| Lextar Electronics Corporation Patent applications |
| Patent application number | Title | Published |
|---|
| 20120113675 | LAMP DEVICE WITH COLOR-CHANGEABLE FILTER - A lamp device includes a supporting frame, a light emitting diode (LED) array source, a light filter, two end caps and two couples of electrodes. The LED array source is disposed on the supporting frame. The light filter is arc-shaped and combined with the supporting frame as a tubular structure, wherein the arc surface of the light filter is a light emitting surface of the LED array source. The light filter is used for absorbing a ray in a specific wavelength range of the emitting light of the LED array source. The two end caps are disposed at two ends of the tubular structure respectively. The two couples of electrodes are disposed at two ends of the tubular structure and mounted on the two end caps respectively for electrically connecting to the LED array source. | 05-10-2012 |
| 20120112160 | SOLID STATE LIGHT EMITTING DEVICE AND METHOD FOR MAKING THE SAME - A method for making a solid state light emitting device includes: (a) forming a first cladding layer on a substrate; (b) forming a matrix layer above the first cladding layer, the matrix layer having a top surface and being formed with a plurality of isolated spaces; (c) epitaxially forming a quantum cluster in each of the spaces such that the top surface of the matrix layer and top surfaces of the quantum clusters cooperatively define a coplanar surface, the quantum clusters cooperating with the matrix layer to form a light emitting layer; (d) forming a second cladding layer on the light emitting layer; and (e) forming an electrode unit electrically connected to the first and second cladding layers. | 05-10-2012 |
| 20120044679 | POINT LIGHT SOURCE AND LIGHT SOURCE MODULE USING THE SAME - A point light source includes a light-emitting portion, a first lead and a second lead. The first lead and the second lead are electrically connected to the light-emitting portion. The first lead and the second lead respectively have a wedging portion. The wedging portions can be matched with each other. A light source module using the point light source is also provided. The light source module includes at least one light source assembly. Each light source assembly includes a plurality of the point light sources connected in series. Adjacent two point light sources are wedged to each other in series by a combination of the wedging portions of the adjacent first lead and second lead. | 02-23-2012 |
| 20120037952 | LIGHT EMITTING DIODE AND FABRICATING METHOD THEREOF - A light emitting diode and a fabricating method thereof are provided. A first-type semiconductor layer, a light emitting layer and a second-type semiconductor layer with a first surface are sequentially formed a substrate. Next, the first surface is treated during a surface treatment process to form a current-blocking region which extends from the first surface to the light emitting layer to a depth of 1000 angstroms. Afterward, a first electrode is formed above the current-blocking region of the second-type semiconductor layer, and a second electrode is formed to electrically contact to the first-type semiconductor layer. Since the current-blocking region is formed with a determined depth within the second-type semiconductor layer, the light extraction efficiency of the light emitting diode may be increased. | 02-16-2012 |
| 20120012886 | LIGHT EMITTING DIODE, FRAME SHAPING METHOD THEREOF AND IMPROVED FRAME STRUCTURE - A single material tape is shaped into first, second and third frames isolated from and disposed opposite each other, and a press forming process is performed to thin bottoms of first and second wire-bonding sectors extending from the first and second frames. The thickness of each of the first and second wire-bonding sectors is smaller than that of the third frame, so that the thicker third frame can be exposed out of a glue body to achieve the better dissipation effect, and at least one side surface between the two frames isolated from and disposed opposite each other is formed with a slot portion. When the frame is applied to the light emitting diode and fixed to the glue body, the slot portion can increase the bonding property between the frame and the glue body, and the structural strength therebetween can be increased. | 01-19-2012 |
| 20110210343 | SEMICONDUCTOR WAFER - A semiconductor wafer includes a substrate, a first separating structure and a semiconductor stacked layer structure. The substrate has a first surface. The first separating structure is formed on the first surface to divide the first surface into a plurality of independent regions. The minimum area of each of the regions is more than or equal to one square inch. The semiconductor stacked layer structure is disposed on the first surface and the first separating structure. The semiconductor wafer can prevent bowing of the semiconductor wafer during an epitaxial growth process so as to enhance quality of the semiconductor wafer. | 09-01-2011 |
| 20110194296 | LIGHTING APPARATUS - A lighting apparatus includes a housing, a light source disposed in the housing and at least one adjustable assembly disposed at an end of the housing. The adjustable assembly includes a connection element fixed to the end of the housing, a cap capping the connection element, at least one electrical terminal and an adjusting mechanism. A part of the connection element is located in the cap. The electrical terminal is disposed at the cap and electrically connected to the light source. The adjusting mechanism includes a gear, a positioning element, a clasp and a track. The gear and the positioning element are respectively disposed at the connection element and the cap. Positions of the gear and the positioning element can be exchanged. The clasp and the track are respectively disposed at the connection element and the cap. Positions of the clasp and the track can be exchanged. | 08-11-2011 |
| 20110156067 | LIGHT EMITTING MODULE AND ILLUMINATION DEVICE WITH THE SAME - A light emitting module includes a substrate, a conductive layer, a first light emitter, a second light emitter and a protection layer. The substrate has a first surface and a second surface on opposite sides of the substrate. The conductive layer is configured in the substrate. The first light emitter is disposed on the first surface and connected with the conductive layer. The second light emitter is disposed on the second surface and connected with the conductive layer. The protection layer covers the first light emitter and the second light emitter. | 06-30-2011 |
