| Leeno Industrial Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120105090 | PROBE DEVICE FOR TESTING - The present invention relates to a probe device for testing a semiconductor chip, and has the aim of providing a probe device for testing with higher test reliability through an improved structure that enables test current to flow safely, the probe device including a barrel open at the top and bottom thereof and a probe projection formed on a top end to contact a connection terminal of a semiconductor chip, an upper plunger having a lower portion housed in an upper portion of the barrel, and a lower plunger having an upper portion housed in a lower portion of the barrel, wherein a metal ball contained in cylindrical silicon to form a conductive silicon portion that exhibits conductivity and housed inside the band electrically connects the upper plunger and the lower plunger and resiliently supports the downward pressure transferred to the upper plunger during the testing of a semiconductor chip, such that the conductive silicon portion containing the metal ball for exhibiting conductivity and inserted in the barrel resiliently supports the upper plunger during a testing process, thus enabling a test current to flow safely along the conductive silicon portion and improving test reliability. | 05-03-2012 |
| 20110102008 | Socket For Testing Semiconductor Chip - A socket for testing a semiconductor chip includes a base cover, a conductive sheet, upper plungers, a housing, lower plungers and a support plate. The base cover has a coupling opening in the central portion thereof, and the conductive sheet is fitted into the coupling opening of the base cover and includes conductive parts and an insulation part. The upper plungers are seated onto upper ends of the conductive parts and come into contact with corresponding terminals of the semiconductor chip. The housing has insert holes at positions corresponding to the upper plungers and fastens the upper plungers to the corresponding conductive parts. The lower plungers are provided under lower ends of the conductive parts and come into contact with corresponding terminals of a PCB to electrically connect the conductive parts to the PCB. The support plate has holes at positions corresponding to the lower plungers and fastens the lower plungers to the lower ends of the corresponding conductive parts such that lower ends of the lower plungers protrude outside through the holes of the support plate. | 05-05-2011 |
