip units; placing the chip units on a substrate to let the spherical contact members lie against contact points of the substrate; and pressurizing the chip units and then heating the spherical contact potions to enable the spherical contact members to be welded and electrically connected with the chip units and the contact points of the substrate | 11-19-2009 |
| 20090239341 | IC PACKAGING PROCESS - An IC packaging process includes the steps of preparing a substrate having a chip-receiving place formed on a front side thereof; creating a dam layer on the front side of the substrate; coating an ultraviolet adhesive layer on the dam layer; removing a part of the ultraviolet adhesive layer that corresponds to the chip-receiving place; removing a part of the dam layer that corresponds to the chip-receiving place; mounting a chip to the chip-receiving place in the open chamber and bonding wires between the substrate and the chip for electrical connection of the chip and the substrate; and mounting a cover layer on the ultraviolet adhesive layer and then heating the ultraviolet adhesive layer to adhesively fasten the cover layer on the dam layer. Accordingly, the IC packaging process effectively reduces the adhesive squeeze-out to prevent it from damage to the chip. | 09-24-2009 |
| 20090239339 | METHOD OF STACKING DIES FOR DIE STACK PACKAGE - A method of manufacturing a die stack package includes the steps of providing a wafer having a first surface and a second surface, said first surface having a plurality of cut ways thereon, the second surface being coated with adhesive of a predetermined thickness at a predetermined position thereof, removing parts of the adhesive by photo-lithography, each of the parts of the adhesive corresponds to the cut way and is wider than the cut way; cutting the wafer along the cut ways to make a plurality of dies, each of the dies having a part of the adhesive thereon; and stacking each of the dies, whose surface having the adhesive faces a lower-layer die, on the lower-layer die. Therefore, the method facilitates the stacking operation and saves the production cost. | 09-24-2009 |
| 20090236712 | IC PACKAGE HAVING REDUCED THICKNESS - An IC package having reduced thickness includes a lead frame, a chip, and a plurality of bonding wires. The lead frame includes a front side, a rear side, a plurality of pins located on the front side, and a hollow portion formed on the lead frame. The chip is larger than the rear side of the lead frame. The chip includes a plurality of electrodes and is adhered to the rear side of the lead frame. The electrodes correspond to the hollow portion. The bonding wires pass through the hollow portion to be connected with the pins and the electrodes. Accordingly, the IC package can effectively take good use of the space below the lead frame, reducing the height of the bonding wires and saving the packaging space above the lead frame, and reduce the thickness of the IC package without addition of the cost and equipment. | 09-24-2009 |
| 20090186450 | IC PACKAGING PROCESS BY PHOTO-CURING ADHESIVE - A IC packaging process includes the steps of mounting at least one retaining member on a top side of a substrate, the retaining member defining a receiving space, a chip being mounted to the substrate and located in the receiving space; forming a photo-curing adhesive layer in the receiving space, the photo-curing adhesive layer being capable of shielding the chip completely; irradiating and developing the photo-curing adhesive layer to harden a part of the photo-curing adhesive layer to define a hardened portion thereof, the other part of the photo-curing adhesive layer defining a non-hardened portion corresponding to the chip; and removing the non-hardened portion to expose an active portion of the chip. | 07-23-2009 |
| 20090178758 | METHOD OF ARRANGING STACKED CHIP BY PHOTO-CURING ADHESIVE - A method of arranging stacked chips by photo-curing adhesive includes the steps of disposing a first chip on a top side of a substrate and electrically connecting the first chip to the substrate by wire bonding; forming a photo-curing adhesive layer on a top side of the first chip; hardening the photo-curing adhesive layer by irradiation to convert it from colloid to solid for 70-80% degree of solidification; softening the photo-curing adhesive layer by heating of 50-80° C. to convert it from solid to semisolid to enable the photo-curing adhesive layer to be adherent; disposing a second chip on a top side of the photo-curing adhesive layer, then converting the photo-curing adhesive layer from semisolid to complete solid by heating of 100-150° C., and finally electrically connecting the second chip to the substrate by wire bonding. | 07-16-2009 |
| 20090020500 | METHOD OF FORMING PASSAGE THROUGH SUBSTRATE FOR MEMS MODULE - A method of forming a passage through a substrate for a MEMS module is disclosed to include the steps of: a) etching a substrate having a thickness smaller than 0.30 mm to form a bottom recess; b) etching a top side of the substrate to form a top recess to define a part of the substrate as a sacrifice portion; c) forming a bottom layer in the bottom recess of the substrate by injection molding; d) depositing a support layer in the top recess of the substrate; and e) removing the sacrifice portion from the substrate by etching to form a passage defined between the support layer and the bottom layer in the substrate with two ends in communication with ambient atmosphere. | 01-22-2009 |
| 20080251869 | PHOTOSENSITIVE CHIP PACKAGE - A photosensitive chip package includes a substrate on which a photosensitive chip having a photo-active zone and a photo-inactive zone surrounding the photo-active zone is bonded. A light-transmissive film covers the photo-active zone of the photosensitive chip. Bonding wires are electrically connected with the photosensitive chip and the substrate. An encapsulant covers the photo-inactive zone of the photosensitive chip, a border periphery of the light-transmissive film and the bonding wires. The encapsulant has an opening corresponding to the photo-active zone. By means of the light-transmissive film, the photo-active zone of the photosensitive chip is protected, thereby lowering the chance of accidental damage to the photosensitive chip by the tool used during formation of the encapsulant and/or during a cleaning work. | 10-16-2008 |
