LHV POWER CORPORATION Patent applications |
Patent application number | Title | Published |
20100321967 | REGULATED OUTPUT CURRENT AND SLOPE CONTROL - The present invention is directed to current mode output control with a current mode (CM) region of the high voltage output curve (VI) slope controlled by component selection and arrangement in the construction of high voltage power supplies. The controlled CM current slope output, the tapped multiplier feedback network, and the subsequent output voltage correction network, yields a power supply with the desired VM and CM output characteristics that is significantly less expensive to construct and more efficient than a power supply built using conventional construction techniques. | 12-23-2010 |
20100314792 | LOW PRESSURE MOLDING ENCAPSULATION OF HIGH VOLTAGE CIRCUITRY - A process relating to a one step low pressure injection molding method of encapsulating high voltage circuitry while incorporating a unique recessed high voltage connector contact means within the injection molding material, greatly reducing the component size, while increasing the capabilities of this type of circuitry. The process reduces the manufacturing time and maintains a clean sealed contact point for repeated usage by the means of a conductive rubber slug. An additional advantage is by creating cavities through the circuit board; axially leaded high voltage components may be conveniently mounted without additional assembly components while being fully encapsulated. | 12-16-2010 |
20100302746 | HIGH VOLTAGE RECESSED CONNECTOR CONTACT - A process relating to a one step low pressure injection molding method of encapsulating high voltage circuitry while incorporating a unique recessed high voltage connector contact means within the injection molding material, greatly reducing the component size, while increasing the capabilities of this type of circuitry. The process reduces the manufacturing time and maintains a clean sealed contact point for repeated usage by the means of a conductive rubber slug. An additional advantage is by creating cavities through the circuit board; axially leaded high voltage components may be conveniently mounted without additional assembly components while being fully encapsulated. | 12-02-2010 |