LEWIS & CLARK COLLEGE Patent applications |
Patent application number | Title | Published |
20140357928 | DEGRADATION OF PHOSPHATE ESTERS BY HIGH OXIDATION STATE MOLYBDENUM COMPLEXES - Degradation of phosphate esters, particularly neurotoxins and pesticides, is performed using high oxidative state molybdenum complexes, more particularly molybdenum(VI) complexes. A molybdenum(VI) complex is dissolved in water and then reacted with a phosphate ester. The phosphate esters can include, but are not limited to, VX, VE, VG, VM, GB, GD, GA, GF, parathion, paraoxon, triazophos, oxydemeton-methyl, chlorpyrifos, fenitrothion and pirimiphos-methyl, representing both chemical warfare agents as well as pesticides and insecticides. | 12-04-2014 |
20100137672 | DEGRADATION OF PHOSPHATE ESTERS BY MOLYBDOCENE AND TUNGSTOCENE DERIVATIVES - Degradation of phosphate esters, particularly neurotoxins and pesticides, is performed using metallocene derivatives, more particularly molybdocene and tungstocene derivatives. A metallocene derivative is hydrolyzed and then reacted with a phosphate ester. The preferred metallocene derivatives are molybdocene and tungstocene derivatives. The phosphate esters can include, but are not limited to, VX, VE, VG, VM, GB, GD, GA, GF, parathion, paraoxon, triazophos, oxydemeton-methyl, chlorpyrifos, fenitrothion and pirimiphos-methyl, representing both chemical warfare agents as well as pesticides and insecticides. | 06-03-2010 |
20090146320 | FABRICATED ADHESIVE MICROSTRUCTURES FOR MAKING AN ELECTRICAL CONNECTION - An integrated circuit chip has one or more electrically conductive nano-fibers formed on one or more contact pads of the integrated circuit chip. The one or more electrically conductive nano-fibers are configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package. | 06-11-2009 |
20080308953 | FABRICATED ADHESIVE MICROSTRUCTURES FOR MAKING AN ELECTRICAL CONNECTION - An integrated circuit chip has one or more electrically conductive nano-fibers formed on one or more contact pads of the integrated circuit chip. The one or more electrically conductive nano-fibers are configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package. | 12-18-2008 |