LG Siltron Incorporated Patent applications |
Patent application number | Title | Published |
20160045999 | SLURRY SUPPLY DEVICE AND POLISHING APPARATUS INCLUDING THE SAME - Disclosed is a slurry supply device including a nozzle configured to eject slurry, a slurry supply unit configured to receive the slurry from the nozzle and to discharge the slurry through at least one slurry hole, a receiving unit configured to allow the slurry supply unit to be mounted, inserted, seated, coupled, supported, or placed therein so as to enable discharge of the slurry from the slurry supply unit, the receiving unit being configured to receive a flowing material around the slurry supply unit and a slurry protection unit configured to enclose a space for passage of the slurry from an exit of the nozzle to an entrance of the slurry supply unit in conjunction with the flowing material. | 02-18-2016 |
20160031062 | WAFER POLISHING APPARATUS - Disclosed is a wafer polishing apparatus including a base, a lower surface plate disposed on the upper surface of the base, an upper surface plate disposed on the lower surface plate and a first shape adjustment unit configured to deform the shape of the lower surface of the upper surface plate so that the lower surface of the upper surface plate has one of a concave shape, a flat shape and a convex shape in a first direction, and the first direction is a direction from the lower surface plate to the upper surface plate. | 02-04-2016 |
20130001846 | CASSETTE JIG FOR WAFER CLEANING APPARATUS AND CASSETTE ASSEMBLY HAVING THE SAME - A cassette jig for a wafer cleaning apparatus is provided, comprising a jig body having an inner space designed to receive a first wafer therein; and a guide member mounted in the jig body and operative to guide a cassette to be installed in the jig body, the cassette having an inner space designed to receive a second wafer of a relatively smaller diameter than the first wafer therein. | 01-03-2013 |