| 20100197078 | DICING FILM HAVING SHRINKAGE RELEASE FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME. - The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same. | 08-05-2010 |
