| LIGHTHOUSE TECHNOLOGY CO., LTD Patent applications |
| Patent application number | Title | Published |
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| 20100284188 | LAMP - A lamp including a carrier and a plurality of light source modules stacked to the carrier is provided. Each light source module includes a circuit board and a plurality of light-emitting diodes, wherein the light-emitting diodes are disposed on at least one side of the circuit board and electrically connected to the circuit board. | 11-11-2010 |
| 20100133576 | CASTING FOR AN LED MODULE - A casting adapted to carry a light emitting diode die and an anti-static die is disclosed. The casting comprises two electrodes for opposite electrodes and a wall. The light emitting diode die is mounted one of electrodes and the anti-static die is mounted on the other electrode. The wall is arranged between the light emitting diode die and the anti-static die. Further, the height of the wall is larger than that of the anti-static die to shade the anti-static die, whereby reflecting the light emitted from the light emitting diode die. Therefore, the reflection ratio of the light emitting diode die is improved, and the intensity generated by the whole light emitting diode is also improved. | 06-03-2010 |
| 20100129598 | OPTICAL FILM - An optical film includes a number of phosphor layers. The phosphor layers are stacked together, and each of the phosphor layers is excited by an exciting light source and respectively emits a secondary light beam. The secondary light beams emitted by the phosphor layers are in different wavelength ranges. | 05-27-2010 |
| 20090290378 | Image Display Apparatus - An image display apparatus comprising a light guide plate, a light-emitting diode (LED), a first transparent substrate and a second transparent substrate is provided. Light generated from the LED is guided into the light guide plate through the edge thereof, and outwardly projected through the two opposite surfaces of the light guide plate. Thus, a pattern being disposed in front of the first transparent substrate or the second transparent substrate would be lighted up. | 11-26-2009 |
| 20090267104 | LIGHT-EMITTING DIODE PACKAGE - An LED package including a lead-frame, at least an LED chip and an encapsulant is provided. The lead-frame has a roughened surface, the LED chip is disposed on the lead-frame and electrically connected to the lead-frame, and the roughened surface is suitable to scatter the light emitted from the LED chip. In addition, the encapsulant encapsulates the LED chip and a part of the lead-frame, and the rest part of the lead-frame is exposed out of the encapsulant. | 10-29-2009 |
| 20090034288 | LIGHT EMITTING DIODE PACKAGE, DIRECT TYPE BACKLIGHT MODULE AND EDGE TYPE BACKLIGHT MODULE - An LED package includes a carrier, an LED chip and a light scattering material. The LED chip is disposed on the carrier, electrically connected with the carrier and adapted to emitting a light with wavelength λ | 02-05-2009 |
| 20080224096 | PHOTOLUMINESCENT MATERIAL OF LIGHT-EMITTING DIODE PACKAGE STRUCTURE - An LED package structure including a carrier, an LED chip, an encapsulant and a PL material is provided, wherein the LED chip is disposed on the carrier for emitting light. The encapsulant encapsulates the LED chip. The PL material is distributed in the encapsulant. The PL material is suitable for being excited by the light emitted from the LED chip and scattering the light. Moreover, the present invention provides a novel PL material with a molecular formula of W | 09-18-2008 |
